RBSP Radiation Belt Storm Probes RBSP Radiation Belt Storm Probes RBSP/EFW CDR /30-10/1 100 EFW DFB Systems Assurance Trent Taylor LASP

RBSP/EFW CDR /30-10/1Trent Taylor DFB LASP QA Organization 101 Quality Assurance Build Configuration Verification Build Configuration Verification ESD Control LASP Flight Assurance Manager LASP Flight Assurance Manager Safety Configuration Management Configuration Management Documentation and Records Documentation and Records PMPCB, FRB, MRB Training and Certification Training and Certification Personnel Safety Personnel Safety Flight Hardware Safety Flight Hardware Safety Lab Inspections Contamination Control Contamination Control Support Flight H/W & S/W Testing Support Flight H/W & S/W Testing Inspections Quality Assurance Engineer Quality Assurance Engineer LASP Engineering Director

RBSP/EFW CDR /30-10/1Trent Taylor 102 DFB PA Requirements and Safety Performance Assurance Matrix Status –A few FPGA requirements still open. Closure is scheduled for 9/17/09 with APL’s acceptance of LASP’s FPGA Development Guide. –Materials & Processes requirement #122 still open (see below) No waiver/deviation requests to date –Materials and Processes requirement #122 of the PA Compliance Matrix may require a deviation request for LASP to use RGA instead of QCM. System Safety –LASP provided initial safety input with CDRL MA-006 for PDR. –There are no safety compliance issues with the EFW DFBs. –LASP will provide any further safety input upon request.

RBSP/EFW CDR /30-10/1Trent Taylor DFB Suppliers and GIDEP Suppliers –LASP procures all flight parts and materials through vendors on LASP’s approved vendor list. –LASP procures EEE parts directly from the manufacturer or through authorized distributors. –LASP requires full traceability on all flight procurements. –Program requirements are flowed through procurement documentation. Where necessary, procurement documentation may include source control documents (SCDs) and engineering documentation. –LASP’s DFB contains no custom or non-standard EEE parts. –LASP’s DFB procurements required no additions to the LASP approved vendor list. GIDEP Status –LASP has responded to APL GIDEP evaluation requests meeting all delivery dates. –There are no current GIDEP “hits” – no parts on the DFB are impacted by any Alert or Advisory. 103

RBSP/EFW CDR /30-10/1Trent Taylor DFB EEE Parts Parts –All EEE parts are procured to program requirements with no additional screening required with the exception of the following: JANTXV cavity devices (3 part types): GSFC will PIND test these parts. AD648/883B (OpAmp): GSFC will screen and qualify to EEE-INST-002 Level 2. No additional radiation testing is required. OP262GS (dual Op Amp - Plastic COTS). Parts were radiation tested by APL. GSFC will screen and qualify to EEE-INST-001 requirements. VTF TBX (Resistor Network – COTS): GSFC will screen and qualify to EEE-INST-002 Level Parts CE Approval Radiation Engineering Approval Screening/Qual Approval PMPCB ApprovalTOTAL EEE Parts63 Detectors00000 ASICs00000 Hybrids22222

RBSP/EFW CDR /30-10/1Trent Taylor DFB Materials & Processes Materials and Processes –MIL is up-to-date –Regular meetings with PMPCB –Will add PWB data when ordered (will be per required IPC specs) –Fasteners need to be approved Limited Life Items –DFB has no limited life items 105 M&P Category SubmittedApprovedConditionalPendingProhibitedTOTAL Non- Metallic Materials 1392%0%8%013 Metallic Materials 2100%0% 12 Processes367%0%33%03

RBSP/EFW CDR /30-10/1Trent Taylor DFB Configuration Management Configuration Management –LASP uses Agile software for Configuration Management Documents submitted, reviewed, and approved electronically All documents and records are searchable As-built records and as-run test procedures archived –Follow LASP’s Document & Record Control Procedure –Assembly Travelers (ATs) generated and archived in the system Flight Drawing/Document Status 106 DrawingsRelease DateDocumentsRelease Date Schematic9/18/09DFB SpecReleased Rev D Layout9/18/09FPGA Spec Draft 10/01/09, Prelim 12/01/09, Final 02/01/10 Fab, Assembly Instructions 10/01/09Test PlanPrelim 10/01/09, Final 12/01/09 Test Results1 st Qtr ‘10

RBSP/EFW CDR /30-10/1Trent Taylor DFB Contamination & ESD Control Contamination Control –All assembly performed at laminar flow-benches –Class 10,000 cleanrooms available –PWAs baked out with RGA –Packaging and shipping provisions to maintain low contamination exposure during transport ESD Control –QA owns and implements the ESD control program –LASP’s ESD Control Procedure meets ANSI/ESD S20.20 requirements –All applicable personnel trained and certified by LASP’s NASA-trained Level B instructor –Training certifications required for lab entry 107

RBSP/EFW CDR /30-10/1Trent Taylor 108 Mandatory Inspection Points and photo documentation specified in Fabrication & Assembly Instructions (FAIs) within ATs – Audit Assembly Traveler data package at each inspection point Check sign-offs, traceability, document revisions, etc. Verify acceptable lab temperature and humidity – PWAs Inspect solder workmanship to NASA-STD and.3 Parts placement and orientation – per engineering drawings and FAIs – Polymerics Inspect per NASA-STD , FAIs, drawings, and in-house standards Check mix records, durometer hardness of cure samples – Cables, Harnesses, Wiring Inspect crimps, solder and other workmanship to NASA standards Dimensions, shield terminations, shrink sleeve, etc. to FAIs, drawings, etc. – Other Inspections Incoming/Receiving; Kitting; Pre-cap; Calibration of Equipment; Acceptance and Environmental Test Set-up; Flight Connector Safe-to-Mate DFB Inspections

RBSP/EFW CDR /30-10/1Trent Taylor Non-Conformance Reporting 109 Non-conformances addressed per LASP’s Anomaly Reporting Plan Reporting Methods - Fabrication and Assembly Discrepancy Report (FADR) For rework-type non-conformances identified during fabrication/assembly - Non-Conformance Report (NCR) Level 1 NCR- for minor discrepancies Level 2 NCR- for test failures and other issues occurring after program Pre- Environmental Review, or for any anomaly that the Integrated Project Development Team (IPDT) determines to warrant Level 2. - Dispositions include: scrap, rework, return to supplier, refer to MRB - Processing of Level 2 NCRs is consistent with standard Failure Review Board (FRB) practices. - Material Review Board (MRB) report Dispositions include: scrap, rework, return to supplier, repair by standard or non-standard procedures, use-as-is, request for waiver Customer participation and approval required