HARDROC2: First measurements. HR2 status, Hambourg 12 dec 08, NSM 2 HARDROC2 4.3mm 4.5 mm Ceramic: 4.3 mm Plastic (Thin QFP): 1.4 mm 28 mm Hardroc2 submission:

Slides:



Advertisements
Similar presentations
20/Oct./2000 CF IEEE NSS 2000 at Lyon,France 1 An MWPC Readout Chip for High Rate Environment Introduction ASIC Structure & Fabrication ASIC Evaluation.
Advertisements

Jeudi 19 février 2009 Status of SPIROC chips Michel Bouchel, Stéphane Callier, Frédéric Dulucq, Julien Fleury, Gisèle Martin-Chassard, Christophe de La.
SKIROC New generation readout chip for ECAL M. Bouchel, J. Fleury, C. de La Taille, G. Martin-Chassard, L. Raux, IN2P3/LAL Orsay J. Lecoq, G. Bohner S.
L.Royer– Calice DESY – July 2010 Laurent ROYER, Samuel MANEN, Pascal GAY LPC Clermont-Ferrand R&D LPC Clermont-Fd dedicated to the.
Second generation Front-end chip for H-Cal SiPM readout : SPIROC DESY Hamburg – le 13 février 2007 M. Bouchel, F. Dulucq, J. Fleury, C. de La Taille, G.
P. Baron CEA IRFU/SEDI/LDEFACTAR WORKSHOP Bordeaux (CENBG) June 17, Functionality of AFTER+ chip applications & requirements At this time, AFTER+
EUDET FEE status C. de LA TAILLE. EUDET annual meeting 6 oct 08 cdlt : FEE statrus 2 EUDET module FEE : main issues 2 nd generation ASICs –Self triggering.
An update on Power Pulsing with SDHCAL Kieffer Robert IPN Lyon « CALICE collaboration meeting » May 2011, CERN
L.ROYER – TWEPP Oxford – Sept The chip Signal processing for High Granularity Calorimeter (Si-W ILC) L.Royer, J.Bonnard, S.Manen, X.Soumpholphakdy.
Hold signal Variable Gain Preamp. Variable Slow Shaper S&H Bipolar Fast Shaper 64Trigger outputs Gain correction (6 bits/channel) discriminator threshold.
Organization for Micro-Electronics desiGn and Applications HARDROC 3 for SDHCAL OMEGA microelectronics group Ecole Polytechnique CNRS/IN2P3, Palaiseau.
EUDET JRA3 Front-End electronics in 2007 C. de La Taille IN2P3/LAL Orsay HaRDROCSKIROCSPIROC.
Vendredi 18 décembre 2015 Status report on SPIROC chips Michel Bouchel, Stéphane Callier, Frédéric Dulucq, Julien Fleury, Gisèle Martin- Chassard, Christophe.
Thanushan Kugathasan, CERN Plans on ALPIDE development 02/12/2014, CERN.
L.Royer– Calice LLR – Feb Laurent Royer, J. Bonnard, S. Manen, P. Gay LPC Clermont-Ferrand R&D pole MicRhAu dedicated to High.
SPIROC update Felix Sefkow Most slides from Ludovic Raux HCAL main meeting April 18, 2007.
Fermilab Silicon Strip Readout Chip for BTEV
ILD/ECAL MEETING 2014, 東京大学, JAPAN
17-19/03/2008 Frédéric DULUCQ Improvements of ROC chips VFE - ROC.
S. Bota – Calorimeter Electronics overview - July 2002 Status of SPD electronics Very Front End Review of ASIC runs What’s new: RUN 4 and 5 Next Actions.
Organization for Micro-Electronics desiGn and Applications Ludovic Raux OMEGA microelectronics group Ecole Polytechnique & CNRS IN2P3
Front-End electronics for Future Linear Collider calorimeters C. de La Taille IN2P3/LAL Orsay On behalf of the CALICE collaboration
14 jan 2010 CALICE/EUDET FEE status C. de LA TAILLE.
An update on Power Pulsing with SDHCAL Kieffer Robert IPN Lyon « CALICE collaboration meeting » May 2011, CERN
HARDROC: Readout Chip for CALICE/EUDET Digital Hadronic calorimeter Nathalie Seguin-Moreau.
HaRDROC performance IN2P3/LAL+IPNL+LLR R. GAGLIONE, I. LAKTINEH, H. MATHEZ IN2P3/IPNL LYON M. BOUCHEL, J. FLEURY, C. de LA TAILLE, G. MARTIN-CHASSARD,
