Lamiflex shielding Pre-Pregs

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The effects of electromagnetic interference can be very detrimental to electronic systems utilized in aerospace missions. Assuring that subsystems and systems are electrically compatible is an important engineering function necessary to assure mission success. An electronic incompatibility occurs when a system or equipment interferes with another system or equipment. When this interaction is traced to the transfer of electromagnetic energy from culprit to the victim, it is termed EMI. EMC denotes the electromagnetically compatible, simultaneous operation of systems and equipment. In this condition with the new increasing transformation of the structures from metal to composite, have offered more vulnerability to many electronic devices. Based on that Lamiflex has developed new composite materials that combines benefits of the composites with the electrical features of the metal. We offer : - Weight saving at least 40% less compared with metal solution - From 45dB up to 90dB attenuation level from 1 Mhz to 18 GHz - Electrical surface stability, conductivity from less then 5mmΩ - Flexibility in design 2

3 In the US market the applications are supported by AASC, Specializing in Design, Fabrication, and Testing Lightweight Aerospace Structural Assemblies. With the innovation of Lamiflex, in the textile and composite material design, and the cooperation agreement signed with Soliani EMC, a company active in making shielding / metalized materials and RF design, new solutions are born for EMI and RFI shielding applications.

CASE HISTORY Aeronautical EMC problems of electronic devices 4 CASE Between 1981 and 1987, five Blackhawk army helicopters crashed and killed or injured all on board when they flew too close to radio broadcast transmitters. CAUSE Insufficient immunity of flight (on-board) control electronic sub-system against high intensity radiated fields (HIRF) that produced uncommanded movements while flying past radio broadcast towers. (Source: NASA Reference Publication 1374 July 1995)

CASE HISTORY Missile EMC problems of electronic devices 5 During a B-52 missile interface unit test, an un commanded missile launch signal took place. One of the contributing factors was crosstalk in the systems wiring. The outcome was a year long redesign and test effort. (Source: NASA Reference Publication 1374, July 1995)

CASE HISTORY Medical equipment EMC problems of electronic devices 6 Modern medical equipment has experienced EMI problems. From 1979 to 1993, the FDA received over 90 reports concerning EMI problems in the field. It was pointed out that users experiencing medical equipment performance degradation might not suspect EMI as a possible cause. Thus, EMI problems are more likely to be under-ported to the FDA. (Source: NASA Reference Publication 1374 July 1995)

FEATURES of shielding materials 7 Lamiflex combines the characteristics of shielded materials and those of composite materials by creating new components that combine the advantages from both sector. -High electrical conductivity on the surface -Wide range of types of fabrics for a high coverage of the frequency spectrum

FEATURES of composite materials 8 Lamiflex combines the characteristics of shielded materials and those of composite materials by creating new components that combine the advantages from both sector. -Optimization of the weights -Versatility of feasible geometries

Metallization of the fabric is the core of shielding 9 Creating a deposition of metals – such Copper, Nickel or Zinc – around the single filament after weaving

Solvent impregnation: Key tecnologies Epoxy solvent pre-preg production Resin mixing and formulation Pre-pregs for specific applications 10 Pre-preg and conductive reinforcement

FARADAY pre-preg family: Shielding 11 Faraday pre-preg is a perfect solution for EMC/RFI shielding from MHz to 60GHz. Shielding capability is about 50-70db depending of reinforcement and metal

FARADAY pre-preg family: REINFORCEMENTS 12 FARADAY PPolyester/Polyamide reinforcement - general purpose for light weight and low cost solutions FARADAY G Glass reinforcement - meet shielding and medium stiffness solutions FARADAY C Carbon reinforcement - meet shielding and high stiffness solutions Conductive pre-preg in epoxy resin mix the conductive behavior of the metal to the drapability of the textiles products for lightweight shielded component

