Manqi Ruan Discussing & Support: Roman, Francois, Vincent, Supervisor: Z. ZHANG (LAL) & Y. GAO (Tsinghua)) DQ Check for CERN Test.

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Presentation transcript:

Manqi Ruan Discussing & Support: Roman, Francois, Vincent, Supervisor: Z. ZHANG (LAL) & Y. GAO (Tsinghua)) DQ Check for CERN Test Beam 2007 data

Outline Statistic Ecal Response: Longitudinal Profile, Linearity & Resolution Problems & Noise Patterns observed in TB data

Statistic Scan over 1000 runs on /grid/calice/tb- cern/rec/monitor-cern07: (from run run , currently about 100 runs failed or missed in grid job submission) About 90 electron runs, 80 electron-pion mixed run and 160 pion runs are marked as Most valuable runs, with statistic > 100k per run. (A few runs with statistic < 100k was also marked as most valuable run for those run could combine together with other runs with same beam configuration to gain enough statistic).

Ecal Response: Longitudinal Profile 0 Degree10 Degree20 Degree 50GeV GeV GeV GeV GeV GeV GeV GeV A set of most valuable electron runs are selected: with beam aim at wafer center. Only the default cut (energy>0.5 mip) of reconstruction is applied

Normal inject beam: Energy deposition/Mips

10 o impact: Energy deposition/Mips

20 o impact: Energy deposition/Mips

A Gaussian fit on the main peak of ECAL energy spectrum

Linearity: Without Any Cleaning & selection: 1GeV ~ 269 mips (>233 mips (the value for last TB experiment) for different cut applied?) 0o0o 10 o 20 o

Linearity: overlay for 3 different inject angle

Resolution: Without Any Cleaning & selection: σ(E) ~ 0.2sqrt(E) 0o0o 20 o 10 o

Resolution accuracy: overlay for 3 different inject angle Large statistic of high Quality TB data had Been collected & Ecal response is consistent with our Previous result

Noise & Problem Patterns observed Wafer Gap effect: Bump & Double bump in ecal energy spectrum Ecal: less hit in ecal last layer: almost affect every Pion Run (and high energy electron runs) Low energy noise in several ecal layer Disconnect of Up PCB in ecal layer 27 Time dependent Noise Beam unstable or went off during the run

Bump pattern is observed for runs with beam aim at the wafer gap:

Double bump pattern is observed for run with beam aim at the wafer corner: Some events loose more energy!

Less hits in ecal last layer:

Many dead Cells and a whole dead half wafer on Ecal last layer: Plots draw from first 120k events of Run

Low energy noise: Amplitude for corresponding Layer in Longitudinal profile in hit increases a lot while Longitudinal profile in energy Does not change much

For run , the Up PCB of layer 27 seems not Connect!

Time dependent noise: some layer behavior anomaly during the run ECAL Layer 10: … Layer 11: , … Layer 26: , 1134, 1173, 1175, 1065, 1246, 1221, 1251… Layer 29: … HCAL Layer 6: … Layer 13: , 1143, 1198, 1244, 1246, 1258, 1308… Layer 32: , 0461, 0475, 0590, 0606, 0733, 0808, 0826, 0853, 0937, 0947…

Noisy region could be located to a half wafer (one chip):

Or the whole PCB

Similar pattern could be observed in HCAL

Beam was quite stable during our data taking, but sometime it went off during the run:

Summary Large statistic of high-quality test beam data had been collected; Energy resolution linearity and accuracy look consistent with our last test beam data result; Many new noisy pattern observed and requires carefully treatment

Back Up

Funny pattern: Summer students change the beam file

Run : large noise in both ecal and hcal, beam off during the run;

Run : Many Noise Cells in Ecal;