J. Valls, CMS L2-L3 Meeting, Sept 20021 ROD Production at CERN  ROD Flow During Production  ROD Flow at CERN  ROD Testing Areas  Infrastructure  Equipment.

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Presentation transcript:

J. Valls, CMS L2-L3 Meeting, Sept ROD Production at CERN  ROD Flow During Production  ROD Flow at CERN  ROD Testing Areas  Infrastructure  Equipment Requirements Document 

J. Valls, CMS L2-L3 Meeting, Sept Goals To fully assemble, test and characterize a total of ~ 700 RODs …by the end 2004

J. Valls, CMS L2-L3 Meeting, Sept ROD Assembly Sequence  Mechanical ROD (ROD frames + pipes)  Electrical ROD (+ IC bus + IC boards + AOH)  Full ROD (+ Silicon)

J. Valls, CMS L2-L3 Meeting, Sept ROD Flow During Production ROD electrical integration ROD mechanical integration  IC bus and IC boards integration  Optoelectronics integration  CCUM, connectors, and cable assembly  Electrical tests with FE hybrids  Electrical RODs packaged and sent to FNAL and UCSB FNAL/UCSB ROD final qualification  Basic ROD operation Digital tests and readout errors Bad channel identification OH scans Total gain and offset scans Operational bias voltage  X-Y -source scans  Cosmic ray runs ROD silicon integration ROD qualification Helsinki Goal: Ready by March 2003 CERN

J. Valls, CMS L2-L3 Meeting, Sept ROD Flow at CERN CERN Spare Modules Storage Bin CERN Single Module Test Setup CERN -Source X-Y Scan Table CERN Single ROD Test Setup FNAL & USBC Modules and ROD CERN ROD Storage Bin CERN ROD Cosmic Rack ROD OK ROD Failure ROD OK Module OK

J. Valls, CMS L2-L3 Meeting, Sept  -Source X-Y Scan Table Patch panel with connectors (HV, LV, controls, cooling) X-Y movement arms 3 RODS (any type) Rigid cover

J. Valls, CMS L2-L3 Meeting, Sept Delivery Schedule for Electrical RODs Testing Capability Rate (4 RODs/day) Wheel integration

J. Valls, CMS L2-L3 Meeting, Sept ROD Testing Areas  Building 598 ROD System Tests (prototypes SS, DS) Equipment Procurement and Quality Test Definitions for Production  Building 596 Electrical ROD Assembly and Tests  Building 186 ROD Production and Qualification Tests Tracker Assembly and Integration

J. Valls, CMS L2-L3 Meeting, Sept Building 186

J. Valls, CMS L2-L3 Meeting, Sept Building 186 (TOB Area) PS x-y Table Rod Hospital Cosmic Rack Cooling unit Cold room PS PS racks Rod storage PS racks Module Air cond 0.8 m 17.8 m 7.1 m Total Testing Area: 126 m 2 Tracker Assembly Hall Tracker Assembly Area 300 ROD capacity Goal: Ready by early 2003 Siemens C/32 0 C C (~400 W for 12 RODs)

J. Valls, CMS L2-L3 Meeting, Sept Infrastructure for 186  Gas Contact CERN gas working group  Grounding Contact TIS (?)  TIS Permissions  Conditioning Work Cleaning Furniture procurement Pipe work Etc. Goal: Ready by Dec 2002

J. Valls, CMS L2-L3 Meeting, Sept Equipment Needed for Production  DAQ Hardware 4 PC computers DAQ cards 1 ARC single module setup  High Voltage CAEN SY-127 Mainframe (10 boards A343, 2 kV, 200 A) CAEN SY-1527 Mainframe (6 boards A1511, 2 kV, 10 A-1 mA) Current Monitoring (CERN MSGC picoAmmeters) Controls (CAENET V288 VME)  Low Voltage DELPHI switching LV PS (redesigned) 3 LV control PS (testbench)  Cooling Units (and interlocks) Siemens Uniphase Cooling Unit (C 6 F 14 ), C / C Refrigeration Unit at Build. 186 (C 6 F 14 ), C  DAQ Software XDAQ (beam-test program) XROD (system test)  Qualification and Acceptance Criteria Software  Integration into DB

J. Valls, CMS L2-L3 Meeting, Sept DAQ Test Setups at CERN  Single electrical ROD setup (Build. 596)  Single ROD setup (Build. 186)  X-Y table setup (3 RODS) (Build. 186) Max. APVs OEC Channels OEC Boards MUX Cards PMC-FED TSC/FEC Cards / 1 Max. APVs OEC Channels OEC Boards MUX Cards PMC-FED TSC/FEC Cards / 1 Max. APVs OEC Channels OEC Boards MUX Cards PMC-FED TSC/FEC Cards / / 3 Total: / 2 Available: (Build. 598)

J. Valls, CMS L2-L3 Meeting, Sept ROD Types  L1, L2  Double Sided RODs (DS) 12 modules, 4 APV  24 fibers  L3, L4  Single Sided RODs (SS4) 6 modules, 4 APV  12 fibers  L5, L6  Single Sided RODs (SS6) 6 modules, 6 APV  18 fibers