Components and Smart Machines Micro-Nano Surface Embedded Sensors COSMOS-II Components and Smart Machines with Micro-Nano Surface Embedded Sensors Kristian Martinsen SINTEF Raufoss Manufacturing

The vision Create intelligent surfaces of the future Added value in products trough enhanced properties and new functions

COSMOS Improved interaction between human and machines trough more information Smart products with embedded sensors to improve safety, quality, performance and lifetime Increase productivity trough process monitoring, breakdown avoidance, increased process and product knowledge

The team Acreo : Cleanroom, microstructuring, sensor design SINTEF : Cleanroom (MiNaLab) Sensor design UiO: ALD VTT : ALD, Tribology, coating tests Danish Technological Institute : CVD and PVD Coatings RTIM: Materials and manufacturing technology, Polishing, Industrial partners: Finland: Picodeon ltd. Oy Denmark: Sauer-Danfoss Sweden:Microplast AB Norway: Raufoss Industrial Tools AS Plasto AS Raufoss technology AS Nammo raufoss AS

Facts: NMP FP7 ERA-NET project Each country have national funding under the ERA-NET umbrella In Norway: The Norwegian Research Council with 2920 KNOK, Industrial in-kind: 4380 KNOK From beginning of 2008 to end of 2010

Examples of possible utilization of embedded sensors Valves with build in temperature and/or pressure sensors under anti-corrosive coating Pumps or rotors with build in pressure sensors Axels and bearings with low-friction DLC with embedded temperature sensor Extrusion/molding forms with temprature and pressure sensors Interactive and intelligent tools and machines

From passive to active coatings, patents

Basic Concept Wear-resistant coating Electric insulator Sensor material Substrate

Cross-disciplinary task Sensor design and technology Coating technology 3D microstructurization Interface: Wiring and electronics Sensor test Coating test Polishing, surface texture Industrial Testing and verification Industrial application design Surface embedded sensors

Coatings Coating technologies PVD CVD Other technologies Reactive Sputter Evaporation CVD Plasma ass. CVD Atomic layer CVD Other technologies Relevant Coating Materials TiN CrN DLC Al2O3 Borides, carbides Other materials

Physical Vapor Deposition Evaporative deposition - The material to be deposited is heated to a high vapor pressure by electrically resistive heating in "low" vacuum Electron beam physical vapor deposition - The material to be deposited is heated to a high vapor pressure by electron bombardment in "high" vacuum. Sputter deposition - Glow plasma discharge bombards the material sputtering some away as a vapor Cathodic Arc Deposition - In which a high power arc directed at the target material blasts away some into a vapor Pulsed laser deposition - In which a high power laser ablates material from the target into a vapor

Dual magnetron sputtering Al in Ar/O2 MF-Power

Reaktive sputtering of Al in Ar/O2 Disappearing Anode: Anoderne bliver belagt med insulator materiale Katoderne forbliver selv rengjort til en vis grænse Power

CrN/TiN multilayer TiN 22 layers of TiN/CrN CrN FIB-SEM Pia Wahlberg og Leif Højslet Christensen

TiAlN + + N2/Ar = + + N2/Ar = + + N2/Ar = Ti Al ”AlN”/”TiN” ”TiAlN” plasma = ”TiAlN” mix + + N2/Ar plasma = Ti ”TiAlN”/”TiN” + + N2/Ar plasma = 40cm x 40cm x 40cm

Plasma Assisted Chemical Vapour Deposition of Si3N4 3 SiCl4(g) + 2 N2(g) + 6 H2(g)  Si3N4(s) + 12 HCl(g) (450-550°C + plasma)

Atomic Layer Deposition (ALD) Gas phase chemical depostion Based on surface reactions which makes achieving atomic scale deposition control possible As fine as ~ 0.1 ångstroms per monolayer ALD grown films are conformal, pin-hole free, and chemically bonded to the substrate. With ALD it is possible to deposit coatings perfectly uniform in thickness inside deep trenches, porous media The coating range is usually 1-500 nm

ALD/ALCVD coating technologies Atom layer deposition (ALD) See http://www.planar.com/advantages/innovation/docs/Planar_ALD_Background.pdf

DLC coating technologies PACVD (r.f. plasma) for hydrogenated DLC Titanium Carbon Argon H2 or CH4 Pump coated object Pulsed arc for DLC (ta-C) deposition Arc source for Ti deposition r.f. power Vacuum arc deposition for hydrogen-free DLC Hydrocarbon gas EB gun

Other Deposition Techniques e-beam assisted evaporation (Pt, Au…) Stamps: imprinting, nano-imprint CSD-Chemical solution deposition (Dip- coating, electrochemical plating) (Plasma) Spray-coating

Basic Concept Wear-resistant coating Electric insulator Sensor material Substrate

Sensors embedded under wear-resistant coatings CVD DLC CrNxCy-layer Embedded Sensor Substrate

