Mar 24 th, 2016 Inorganic Material Chemistry. Gas phase physical deposition 1.Sputtering deposition 2.Evaporation 3.Plasma deposition.

Slides:



Advertisements
Similar presentations
FABRICATION PROCESSES
Advertisements

Dept. of Chemistry, SCSVMV University
Thin-Film Evaporation Process
Ch.1 Introduction Optoelectronic devices: - devices deal with interaction of electronic and optical processes Solid-state physics: - study of solids, through.
For the exclusive use of adopters of the book Introduction to Microelectronic Fabrication, Second Edition by Richard C. Jaeger. ISBN © 2002.
Another “Periodic” Table!. Growth Techniques Ch. 1, Sect. 2, YC Czochralski Method (LEC) (Bulk Crystals) –Dash Technique –Bridgeman Method Chemical Vapor.
Atomic Layer Deposition (ALD)
Effect of Environmental Gas on the Growth of CNT in Catalystically Pyrolyzing C 2 H 2 Minjae Jung*, Kwang Yong Eun, Y.-J. Baik, K.-R. Lee, J-K. Shin* and.
Chemical Vapor Deposition ( CVD). Chemical vapour deposition (CVD) synthesis is achieved by putting a carbon source in the gas phase and using an energy.
The Deposition Process

Physical Vapor Deposition
INTEGRATED CIRCUITS Dr. Esam Yosry Lec. #5.
Thin Film Deposition Prof. Dr. Ir. Djoko Hartanto MSc
S. Kugler: Lectures on Amorhous Semiconductors 1 Preparation.
Film Deposition in IC Fabrication
Chemical Vapor Deposition This presentation is partially animated. Only use the control panel at the bottom of screen to review what you have seen. When.
McGill Nanotools Microfabrication Processes
Lecture 12.0 Deposition. Materials Deposited Dielectrics –SiO2, BSG Metals –W, Cu, Al Semiconductors –Poly silicon (doped) Barrier Layers –Nitrides (TaN,
Nanostructure Formation: 1-D
반도체 제작 공정 재료공정실험실 동아대학교 신소재공학과 손 광 석 隨處作主立處開眞
Plasma-Enhanced Chemical Vapor Deposition (PECVD)
MOCVD Basics & Applications
Carrier Mobility and Velocity
M.H.Nemati Sabanci University
PVD AND CVD PROCESS Muhammed Labeeb.
Comparative study of processes for CdTe and CIGS thin-film solar cell technologies 5070 term paper presentation FENG Zhuoqun Dec. 3, 2014.
Crystal Growth Techniques
SEMINAR ON IC FABRICATION MD.ASLAM ADM NO:05-125,ETC/2008.
English ability would save life English ability gives you opportunities e.g. Job opening in TSMC
Epitaxial Deposition Daniel Lentz EE 518 Penn State University March 29, 2007 Instructor: Dr. J. Ruzyllo.
Reminders Quiz#2 and meet Alissa and Mine on Wednesday –Quiz covers Bonding, 0-D, 1-D, 2-D, Lab #2 –Multiple choice, short answer, long answer (graphical.
NANO PHYSICS Unit-6 Sub: Engineering Physics By: Pankaj Sorathiya.
BY KRISHNAN.P Chemical Vapour Deposition (CVD) is a chemical process used to produce high purity, high performance solid materials. In a typical.
Nanotechnology Ninad Mehendale.
Thin Film Deposition. Types of Thin Films Used in Semiconductor Processing Thermal Oxides Dielectric Layers Epitaxial Layers Polycrystalline Silicon Metal.
2-D Nanostructure Synthesis (Making THIN FILMS!)
Atomic layer deposition Chengcheng Li 2013/6/27. What is ALD ALD (Atomic Layer Deposition) Deposition method by which precursor gases or vapors are alternately.
THREE ATOMS THICK SEMICONDUCTING FILM How It’s Made “Using a technique called metal organic chemical vapor deposition. Already used widely in industry,
Presented by: -Priyasi Singh -Pooja Singh
CHEMICAL VAPOUR DEPOSITION & PHYSICAL VAPOUR DEPOSITION
Section 5: Thin Film Deposition part 1 : sputtering and evaporation
Glass surface modification by coating deposition
Optical Waveguide Fabrications Jules Billuart & Leo Norilo & Kasperi Kylmänen.
Thin Film Deposition. 고려대학교 MNB Sensor Lab 61 고려대학교 MNB Sensor Lab 62  Thin Films Used in the Fabrication of IC and MEMS Devices A large variety of.
Solid State Synthesis Czochralski Method
Solution State Synthesis
ALD coating of porous materials and powders
Deposition Techniques
Why MOCVD and GaAs nanowires?
Thin Film Deposition Processes
Lecture 3: Semiconductor Epitaxy Technologies (II) and
Jari Koskinen, Sami Franssila
Lecture 4 Fundamentals of Multiscale Fabrication
PVD & CVD Process Mr. Sonaji V. Gayakwad Asst. professor
Another “Periodic” Table!
Chemical Vapour Deposition (CVD)
Chapter 5 Plasma and Ion Beam Processing of Thin Films
Corial 200R 11/17/2018 Simplicity, performance, and upgradability in a system designed for R&D environments RIE capabilities over a variety of materials.
1.6 Magnetron Sputtering Perpendicular Electric Magnetic Fields.
2. Chemical Vapor Deposition (CVD)
Deposition 27 and 29 March 2017 Evaporation Chemical Vapor Deposition (CVD) Plasma-Enhanced Chemical Vapor Deposition (PECVD) Metal Organometallic CVD.
Lecture 12.0 Deposition.
Thermal oxidation Growth Rate
IC AND NEMS/MEMS PROCESSES
Lecture 3: Semiconductor Epitaxy Technologies (II) and
Metal Organic Chemical Vapour Deposition
Epitaxial Deposition
Deposition Techniques 5 and 8 April 2019
Deposition 30 March And 1 April 2016
Presentation transcript:

