Oct/12/07 Su DongSiD Tracking Meeting1 Thoughts on VXD Sensor Configuration Su Dong.

Slides:



Advertisements
Similar presentations
Background studies Takashi Maruyama SLAC GDE Baseline Assessment Workshop SLAC, January 18-21, 2011.
Advertisements

Simulation Studies of a (DEPFET) Vertex Detector for SuperBelle Ariane Frey, Max-Planck-Institut für Physik München Contents: Software framework Simulation.
1 G4MICE studies of PID transverse acceptance MICE video conference Rikard Sandström.
Progress towards a Long Shaping-Time Readout for Silicon Strips Bruce Schumm SCIPP & UC Santa Cruz SLAC LCWS05 July 28-31, 2004.
GlueX Simulations Status Report on CD3 geometry Richard Jones GlueX Collaboration Meeting, Newport News, January 10-12, 2008.
1 Forward Tracking Simulation Norman A. Graf ALCPG Cornell July 15, 2003.
Striplet option of Super Belle Silicon Vertex Detector Talk at Joint Super B factory workshop, Honolulu 20 April 2005 T.Tsuboyama.
Progress towards a Long Shaping-Time Readout for Silicon Strips Bruce Schumm SCIPP & UC Santa Cruz SLAC LCWS05 July 28-31, 2004.
Oct/24/07 Su DongWWS Vertex Detector Review1 SiD Vertexing Report Su Dong On behalf of the SiD Vertexing Group.
Sergey Belogurov, ITEP, Moscow STS CAD model. GSI, STS mechanics: Conceptual CAD model development Sergey Belogurov ITEP, Moscow Engineer: Sergey.
A new idea of the vertex detector for ILC Y. Sugimoto Nov
R&D Status of FPCCD Vertex Detector Dec.1, 2006 Yasuhiro Sugimoto KEK.
Study of FPCCD Vertex Detector 12 Jul. th ACFA WS Y. Sugimoto KEK.
Fine Pixel CCD Option for the ILC Vertex Detector
Aug/16/05 Su DongSiD Vertexing: Snowmass 05 SiD trk+vtx1 SiD VXD Geometry Update Su Dong SLAC.
Muon Detector Jiawen ZHANG Introduction The Detector Choices Simulation The structure and detector design The Expected performance Schedule.
1 R&D Status and plan for FPCCD VTX Yasuhiro Sugimoto
F February 5, 2001 Pixel Detector Size and Shape David Christian Fermilab.
Super-Belle Vertexing Talk at Super B Factory Workshop Jan T. Tsuboyama (KEK) Super B factory Vertex group Please visit
Fine Pixel CCD for ILC Vertex Detector ‘08 7/31 Y. Takubo (Tohoku U.) for ILC-FPCCD vertex group ILC vertex detector Fine Pixel CCD (FPCCD) Test-sample.
PID for super Belle (design consideration) K. Inami (Nagoya-u) - Barrel (TOP counter) - Possible configuration - Geometry - Endcap (Aerogel RICH) - Photo.
CLIC_ILD vertex detector modules and stave Layout Mathieu Benoit 15/03/12 mini workshop on engineering aspects of the CLIC vertex detectors 1.
SiD R&D tasks for the LOI - Subsystem R&D tasks - Summary of SiD R&D - Prioritization of R&D tasks -> Document for DoE/NSF ~Feb 2009 (Mainly based on Marty’s.
FPCCD option Yasuhiro Sugimoto 2012/5/24 ILD 1.
Performance and occupancies in a CCD vertex detector with endcaps Toshinori Abe and John Jaros 04/21/04.
FPCCD Vertex detector 22 Dec Y. Sugimoto KEK.
Tevatron II: the world’s highest energy collider What’s new?  Data will be collected from 5 to 15 fb -1 at  s=1.96 TeV  Instantaneous luminosity will.
Silicon Detector Tracking ALCPG Workshop Cornell July 15, 2003 John Jaros.
Forward Pixel Beamtest Analysis Carsten Rott Purdue University Januar 24, 2001.
Start and Vertex Detector W. Boeglin, A.Klein Current Design: 3300 scintillating fibers 1mm diameter 3 double layers (1 axial, 2 stereo) cylindrical geometry.
1 FPCCD VTX Work Plan Y. Sugimoto 2010/1/22. 2 FPCCD: Features and R&D issues (1/2) Small pixel size (~5  m) –Sensor development Small size chip; ~6mm.
Layout Tool results In a first exercise we have reproduced something.
1 Nick Sinev, ALCPG March 2011, Eugene, Oregon Investigation into Vertex Detector Resolution N. B. Sinev University of Oregon, Eugene.