Substrate Wear-resistant coating Electric insulator Sensor material

Substrate requirements Surface roughness is an important issue: Higher roughness means ticher layors 1 micron seems to be a pratcical/economical optimum The materials used must be compatible with a high vacuum environment and withstand the deposition temperatures of the process desired  Materials that outgas in the vacuum chamber present a problem for coating   Proper adhesion of the coating requires a pristine surface of the part no foreign materials no oxidation on the part

Substrate Not 2D but 3D Not Si - Austenitisk, Ferritisk and Martensitisk steel Duplex steel (austenitisk-feritisk) AISI316L, Sverker 21 or HSS Cupper based Mouldmax Aluminum based alloys Surface finish Directly from machining Polished mechanically or electrochemically

insulator Wear-resistant coating Electric insulator Sensor material Substrate

Electric insulating coatings Dual magnetron AlN Dual Magnetron Al2O3 PVD Al2O3-Cr2O3 multilayer-systems PECVD Si3N4 Atomic Layer Deposition of Al2O3 and TiO2 Non conductive IBAD-DLC Non conductive multilayers of ac:H DLC

Insulator:. Si3N4 at DTI. Al2O3 at DTI. ac DLC at VTT. ALD at Planar Insulator: Si3N4 at DTI Al2O3 at DTI ac DLC at VTT ALD at Planar ALD at Sintef Wear resistant coating Insulator, 2 Insulator, 1 Substrate

Examples of isolating coatings

Plasma Assisted Chemical Vapour Deposition of Si3N4 AFM Roughness like Si LASER diffraction Dust particles

On a smooth surface…

Sputter vs ALD W1: Al2O3, 4 µm, Sputter W3: Al2O3, 0.5 µm, ALD

Sensors and wireing Wear-resistant coating Electric insulator Sensor material Substrate

Sensor Design Resistive temperature sensors Thermocouples Capacitive pressure sensors Twin arc pressure sensors VTT sensor device Test patterns Wiring Contact pads/terminals

Patterning techniques Photolithography 1:1 contact lithography Stepper lithography Shadow mask Direct write Electron beam lithography Laser writing Nanoimprint ECPR – ElectroChemical Pattern Replication

Photolithography (a) (b) (c) (d) (e) (f) Substrate Substrate Substrate

Deposit Sensor Material Metal Isolation Substrate Substrate Substrate (a) (b) (c) Substrate Substrate Substrate (d) (e) (f)

Photo Resist (a) (b) (c) (d) (e) (f) Photo Resist Substrate Substrate

Exposure (a) (b) (c) (d) (e) (f) UV light Mask Substrate Substrate

Development (a) (b) (c) (d) (e) (f) Substrate Substrate Substrate Patterned Photo Resist Substrate Substrate Substrate (d) (e) (f)

Etch (a) (b) (c) (d) (e) (f) Substrate Substrate Substrate Etch Metal

Strip (a) (b) (c) (d) (e) (f) Substrate Substrate Substrate Strip Photo Resist Substrate Substrate Substrate (d) (e) (f)

Requirements Flat surface Fit into lithography tools (a) (b) (c) (d) Substrate Substrate Substrate (a) (b) (c) Flat surface Fit into lithography tools Substrate Substrate Substrate (d) (e) (f)

photolithography – shadow mask

Shadow mask Direct patterning with shadow mask One step process (a) Deposit metal Shadow mask Patterned structures Isolation Substrate Substrate Substrate (a) (b) (c) Direct patterning with shadow mask One step process

Flexible Steel Foil Standard technology Attached to substrate Screen printing lito Etched holes Attached to substrate with magnets Holder 80 µm thick Flexible. Follows surface Bendable in 1 dimension Min feature size 150 µm

Etched metal mask

Patterned metal disc

Advanced shadow mask HiCoFlex (15 µm polyimide film) Pattern trough holes  Flexible shadow mask Flexible sensor

Advanced shadow mask Can be placed on non-flat surfaces Axles Moulds Other

Flex mask system

Real buried temperature sensors

Wear restiant coating Wear-resistant coating Electric insulator Sensor material Substrate DLC, TiN, ….

Diamond-like carbon (DLC) Various forms of C-H alloys presented in a ternary phase diagram DLC is a metastable form of amorphous carbon DLC films have a mixed sp3/ sp2 structure with different sp3 and sp2 proportions depending on deposition technique and parameters

Diamond like Carbon as a pressure sensor Metal Ion beam

Industrial Demonstrators Surface embedded temperature sensor on a flat surface on a 3D object Embedded temperature sensor on a 3D surface on a 3D object The cylinder for de-forming of injection moulded plastics components Surface embedded temperature sensor on metal forming tool – Both hot and cold forming

Demo 1

Demo 2

Demo 3 Forging tool for compression of aluminum

Hot forging Temperature distribution on the surface as forged. Max temperature - approx. 540°C

Hot forging Surface pressure against upper die as forged. Maximum pressure - about 100MPa

Cold forming Temperature distribution on the surface as forged. Max temperature - approx. 110°C.

Cold forming Surface pressure against upper die as forged Maximum pressure - about 350MPa

The sensor mounting solution