Performances of the upgraded SVT The Silicon Vertex Trigger upgrade at CDF J.Adelman 1, A.Annovi 2, M.Aoki 3, A.Bardi 4, F.Bedeschi 4, S.Belforte 5, J.Bellinger 6, E.Berry 1,M.Bitossi 2, M.Bogdan 1, M.Carlsmith 6, R.Carosi 4, P.Catastini 9, A.Cerri 8, S.Chappa 7, W.Chung 6,M.A.Ciocci 9, F.Crescioli 2, M.Dell’ Orso 2, B.Di Ruzza 11, S.Donati 2, I.Furic 1, S.Galeotti 4, P.Giannetti 4, C.M.Ginsburg 6, P.Giovacchini 4, R.Handler 6, Y.K.Kim 1, J.D.Lewis 7, T.Liu 7, R.Mahlum 7, T.Maruyama 3, F.Morsani 4, G.Ott 6, I.Pedron 10, M.Piendibene 4, M.Pitkanen 7, L.G.Pondrom 6, G.Punzi 2, B.Reisert 7, M.Rescigno 11, L.Ristori 4, H.Sanders 1, L.Sartori 10, F.Schifano 10, F.Sforza 9, M.Shochet 1, B.Simoni 2, F.Spinella 4, P.Squillacioti 9, F.Tang 1, S.Torre 9, R.Tripiccione 10, G.Volpi 9, U.K.Yang 1, L.Zanello 11, A.M.Zanetti 5 1 University of Chicago,Illinois,USA, 2 University of Pisa, Italy, 3 University of Tsukuba,Japan, 4 INFN Sezione di Pisa, 5 INFN Sezione di Trieste, 6 University of Wisconsin,USA, 7 Fermilab,Batavia,Illinois,USA, 8 LBL,California,USA, 9 University of Siena,Italy, 10 University of Ferrara and INFN,Italy, 11 University of Rome and INFN,Italy COT tracksSVX hits Finding tracks in the silicon Low res track 2 steps: 1.Find low resolution: not time consuming 2.Fit hits at full res.: time consuming depending on the number of fits CDF DAQ & Trigger Detector Raw Data To Mass Storage (50~100 Hz) Level 1 pipeline: 42 clock cycles L1 Accept Level 2 Trigger Level 2 buffer: 4 events L2 Accept DAQ buffers L3 Farm 7.6 MHz Crossing rate Level 1 Trigger Level 2 Asynchronous 3 Stage Pipeline 20  s Latency 300 Hz accept rate Level MHz Synchromous Pipeline 5544 ns Latency 50 KHz accept rate SVT here 40 kHz accept rate 20  s average Latency ~20 kHz actual ~35  s actual Tails are important Design goals The task of the Silicon Vertex Trigger (SVT) is very complex: Links hits from five layers of the Silicon Vertex Detector (SVX) to segments observed in the Central Outer Chamber (COT) The task proceeds through steps of increasing resolution. 1.Associate hits to tracks at low resolution (roads) strongly reducing the combinatorics 2.Fit tracks and precisely determine their parameters solving the residual combinatorics Thanks to the use of Associative Memories the first step is performed in parallel during the detector readout The Silicon Vertex Trigger reconstructs in real time tracks precise enough to measure b quark decay secondary vertices. The tracks reconstructed by SVT are used for the selection of events at the Collider Detector at Fermilab (CDFII) The CDF DAQ and Trigger system is organized in three levels. The Level 2 uses the SVT tracks for the event selection The Level-2 Trigger processing time at present limits the Level-1 bandwidth depending on instantaneous luminosity. The SVT takes a significant fraction of the total Level-2 processing time whose fluctuations cause deadtime and limit the Level-2 processing rate Why was the SVT upgrade necessary? SVT processing time is well described by this model: ~c 1 +(35ns)*N(Hit) +(300ns)*N(Comb.). Left plot shows comparison between this parameterization (blue line) and data (red histogram) taken at 5x10 31 cm -2 s -1. The two histograms agree. The peak luminosity the Tevatron is expected to provide is 30x10 31 cm -2 s -1 (6 times the luminosity used to train the model). Middle plot shows the expected performances of the SVT at the maximum luminosity. 