Mar 24 th, 2016 Inorganic Material Chemistry

Gas phase physical deposition 1.Sputtering deposition 2.Evaporation 3.Plasma deposition

1. Sputtering deposition ■ Principle & Process - High-power laser beam strikes a target, and then vaporized target (ablation plume) deposits onto substrate as thin film (Sputtering) ■ Usages & Applications -Thin film of complex compounds with complicated stoichiometry (YBCO, ceramics, etc.) ■ Characteristics Advantages -Stoichiometry of a target can be reproduced on substrate (deposits almost any materials) Drawbacks - Requires ultra high vacuum -Possibility of incorporating impurities -Uneven coverage (Line-of-sight). Ag nanoparticles deposited on substrate Y 2 O 3 doped ZrO 2

2. Evaporation ■ Principle & Process - Solid metal source is thermally evaporated into vapor, and it deposits on the substrate. ■ Usages & Applications - Wide variety of thin films (semiconductors, metals, solar cells, etc.) ■ Characteristics Advantages -Deposits almost any materials -Low contamination Drawbacks -Undesired polycrystalline layers -Difficult to evaporate materials with low vapor pressure or high melting point. Thermally deposited metallic NPs

■ Principle & Process - Discharge electrode excites the reactant gas into a plasma, charged ions strikes target on the cathode, and then vaporized target (ablation plume) deposits onto substrate as thin film (sputtering). ■ Usages & Applications -Thin film of complex compounds with complicated stoichiometry (TiN, TiAlN, CrN, ZrN, AlCrTiN, TiAlSiN.) ■ Characteristics -Deposits almost any materials (metallic, ceramic) 3. Plasma deposition TiAlSiN Precursor: Pure metals (Cr, Ti) and AlSi alloy Rh nanoparticles Precursor: Pure Rh metal

Chemical vapor deposition (CVD) 1.Thermal enhanced CVD 2.Laser enhanced CVD 3.Plasma enhanced CVD 4.Chemical beam epitaxy

1. Thermal CVD ■ Principle & Process - Heat energy is supplied to activate required source and gas-solid phase reaction. ■ Usages & Applications - Thin films (Metal oxide, metal sulfide, silicon, various semiconductors, etc.) ■ Characteristics Advantages -High quality product -Simple reactor -Large-scale synthesis Drawbacks -Large quantity carrier gas in need -Hard to detach the product from substrate Graphene Precursor: CH 4 + H 2 Gas

2. Laser-assisted CVD ■ Principle & Process - Chemical reaction of source gas takes place at the spot on the substrate under laser irradiation. ■ Usages & Applications - Thin rod and fibers. (Si, C, B, Al, etc.) ■ Characteristics - Control of directionality Carbon nanotube Precursor: C 2 H 4 Catalyst: FePrecursor: SiH 4 Silicon wire

3. Plasma enhanced CVD ■ Principle & Process - Discharge electrode excites the reactant gas into a plasma (ionized gas), which induces a chemical reaction and results in the reaction product being deposited on the substrate. ■ Usages & Applications - High quality silicon complex thin film (SiO x, SiN x, amorphous silicon, dopant) ■ Characteristics Advantages: -Lower temperature( °C) processes compared to conventional CVD (Less damages to sample, good when temperature is restricted) -Fast deposition -High step coverage (High quality) Drawbacks -Toxic byproduct gas -High cost Silicon nanoparticles Precursor: SiH 4 Deposition of SiO 2 Precursor: SiH 4, N 2 O, N 2

4. Chemical beam epitaxy ■ Principle & Process -Reactants are molecular beam of reactive gases, typically as hydride or metalorganic. -Molecular beam (alkyl beam) carries metal atoms. Decomposition happens on the substrate for metal to compose layered structure on the substrate. ■ Usages & Applications -Semiconductor films (GaAs, InP, Si 1-x Ge x, etc.) -Heterostructures (GaAs/InGaAs films) -Carbon doped semiconductors (p-type GaAs) ■ Characteristics Advantages -Low growth temperature -Uniform film coverage Drawbacks -Requires ultra high vacuum ( ~ ) -High carbon contamination Precursor: AsH 3, (C 2 H 5 ) 3 Ga