Welcome to satellite meeting on 3D vertically integrated electronics at TIPP2011 June 14, 2011 G. Deptuch,

Beginning of 3D in HEP We are 6 years after the introduction of 3D-IC to HEP front-end intrumentation; what questions do we have today? 3D satellite workshop, June 14,

program 1st was at TIP2009 in Japan, since then several workshops satelliting selected conferences in the field Under auspices of VIPS facilitation group 8 talks given by distinguished speakers and DISCUSSION 3D satellite workshop, June 14, Japan Junji Haba USA Marcel Demarteau Europe Hans-Günther Moser VIPS (Vertically integrated pixel sensors)

Program (part 1) Paul Franzon, NCSU, USA, ‘Design and Implementation options for 3D-IC’ Hans Gunther Moser, MPI, Germany, ‘3D technology developments in Europe and European Union supported efforts’ Masahiro Aoyagi, AIST, Japan, ‘Japanese 3D status’ Ray Yarema, FNAL, USA, ‘TSV revolution and Fermilab’s MPW experience’ short testimonial/application talks followed by panel discussion part 1 3D satellite workshop, June 14,

Program (part 2) Yasuo Arai, KEK, Japan, ‘SOI technology for monolithic and 3D integrated detectors’ Chenson Chen, MIT-LL, USA, ‘3D-IC enabler of advanced focal planes’ Bob Patti, Tezzaron, USA, ‘3D-IC for real chips and prospectives’ Zvi Or-Bach, FNAL, USA, ‘MonolithIC 3D’ panel discussion part 2 5 3D satellite workshop, June 14, 2011

Conclusions Nothing else in the world... not all the armies... is so powerful as an idea whose time has come. Victor Hugo 6 3D satellite workshop, June 14, 2011