56% of events would take longer than 50  s to be processed: a time long enough for all Level 2 buffers to be filled. Impossible to run SVT at that luminosity. To reduce the processing time: Thinner patterns  less fits but bigger AM (AM++) Bigger AM  Need faster HIT-PATTERN association  new Hit Buffer (HB++) Faster Fits  new Track Fitter (TF++) Rightmost plot shows how the 512k pattern AM bank and TF++ reduce the tails The two steps upgrade 1.First install AM++, AMS/RW, TF++: allow for 128k pattern bank. AM++ inherited from FTK. TF++ and AMS/RW implemented in Pulsar 2.Second step faster HB++ in another pulsar to support the final 512k pattern bank. New Associative Memory (AM++) Pulsar: AMS/RW, TF++ and HB++ 1 st Pulsar Sequencer & Road warrior (AMS/RW) Associative Memory kpattern (AM++) 3 rd Pulsar Track Fitter (TF++) 2 nd Pulsar Hit Buffer (HB++) ~300  m Dead Time (%) Accept Rate (kHz) Phased installation of the SVT upgrade The commissioning of the SVT upgrade occurred during data taking Need to reduce the impact on the data acquisition: proceed in three phases 1.Install AMS/RW and AM++ with 128k patterns enabling only 32k patterns: major changes to the SVT crate layout 2.Install TF++ and after few days of data taking without problem enable the whole 128k patterns bank (July 2005) 3.Install HB++ and after few days of data taking without problem enable the whole 512k patterns bank (February 2006) System fully tested before installation of any board 1.Standalone test of each board: check firmaware functionality and develop the software for monitoring and debugging 2.Vertical slice tests: create a whole SVT crate with new boards and feed it with data coming from one SVT wedge to compare the output of old and new system 3.Take data with one upgraded wedge: before proceeding to the full installation we install the new boards in one wedge and take data for at least 100 hours Most of the data taken during the commissioning were good Mean processing time The average processing time of old SVT used to have a large growth at high luminosity. The faster hardware allows for smaller mean processing time reduces the dependence on the instantaneous luminosity The new system allows for a smaller latency at Level 2 Fluctuations of the processing time Large processing times measured by the distribution RMS are due to complex events They are reduced by improving the fitting stage The TF++ fits each hit combination in less time, reducing the dependence on the number of combination (175 ns instead of 300 ns) The larger pattern bank allow for thinner road and consequently a smaller number of combination to be fitted per road The upgrade reduce the dependence of the fluctuations on the luminosity providing a larger Level 1 bandwidth over a wide luminosity range Fraction of long processing time events Events with processing time higher than 50  s can cause all the Level 2 buffers to be filled and therefore deadtime The percentage of this kind of events used to be strongly dependent on the instantaneous luminosity The upgrade reduces the fraction of long processing time events and its dependence on the instantaneous luminosity With 512k patterns at luminosity of 1.5x10 31 cm -2 s -1 less than 2% of events require more than 50  s to be processed At low luminosity the bandwidth is mostly filled by B physics triggers The 128 kpattern bank already allowed to increase the minimum Level 1 Accept rate at low luminosity: from  20 kHz (blue) to  25 kHz (violet). With the 128 kpattern bank we can already collect 20% more of B decays than in the past with negligible deadtime Because of the shutdown no significant comparison with fully upgraded SVT is possible yet at high luminosities, but the power of the system has been strongly improved (see plots on the left) to be ready for the highest luminosities. Thanks to the upgrade, CDF will be able to fully exploit the increase of the Tevatron luminosity and efficiently select events containing displaced vertexes Effect of the upgrade on the DAQ The deadtime as a function of the rate of events accepted by the Level 1 (L1A) shows the upgrade impact on the performance of the DAQ. The upgrade reduces the deadtime allowing for higher output rates at Level 1 B triggers