FARADAY pre-preg family: REINFORCEMENTS 13 FARADAY PPolyester reinforcement - general purpose for light weight and low cost solutions. Solution to replace conductive paint and plasma coating - Better adhesion - Cheaper than plasma coating - Homogeneous shielding performances - One shot process FARADAY P polyester fabric with high drapability for complex shapes FADARAY HC P polyester fabric with high metal quantity for high shielding al low frequencies FARADAY GHC Ppolyester fabric with high metal quantity and close weaving structure for high shielding at high frequencies; low drapability. Perfect solution for flat panels FARADAY TNT Ppolyamide non woven (available only with copper metallization); low drapability. Perfect solution for flat panels Custom reinforcement available

FARADAY pre-preg family: REINFORCEMENTS 14 FARADAY P FADARAY HC P SEM image

FARADAY pre-preg family: REINFORCEMENTS 15 FARADAY GHC P SEM image

FARADAY pre-preg family: REINFORCEMENTS 16 FARADAY TNT SEM image

FARADAY pre-preg family: REINFORCEMENTS 17 FARADAY GGLASS reinforcement meet shielding and medium stiffness solution. Standard reinforcement is a low weight glass veil. Custom reinforcement available

FARADAY pre-preg family: REINFORCEMENTS 18 FARADAY CCARBON reinforcement meet shielding and high stiffness solution. Standard reinforcement is CC200g/m2 plain. Custom reinforcement available

FARADAY pre-preg family: METALLIZATION 19 NICKEL Ngeneral purpose: good compromise between cost, corrosion resistance and shielding COPPERC high surface conductivity ZINC G safety for manipulation, with same performance of Nickel Copper Nickel Zinc

FARADAY pre-preg family: EPOXY RESINS – R25 20 RESIN 25 : standard epoxy resin for medium curing temperatures (solvent technology) Example of curing Curing Tg 120°C °C Custom resins available

FARADAY pre-preg family 21 FARADAY XXX P_N commercial name description of reinforcement metal reinforcement material

FARADAY pre-preg family: APPLICATIONS 22 PANELS BOX DUCTING

FARADAY SHIELDING: effect of the metal quantity 23 Modifying structure (or material) of the fabric and quantity of the metal is possible to makes custom conductive and shielding level. FARADAY P_N gray FARADAY HC P_N blue FARADAY GHC P_N red Test in accordance to EN

FARADAY SHIELDING: CARBON stiffness&shielding 24 Testing IEEE 299:2006 shielding panels

FARADAY SHIELDING: metal vs composite 25 Same shielding performance but low weight Testing IEEE 299:2006 shielding panels

FARADAY SHIELDING: US Air Force testing 26 US AIR Force laboratory tested FARADAY materials

FARADAY SHIELDING: lightning 27 Rear surface of the Faraday P/N test sample. No visible damage has occurred to the sample. The rear of the sample was noticeably warm to touch approximately 3 minutes after the test was carried out. Front surface of the Faraday P_N test sample. The sample has a 120mm split in the first few ply layers. There has been ablation of the top coating over 60mm x 60mm. DEVELOPMENT on PROGRESS

Shielding Composite cable ducts Case History -55°C / 120°C Light weight FAR compliant ABD0031 compliant

Shielding Composite cable ducts Case History

GHz Aluminum panel vs conductive composite panel made in Faraday pre-preg P Antenna from 1 to 6 GHz Conductive panel -55°C / 120°C Light weight FAR compliant ABD0031 compliant

FARADAY SHIELDING: testing facilities 31 TRANSFER IMPEDANCE TEST SETUP Test in accordance to EN Measure of Transfer Impedance and Effective Shielding

FARADAY SHIELDING: testing facilities 32 Test in accordance to IEEE 299:2006

FARADAY SHIELDING: testing facilities 33 The specified waveform (Zone 2A – D+B+C*) has the following parameters: Component D Peak Current: 100kA ±10% Action Integral: 0.25×106A2s ±20% Time <500μs Component B Average Current: 2kA ±20% Charge Transfer: 10 Coulombs ±10% Time 5ms Component C* Average Current: 400A Charge Transfer: 18 Coulombs ±20% Time 45ms

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