PCB Team: Prof. Sachin S. Sapatnekar. Layer and Packaging In our design, we need to use Eagle to make Library, Schematic, and board. These are then sent.

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Presentation transcript:

PCB Team: Prof. Sachin S. Sapatnekar

Layer and Packaging In our design, we need to use Eagle to make Library, Schematic, and board. These are then sent to the fabrication company for printing. There are two things that we need to address: 1.The cost: in order to be cost efficiency, we used a 4 layer design. 2.To the concern of solderability and availability; we chose a specific packaging format. TSSOP (and so on)

Availability of components We ordered most of our components via DigiKey and TSSOP. They carry the more popular types at low cost with plenty of stock. Fig 1. the DC step-up IC we chose (from Digi-Key)

8 – TSSOP specifications According to the Datasheet, we can Specify the foot- Print in Eagle Precisely Fig 2. Devise dimention From the datasheet from Fairchildsemi.com

One Library Eagle doesn’t have all the IC and components that we use, so we need to create the library. There are three steps to make a library: 1. symbol 2. package 3. connect them

One Library Here is the procedure to make an IC library: