Assembly and Test of the Spectrometer (H.P. Apr. 16,1998) Status Module Assembly and Tests 1.) Status of completed hybrids and module 2.) Summary of the modules we have now 3.) Next steps towards the installation 4.) Detailed systematic measurements tomorrow in Markus’s talk

Overview of Assembly and Test Test of - VA chips - flex cables - hybrids SMD/conn to hybrid Chip to hybrid Hybrid bonding Test of MS MS rework Sensor pool Module gluing Module bonding (fast) Module function test Module SOURCE test Module calibration SURVEY measurement Module rework backpl. contact Mounting on frames

Status of components Hybrids –all hybrids assembled (a total of 1400 chips on 80 hybrids) –all hybrids tested and mounted to modules –lost only 3 of 80 hybrids -> extreme high yield of =96% –our “component drawers” are empty now sensors: –all sensors for the first arm received (big congratulation to Willis & Gerrit) –all necessary sensors for the first arm are tested and mounted (few more T3’ for a spare module now at MIT) Modules: –baseline: We are done with the module assembly and testing!!!

Assembly Time Schedule

Status of components Hybrids –all hybrids assembled (a total of 1400 chips on 80 hybrids) –all hybrids tested and mounted to modules –lost only 3 of 80 hybrids -> extreme high yield of =96% –our “component drawers” are empty now sensors: –all sensors for the first arm received (big congratulation to Willis & Gerrit) –all necessary sensors for the first arm are tested and mounted (few more T3’ for a spare module now at MIT) Modules: –baseline: We are done with the module assembly and testing!!!

A summary of Module Tests Calibration test –verify basic functionality –determine the gain of the module –find dead or substandard channels Acceptance criteria = less than 5% dead channels –dead = gain less than 80% of normal gain –noisy = noise larger than 3 times average noise Test with 90Sr source: –verify sensor function –verify signal –measure signal/noise distribution Acceptance criteria = peak signal/noise > 10

Our Modules MOD2 (2 installed) Substandard ch. percentage/module peak S/N

Our Modules M7T2 (2 installed) Substandard ch. percentage/module peak S/N

Our Modules MOD1 (4 installed)

Our Modules MOD6 (4 installed) Substandard ch. percentage/module peak S/N

Our Modules M4T4 (4 installed) Substandard ch. percentage/module peak S/N

Our Modules M5T4 (3 installed) Substandard ch. percentage/module peak S/N

Our Modules M7T3 (4 installed) Substandard ch. percentage/module peak S/N

Our Modules M5T5 (14 installed) Substandard ch. percentage/module peak S/N

Our Modules M4T5 (6 installed) Substandard ch. percentage/module peak S/N

A summary: The module peak signal-to-noise All modules S/N better than 10 Average S/N = 16:1

A summary: The number of defect channels (mainly pinholes, hardly broken lines or bonding shorts) All modules S/N better than 5% Average number of substandard channels = 1% %

A summary: The mounted sensors Vfd Iactive Rpoly - operation voltage below 90V (except 2 spare Mod1) - polysilicon resistor between 1-10MOhm - active area leakage current below 8uA typically 4-5uA

Conclusion The module assembly and testing is FINISHED –The hybrids had an exceptional high yield –all modules significantly better than the specifications –Signal/Noise=16:1 –about 1% dead channels The next fun- part: –survey and covers (in May/June) –mounting on frames (in July/August) –installation (in September) What’s left to be said: A big thanks to the whole assembly group