SKIROC2 Silicon Kalorimeter Integrated Read-Out Chip Stéphane CALLIER, Christophe DE LA TAILLE, Frédéric DULUCQ, Gisèle MARTIN-CHASSARD, Nathalie SEGUIN-MOREAU.
PArISROC Photomultiplier Array Integrated in Sige Read Out Chip Selma Conforti Frédéric Dulucq Christophe de La Taille Gisèle Martin-Chassard Wei
SKIROC status CERN – CALICE/EUDET electronic & DAQ meeting – 22/03/2007 Presented by Julien Fleury.
H.Mathez– VLSI-FPGA-PCB Lyon– June , 2012 CSA avec reset pour s-CMS, bruit en temporel (Up-Grade TRACKER) (Asic R&D Version 1)
1 Second generation Front-end chip for H-Cal SiPM readout : SPIROC Réunion EUDET France – LAL – jeudi 5 avril 2007 M. Bouchel, F. Dulucq, J. Fleury, C.
June 13rd, 2008 HARDROC2. June 13rd, 2008 European DHCAL meeting, NSM 2 HaRDROC1 architecture Variable gain (6bits) current preamps (50ohm input) One.
CSNSM SPACIROC S. Ahmad, P. Barrillon, S. Blin, S. Dagoret, F. Dulucq, C. de La Taille IN2P3-OMEGA LAL Orsay, France Y. Kawasaki - RIKEN,Japan I. Hirokazu.
CALICE/EUDET FEE status C. de LA TAILLE. 31 aug 2009 EUDET SC meeting Status of JRA3 Front End Electronics 2 ILC front-end ASICs : the ROC chips SPIROC.
Week 22: Schematic Week 23-Week 27: Routing Gerber files have been available since 9th July 1st prototype: – PCB manufacturer: supervised by KIT – Cabling:
SPIROC ADC measurements S. Callier, F. Dulucq, C. de La Taille, M. Faucci, R. Poeschl, L. Raux, J. Rouenne, V. Vandenbussche.
CALICE/EUDET FEE status C. de LA TAILLE. 16 jun 2009 TB meeting FNAL ASICs for CALICE/EUDET 2 First generation ASICs Readout of physics prototypes (ECAL,
ASAD Workshop Saclay (CEA Irfu) November 25, AGET circuit: Application Information actar.
SKIROC status Calice meeting – Kobe – 10/05/2007.
Organization for Micro-Electronics desiGn and Applications Last results on HARDROC 3 OMEGA microelectronics group Ecole Polytechnique CNRS/IN2P3, Palaiseau.
HARDROC2: Before production in2p3
HARDROC HAdronic Rpc ReadOut Chip
OMEGA3 & COOP The New Pixel Detector of WA97
STATUS OF SPIROC measurement
A 12-bit low-power ADC for SKIROC
LHC1 & COOP September 1995 Report
ASIC PMm2 Pierre BARRILLON, Sylvie BLIN, Selma CONFORTI,
Digital Interface inside ASICs & Improvements for ROC Chips
SPIROC Status : Last release, “SPIROC 2c”
HR3 status.
Status of ROC chips C. De La Taille for the OMEGA group
R&D activity dedicated to the VFE of the Si-W Ecal
Multi-Anode ReadOut Chip for MaPMTs: MAROC3 MEASUREMENTS
Electronics for the E-CAL physics prototype
1 Gbit/s Serial Link 1 Gbit/s Data Link Using Multi Level Signalling
02 / 02 / HGCAL - Calice Workshop
STATUS OF SKIROC and ECAL FE PCB
SPIROC Status : Last developments for SPIROC
HARDROC STATUS 6-Dec-18.
SKIROC status Calice meeting – Kobe – 10/05/2007.
Status of SPIROC: Next generation of SPIROC
HaRDROC status: (Hadronic RPC Detector Read Out Chip for DHCAL)
PRODUCTION RUN: ROC chips STATUS
HARDROC STATUS 17 mar 2008.
HaRDROC status: (Hadronic RPC Detector Read Out Chip for DHCAL)
SKIROC status CERN – CALICE/EUDET electronic & DAQ meeting – 22/03/2007 Presented by Julien Fleury.
OmegaPix 3D IC prototype for the ATLAS upgrade SLHC pixel project 3D Meeting 19th March, 2010 A. Lounis, C. de La Taille, N. Seguin-Moreau, G.
Signal processing for High Granularity Calorimeter
The ATLAS LAr. Calibration board K. Jakobs, U. Schaefer, D. Schroff
AIDA KICK OFF MEETING WP9
Presentation transcript:

