Ultra-fast differential front-end electronics

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Presentation transcript:

Ultra-fast differential front-end electronics Detectors as signal generators ~ Overview Low Z vs High Z Front-End Electronics (FEE), Differential vs. single ended FEE, Preliminary design & measurements G. Pascovici, IKP-Cologne, FEE Meeting, Saclay, 04 Dec. 2008

Front-end electronics – overview Detector as a fast signal generator  electron-hole pairs collection  only electrons (or particles) Front-end Electronics preamplifier preamplifiers & shapers & comparators test system cooling and grounding Main requirements: gain (sensibility), dynamic range (directly and/or ToT), S/N, rise/fall time and/or counting rates, crosstalk, EMI, EMC, power consumption etc. G. Pascovici, IKP-Cologne, FEE Meeting, Saclay, 04 Dec. 2008

Detector Signal Collection Circuit High Z Impedance adaptation Amplitude resolution Time resolution Noise cut Low Z Voltage source + Zo Rp Z - Low Z T Francis ANGHINOLFI ELEC-2005 Electronics in High Energy Physics Winter Term: Introduction to electronics in HEP Quo vadis ? Low Z output voltage source circuit can drive any load Output signal shape adapted to subsequent stage (ADC) Signal shaping is used to reduce noise (unwanted fluctuations) vs. signal

Front-end electronics – overview Detector as fast signal generator  electron-hole pairs collection  only electrons (or particles) Z + - Detector Rp if Z is high charge is kept on capacitor nodes and voltage builds up (until capacitor is discharged) Advantages: - excellent E resolution - friendly pulse shape analysis Disadvantages: - channel-to-channel crosstalk - pile up above 40 k c.p.s. - sensitivity to e.m.c. FEE (Input stage) G. Pascovici, IKP-Cologne, FEE Meeting, Saclay, 04 Dec. 2008

Front-end electronics – overview Detector as fast signal generator  electron-hole pairs collection  only electrons (or particles) Z + - Detector Rp if Z is low charge flows as a current through the impedance in a short time. Advantages: - limited signal pile up - limited channel-to-channel crosstalk - low sensitivity to parasitic signals - good timing resolution Disadvantages: - pour signal/noise ratio FEE (Input stage) G. Pascovici, IKP-Cologne, FEE Meeting, Saclay, 04 Dec. 2008

MRCP detectors for LHC

Front-end electronics – overview Detector as fast signal generator  electron-hole pairs collection  only electrons (or particles) if Z is low charge flows as a current through the impedance in a short time. Advantages: - limited signal pile up - limited channel-to-channel crosstalk - low sensitivity to parasitic signals - good timing resolution Disadvantages: - pour signal/noise ratio Single ended structure

Front-end electronics – overview Specifications: Fully differential transimpedance 0.18µm standard CMOS techn. 10 GHz bandwidth dynamic range 25 µA -2.5 mA power consumption 88mW (2V)

Charge Sensitive Preamplifier Active Integrator (“Charge Sensitive (Pre)Amplifier”) Input impedance very high ( i.e. NO signal current flows into amplifier), Cf (Rf) feedback capacitor (resistor) between output and input, very large equivalent dynamic capacitance, sensitivity A(q) ~ q / Cf, large open loop gain Ao ~ 10,000 - 150,000 Ci ~ “dynamic” input capacitance Rf G. Pascovici, IKP-Cologne, FEE Meeting, Saclay, 04 Dec. 2008

Standard Charge Sensitive preamplifiers developed at IKP Cologne et al. Main achievements: low noise, fast preamplifiers (segmented HP-GE & DSSSD) clean transfer function  pulse shape …(no over/under-shoots) differential outputs for HP-Ge detectors & DSSSD-Si high dynamic range highly accurate spectroscopic TOT method (up to ~200MeV) incorporated programmable pulser (50 ppm long term) cryostat wiring (cold part), crosstalk less then 10 miniature, SMD technology -3 Who are our main users? - large arrays of segmented HP-Ge detectors : Miniball (CERN), Rising (GSI), SeGa (MSU), Tigress (Triumf), AGATA (EU) - DSSD Si detectors: LuSia (Lund,GSI), Miniball@IKP, LYCCA (GSI)… G. Pascovici, IKP-Cologne, FEE Meeting, Saclay, 04 Dec. 2008

Miniball HeKo basic structure Advantages: discrete electronic components (e.g. HEMT, GaAs, SiGe) can be easily integrated, flexible open loop gain, frequency compensation vs. detector unfriendly wiring Disadvantages: to low open-loop gain larger size G. Pascovici, IKP-Cologne, FEE Meeting, Saclay, 04 Dec. 2008

Charge Sensitive Loop - basic structure LYCCA CSPs Charge Sensitive Loop - basic structure Advantages: the use of advanced current feedback operational amplifier, very fast, compact, small size, low PS Disadvantages: to large open-loop gain, limited frequency compensation vs. detector unfriendly wiring G. Pascovici, IKP-Cologne, FEE Meeting, Saclay, 04 Dec. 2008

G. Pascovici, IKP-Cologne, FEE Meeting, Saclay, 04 Dec. 2008 GALI -S66 (GSI) G. Pascovici, IKP-Cologne, FEE Meeting, Saclay, 04 Dec. 2008

AGATA Single & Dual Gain Core reworked frequency compensations internal network compensation Lead comp. (1. OpAmp) Cryostat wiring as part of the front-end electronics external network compensation - minimum Miller effect (min.) - lead compensation (min.) - lead-lag compensation (adj.) - dominant pole compensation (adj.)