Vertex detector update 1 Oct Y. Sugimoto KEK.
Oct. 16, 1998Hobbs (thanks Hal)1 SMT Road Widths & Extra CFT Layers Current Situation Adding a 3rd CFT layer Using all 8 CFT layers Summary.
TC Straw man for ATLAS ID for SLHC This layout is a result of the discussions in the GENOA ID upgrade workshop. Aim is to evolve this to include list of.
SiD Collaboration Meeting Highlights Tom Markiewicz/SLAC ILC BDS Meeting 08 May 2007.
Andrei Nomerotski, University of Oxford ILC VD Workshop, Menaggio 22 April 2008 SiD Vertex Detector.
J. Brau LCWS 2006 March, J. Brau LCWS Bangalore March, 2006 C. Baltay, W. Emmet, H. Neal, D. Rabinowitz Yale University Jim Brau, O. Igonkina,
Review of Micromegas Tracking Detectors for CLAS12 – May 7, 2009 Reviewers: Madhu Dixit, Mac Mestayer Presentations covered the following topics: –detector.
LCWS11 – Tracking Performance at CLIC_ILD/SiD Michael Hauschild - CERN, 27-Sep-2011, page 1 Tracking Performance in CLIC_ILD and CLIC_SiD e + e –  H +
Tracking R&D at SCIPP: Charge Division Long Ladder Readout Noise Non-Prompt Tracks with SiD CERN Linear Collider Workshop October
Leonardo Rossi INFN Genova - UTOPIA #12 0 What we have learned from UTOPIA so far? Defined a set of gauge histos to compare layouts Exercised on barrel-part.
FPCCD VTX Work Plan Y. Sugimoto 2010/1/22. FPCCD: Features and R&D issues (1/2) Small pixel size (~5  m) –Sensor development Small size; ~6mm x 6mm Full.
18 Sep 2008Paul Dauncey 1 DECAL: Motivation Hence, number of charged particles is an intrinsically better measure than the energy deposited Clearest with.
Eight fully instrumented PC1 mounted on top of the Drift Chamber. Qualities * Efficiency close to 100% and good spatial resolution. Noise free operation.
6/19/06 Su DongSiD Advisory: VXD DOD Summary II1 VXD DOD Summary (II) Sensors & Other system Issues.
Eunil Won/Korea U1 A study of configuration for silicon based Intermediate Trackers (IT) July Eunil Won Korea University.
Simulation Plan Discussion What are the priorities? – Higgs Factory? – 3-6 TeV energy frontier machine? What detector variants? – Basic detector would.
Tracking: An Experimental Overview Richard Partridge Brown / SLAC Fermilab ALCPG Meeting.
Goals and requirements 1 st flexible geometry version Next geometry version development Conclusions and outlook A realistic and flexible VTX geometry in.
FP-CCD GLD VERTEX GROUP Presenting by Tadashi Nagamine Tohoku University ILC VTX Ringberg Castle, May 2006.
October 2014Silicon Pixel Tracker – Chris Damerell 1 Tracking sensor, one of 12,000, 8x8 cm 2, 2.56 Mpixels each Matching endcaps (only one layer shown)
Towards Snowmass Jul. 13, 2005 Y.Sugimoto. Charge for Detector WGs Charge for Concept Groups: work towards a baseline design define performance criteria.
Effect of L* Changes on Vertex Detector and Forward Calorimeter Performance LCWS 2015 Whistler, BC, Canada November Bruce Schumm UCSC/SCIPP 1.
IOP HEPP Conference Upgrading the CMS Tracker for SLHC Mark Pesaresi Imperial College, London.
Hybrid Pixel R&D and Interconnect Technologies
Silicon Pixel Detector for the PHENIX experiment at the BNL RHIC
C.Clerc ILD session, ALCPG /03/2010
Vertex Detector Mechanical R&D Design Questions and Issues
SiD VXD Conceptual Design
SuperB SVT Definition of sensor design and z-side connection scheme
Francesco Forti SuperB Workshop LNF, March, 2006
FPCCD Vertex Detector for ILC
Yasuhiro Sugimoto KEK 17 R&D status of FPCCD VTX Yasuhiro Sugimoto KEK 17
Vertex Detector Overview Prototypes R&D Plans Summary.
SiD Tracker Concepts M. Breidenbach
FPCCD Vertex Detector for ILC
Backgrounds using v7 Mask in 9 Si Layers at a Muon Higgs Factory
SVT detector electronics
Presentation transcript:

Oct/12/07 Su DongSiD Tracking Meeting1 Thoughts on VXD Sensor Configuration Su Dong

Oct/12/07 Su DongSiD Tracking Meeting2 Sensor Requirements As of the DOD writeup, we have defined the following requirements: 1)Spatial resolution <5  m in all dimension for track entrance angles )Two track resolution <40  m. 3)< ~0.1% X0 material per layer. 4)~30W+30W total power in barrel+endcap. Gas cooled. 5)Operable at 5T with little resolution loss. 6)<5 hits/mm 2 at Layer 1; <1 hit/mm 2 in outer layers. 7)Low noise to allow threshold for >99% hit efficiency and readout noise <30% of all hit data. 8)EMI immunity. 9)Can withstand: >20Krad/year; >10 9 /cm 2 /yr 1 MeV Neutrons.

Oct/12/07 Su DongSiD Tracking Meeting3 Comments on Sensor Requirements The 5  m resolution is very generous and one ought to be able to do better. One should still give extra credit for significantly better resolution (which may need the combination of thin EPI, low noise and perhaps not fully depleted). The power requirement is not only bound by the need for gas cooling. The necessary copper to deliver the instantaneous current is also an important factor. The hit density requirement has some uncertainties. We have not fully explored the tracking robustness at these limiting densities. Given the pivoting role of VXD in SiD tracking, capability for lower density could be important insurance to leave necessary margin to accommodate significant machine background variations.

Oct/12/07 Su DongSiD Tracking Meeting4 VXD Background Rate Variations R= N Q Y P H 500 GeV 1 TeV Layer 1 Need to be able to deal with 200 hits/mm 2 /train – reading 40 times/train to reduce down to 5 hits/mm 2 Layer 1’s problem is in its own league (current Layer 2 is at slightly lower R of 2.2cm).

Oct/12/07 Su DongSiD Tracking Meeting5 SiD Geometry and Material

Oct/12/07 Su DongSiD Tracking Meeting6 Barrel Geometry LayerLadderArea (cm 2 ) Layer 1 sensor has a narrower width Layer 1 area is 9% of barrel total

Oct/12/07 Su DongSiD Tracking Meeting7 SiD Geometry Implications No track at very shallow entrance angle. Full coverage of 5 VXD hits up to |cos  ~0.98. –Sensors has slightly thicker active region would not cause too much resolution degradation. –Less fear in barrel wafer shape issues when pushing for thin ladders with a shorter barrel. –Endcap sensors don’t care much about Lorentz effect. Need to work harder on the barrel endplate service material. –The R&D to achieve lightweight power delivery and signal communications are as important as the sensor technology and mechanical design !

Oct/12/07 Su DongSiD Tracking Meeting8 Service Material Model Due to the lack of a real design, this is unfortunately a very crude toy model in GEANT: 1)Readout/service connection at each barrel layer end is represented by a solid ring of G10 5mm wide in Z and 3mm high in radius. 2)The power and signal cables are represented by a 300  m diameter copper wire and 250  m diameter fiber at each end of a ladder. The cables all focus down to the beampipe to exit from there to be out of fiducial volume, but this causes a significant clumping of material at lower radius which may not work mechanically. The R&D which can lead to a real design that is not far off from the total material of this model will be a crucial step to validate the layout concept.

Oct/12/07 Su DongSiD Tracking Meeting9 A Different View at the Sensor Requirements So far no `ideal’ technology performs best in all categories. In particular, attempts to reduce hit density via faster readout or time stamping seemed to be invariably associated with more power. Have we dug a hole for ourselves by having the one size shoe fit all requirements ? We have seen that the problems at inner and outer barrels and the endcap are different in some important aspects. If we can tolerate the loss of elegance, is it so bad to consider the option of a mixed sensor technology ? Life may get significantly easier if the sensor only need to meet the requirement for a specific region of the detector.

Oct/12/07 Su DongSiD Tracking Meeting10 Innermost Barrel The first layer carries a huge weight in determining the ultimate impact parameter resolution and is in the most hostile environment of highest hit density. So one might desire: –Small, thin pixels with low noise to gain the ultimate spatial resolution of <3  m (or even 2?) –Time stamping or other means of tagging bunch crossings to bring the effective hit density down to <<5 hits/mm 2. –Yes it needs more power but we may afford that: The end service section is falling out of fiducial so that a bit more service material may be OK. Power lines still axial along beamline – no Lorentz force. Layer 1 is only 9% of the total barrel area. There is also a possibility of some liquid cooling around the beampipe region out of the fiducial.

Oct/12/07 Su DongSiD Tracking Meeting11 Outer Barrels Many more sensors and services will suffer Lorentz force and in fiducial region. It is therefore highly preferrable to be a low power technology. In exchange, do not have to work as hard for the readout hit density. With Layer 1 at very fine resolution, we need to revisit the spatial resolution requirement for outer layers. Larger pixels may not be OK ? Still cares about Lorentz angle. If service light enough, routing them radially outwards outside the endcap may not be paying too much penalty on material ? This will reduce clutter around beampipe and reduce multiple scattering problem at low angles.

Oct/12/07 Su DongSiD Tracking Meeting12 Endcap The access to power is in less critical fiducial regions so that there are more sensor options to choose from. Tracks are more perpendicular so that thicker sensors may be OK. Don’t care about Lorentz angle. Cooling delivery is also somewhat easier.

Oct/12/07 Su DongSiD Tracking Meeting13 Summary Once lowered the elegance requirement on a single technology, one suddenly has some interesting freedom to consider more options to better optimize for the different regions. Question: –Asynchronized readout of mixed technology may interfere ? –Separate spatial resolution requirements for outer barrel ? –… Hopefully a useful starting point for discussions.