HARDROC2: First measurements

HR2 status, Hambourg 12 dec 08, NSM 2 HARDROC2 4.3mm 4.5 mm Ceramic: 4.3 mm Plastic (Thin QFP): 1.4 mm 28 mm Hardroc2 submission: mid june 08, Delivered end of october 08: 6 packaged chips, 440 naked dies Package: QFP160 1single row of pads

HR2 status, Hambourg 12 dec 08, NSM 3 HARDROC2: HARDROC1 +modifs Dynamic range extension –Gain correct.: 8 bits instead of 6: G=0 to 255 (analog G=0 to 2) –3 shapers, different Rf,Cf and gains: Fsb1, G= ½,1/4,1/8,1/16 Fsb2, G= 1/8,1/16,1/32,1/64 –3 thresholds (=> 3 DACs): 10 fC, 100fC, 1pC (megas) 100fC, 1pC, 10pC (GRPC) Correction of the minor bugs of HR1 : MASK, memory pointer (dummy frame) 872 SC registers, default config Power pulsing: –Bandgap (redesigned)+ ref Voltages + master I: power pulsed –POD module (power budget)

HR2 status, Hambourg 12 dec 08, NSM 4 SC/Read pb sr_rstb rstb_read rstb_sc selec Digital SW To spare output PADS and to avoid parasitics on the SC registers, SELEC + switch to deliver: –sr_sc, clk_sc, rstb_sc –sr_read, clk_read, rstb_read –Pb=digital sw and reset active low => reset of the SC registers when SELEC switched on the read register Read register not essential but usefull for debug and characterisation => Focused Ion Beam on 2 packaged chips to be able to use the Read register SC loading: –872 SC parameters –Vddd=4V necessary to load some SC config

HR2 status, Hambourg 12 dec 08, NSM 5 POWER CONSUMPTION Pwr_on_a alone14.9mA Pwr_on_dac1.025mA Pwr_on_d0.93mA ALL ON (default config)17 mA ALL OFF<4µA HR2 ON Vdd_pa5.5mA Vdd_fsbx312.3 mA Vdd_d0,1,27.3 mA Vddd0.67 mA vddd20.4mA (=0 if 40MHz OFF) Vdd_dac0.84 mA Vdd_bandgap1.2 mA Total (noPP)29 mA Total with 0.5% PP145 µA OFF= Ibias _cell switched off during interbunch HR1:a few forgotten switches (Bandgap, some reference voltages not power pulsed) HR2: switches added: –ALL OFF => 0 –5.5 µW/ch with 0.5% duty cycle HR1 ONOFF Vdd_pa5.8 mA5.6 µA Vdd_fsb4.9 mA65 µA Vdd_d02.8 mA78 µA Vdd_d12.7 mA0 Vddd+ vddd2 3mA250µA + 0 (Clk OFF) Vdd_dac0.77 mA218 µA Vdd_bandgap5.05 mA2.73 mA Total (noPP)25.3 mA3.2mA Total with 0.5% PP 125 µA0 hopefully HR2:

HR2 status, Hambourg 12 dec 08, NSM 6 Power On Digital: PowerON start/stop clocks and LVDS receiver bias current to meet power budget. LVDS receivers for RazChn/NoTrig and ValEvt ON during PowerOnAnalog (during bunch crossing) Clock is started asynchronously, enabled and stopped synchronously (at ‘0’) 2 operation modes : –Acquisition, Conversion  common to all managed by DAQ –Readout  daisy chained managed by StartReadOut and EndReadOut POD successfully tested on testbench

HR2 status, Hambourg 12 dec 08, NSM bit-DACs DAC0: fine=> -1.1mV/UDAC –VmaxVminstd – DAC0: coarse => -2.21mV/UDAC –VmaxVminstd – DAC1: coarse => -2.06mV/UDAC DAC2: coarse => -2.12mV/UDAC

HR2 status, Hambourg 12 dec 08, NSM 8 DC FSB0 vs G FSB0, 150fF, R∞, G=0 –DC Max DC Min DC std DC Mean – G=64: –DC Max DC Min DC std DC Mean – G=128 –DC Max DC Min DC std DC Mean – G=256: –DC Max DC Min DC std DC Mean – G=0 pedestal= 85 ±2 (peak to peak) G=128pedestal= 88±2 (noise envelop) G=256pedestal= 92±2 <>dc fsb: Independant of G <>=2.14V = pedestal equiv. to DAC0 (coarse) ≈90 G=256 G=0 Pedestal= 90 ±2

