Update on probe card preparation Y. Kwon (Yonsei Univ.)

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Presentation transcript:

Update on probe card preparation Y. Kwon (Yonsei Univ.)

Contents I will report on the status of 1.probe board (in good status), 2.probe needle (in good status), 3.and chuck (in solution search).

Chips bend easily. Chip arrival, Apr. 11 th Thin mono-crystalline silicon : 1.Warp on flat chuck 2.Possible invisible damage for each pick. 3.Possible fatigue failure

General CMOS chip 4-metal CMOS process schematics Cross-sectional area Bent surface can damage chips invisibly. Our chip will be 5or 6 metal case.

Sensor on chuck Central part of sensor is in contact to chuck. 4 measurements are heights of the sensor front side (chuck height set to be 0).

Probe board under test ETHERNET FPGA MCU LED status

EMULATOR MCU speed measurement MCU programming VHDL for FPGA

Status for probe board Basic functionality of board is in good shape. We need to detail algorithm to define contact status of probe card. Good support from NOTICE

Status - probe needle Mounting needle will be completed in 2-3 days. Sensor below dark area will be invisible. ~0.2g/  per pin Bent needle

Illumination from backside A special chuck transparent to light ( ~1050nm). Suction control One hole Minimum hole size for this Quartz chuck ~ 450  50 .

Headache Sensor has to be flat on the chuck when we lower probe needles. But our 50  -thick sensor with the delicate surface bends and breaks.

Status – Transparent chuck Sensors do not lie flat on the chuck. We need very gentle suction or adhesion. Simple suction makes visible warp. More holes? Sticky chuck?