HR2 status, Hambourg 12 dec 08, NSM 9 NMOS MIRRORS GAIN of FSB1 and FSB2 Fsb1, G_nmos linearity Qinj=500fC 4 channels Fsb2 G_nmos lin 1pC 2.5pC 5pC (all swi ON) 10pC 100 fC

HR2 status, Hambourg 12 dec 08, NSM 10 Waveforms and Xtk: scope measurements FSB0, Qinj=100fC FSB1 (0100), Qinj=1 pC FSB2 (0100), Qinj=10 pC FSB0 normalised to 1 Xtk x10 Analog Xtk < 1%

HR2 status, Hambourg 12 dec 08, NSM 11 8bit PMOS MIRRORS: linearity measurement Allows accomodating the gain according to the detector choice PMOS gain: 8 bits/channel Binary G b = 0 to 255 Analog G = 0 to 2 Current mirrors mismatch between channels (small size transistors to optimise the speed): layout redone in HR2 to improve the uniformity Vout Qinj=100fC

HR2 status, Hambourg 12 dec 08, NSM 12 FSB0 scurves: HR1 /HR2 before and after gain correction 9% 5% 6.7% 1.4% HR1 before cor. HR1 after cor. HR2 before cor. HR2 after cor. Qinj=100fC Pedestal substracted

HR2 status, Hambourg 12 dec 08, NSM 13 SCURVES: FSB0,1,2 FSB1, 1pC FSB2, 10pC FSB2, 1pC FSB0, 100 fC In GREEN= after gain correction Gain=144 (Ga=1.125) for all channels before correction Gain correction for each channel on FSB0 FSB0, Cf=100f and Rf=100K ON (Cf eq =120fF, Rf eq =50K), Qinj=100fC FSB1, all Rf, Cf on (Rf eq =25K, Cf eq =170fF), G nmos =1000, 1pC FSB2, Qinj=1pC, Cf=100f (Rf eq =100K, Cf eq =120fF), G nmos =1000, G=144 FSB2,Qinj=10pC (Cinj), all swi ON (Cf eq =170fF, Rf eq =25K, G nmos =0010, G=144 50% point, Pedestal substracted channels UDAC

HR2 status, Hambourg 12 dec 08, NSM 14 SCURVES: FSB0,1,2 In GREEN= after gain correction FSB2, 10pC FSB2, 1pC FSB0, 100 fC FSB1, 1pC Gain=144 for all channels before correction Gain correction performed for each channel on FSB0, not efficient on FSB1 and FSB2 as non uniformity is dominated by non uniformity of NMOS mirrors used to change Gnmos 6.7% 1.3% 7% 6% 5.5% 5% 3%

HR2 status, Hambourg 12 dec 08, NSM 15 CONCLUSION HR1 bugs corrected: –Mask, pointer –Idle mode: pwr <15µW for the 64 channels ASIC –Better uniformity between channels before correction: 5%, down to 1.5% (fsb0) after correction 1pC and 10 pC OK, dispersion=5% HR2: suitable for m 2 ( No analog output) 400 HR2 to be packaged in plastic TQFP160 (I2A in USA) and TESTED (= characterisation=>30minutes/chip) Power pulsing to be tested (on testbench AND in test beam)

HR2 status, Hambourg 12 dec 08, NSM 16 ANNEX

HR2 status, Hambourg 12 dec 08, NSM 17 HARDROC2: analog part Slow Channel ½,1/4,1/8,1/16 PA FSB0 Gain FSB1 ½,1/4,1/8,1/16 (Default: G=0100) Gain FSB2 1/8,1/16,1/32,1/64 (Default: G=0100) Discri 0 Discri 1 Discri 2 Vth0: 10fC to 100fC Vth1: 100fC to 1pC Vth2: 1pC to10pC Out_fsb LATCH 0 Encoder LATCH 2 NOR64_0 NOR64_1 NOR64_2 trig_1 trig_0 trig_2 Q_Read hold LATCH 1 trigger0 trigger1 trigger2 trigger0 trigger1 trigger2 encod0 encod1 Qmask2 Qmask1 Qmask0 razchn valevt razchn valevt razchn valevt Multiplex Out_ss 8 bits correct. HARDROC1 872 SC parameters (default config)