LYCCA CSPs (32- channels) block diagram - basic structure Input: 68x high density flat band cable (SE*GND) Output: 32x Differential 100 Ohm*, 68x high density flat band cable x 32 channels G. Pascovici, IKP-Cologne, FEE Meeting, Saclay, 04 Dec. 2008

tr ~ 18 ns (Gain x1; Cd~10pF) LYCCA - CSPs Transfer Function a) energy channel (differential out.) tr ~ 18 ns (Gain x1; Cd~10pF) tr ~ 29 ns (Gain x3; Cd~10pF) b) up-graded time channels (also with differential outputs) tr ~ 200 pS (tentative) LYCCA CSPs 200 MeV & 4 GeV 32 channels only with energy diff. outputs or 16 channels with both, energy and ultra fast diff. outputs mean min max

Sub - nanosecond CSP GaAs – HEMT ultra-fast, narrow time output (Q1, Q2) ultra-fast, narrow time output (note: measured with existing scopes: tr ~ 500 ps, expected tr ~ 200ps !) energy output tf~10 µs (no P/Z cancellation) high counting rates timing > ~1 Mcps dominant pole compensation included low power, only +/- 6V E +/- 3V T) G. Pascovici, IKP-Cologne, FEE Meeting, Saclay, 04 Dec. 2008

LYCCA CSP modified for fast timing outputs: jFET: Bf861; BF862, HEMT: ATF-55143 Id ~ from 2mA – 10 mA

Idrain, Vdrain  to optimize the tr ~ 720 ps jFET, FET, HEMT selection a) jFET, FET BF861 (1,B,C); BF862; BF 889 b) GaAs-FETs (E-pHEMT) ATF-35143; ATF-55143; ATF-38143 Idrain, Vdrain  to optimize the noise & bandwidth characteristics (10-15 mA, 2-2.7 V, 20-30mW) Pulse generator: Tektronix PG502 modified (less than 700ps rise/fall time) Scope: Tektronix TDS 3032 (300 MHz, 2.5 GHz sampling) tr ~ 930 ps

Idrain, Vdrain  to optimize the jFET, FET, HEMT selection a) jFET, FET BF861 (1,B,C); BF862; BF 889 b) GaAs-FETs (E-pHEMT) ATF-35143; ATF-55143; ATF-38143 Idrain, Vdrain  to optimize the noise & bandwidth characteristics (10-15 mA, 2-2.7 V, 20-30mW) tr ~ 505 ps Pulse generator: Tektronix PG502 modified (less than 700ps rise/fall time) Scope: LeCroy 44Xs (400 Mhz, 2.5 GHz sampling) tr ~ 499 ps

Idrain, Vdrain  to optimize the tf ~ 498 ps jFET, FET, HEMT selection a) jFET, FET BF861 (1,B,C); BF862; BF 889 b) GaAs-FETs (E-pHEMT) ATF-35143; ATF-55143; ATF-38143 Idrain, Vdrain  to optimize the noise & bandwidth characteristics (10-15 mA, 2-2.7 V, 20-30mW) tf ~ 498 ps Pulse generator: Tektronix PG502 modified (less than 700ps rise/fall time) Scope: LeCroy 44Xs (400 Mhz, 2.5 GHz sampling) tf ~ 498 ps G. Pascovici, IKP-Cologne, FEE Meeting, Saclay, 04 Dec. 2008

position sensitive detector Read-out from a MCP + dual delay line based position sensitive detector Two mutually perpendicular delay lines * - Sobottka & Williams, IEEE Trans. NS (1988),35, p348 - Kozulin, Kondratiev et al.,Nucl.Exp.Tech., 2008 No 58, p.44-58 Preliminary design - test measurements

Read-out from a MCP-based position sensitive detector LT6411 3300V/µs 650 MHz 50-100 mW / ch. G. Pascovici, IKP-Cologne, FEE Meeting, Saclay, 04 Dec. 2008

LYCCA CSPs (32- channels) block diagram - basic structure Input: 68x high density flat band cable (SE*GND) Outputs: 32x E - differential 100 Ohm*, 68x high density flat band cable x 32 channels G. Pascovici, IKP-Cologne, FEE Meeting, Saclay, 04 Dec. 2008

LYCCA like CSPs with implemented ultra-fast differential time outputs – 16x channels Input: 68x high density flat band cable (SE*GND) Outputs: 16x [E] ch. - differential 100 Ohm*, 32E out of 68 x high density flat band cable (10µs) (a) Diff. Comp. CML, LV-PECL, LVDS (b) tf ~10ns* (opt. ~ 100ns) Outputs: 16x [T] ch. - differential 100 Ohm*, 32T out of 68x high density flat band cable x 16 channels G. Pascovici, IKP-Cologne, FEE Meeting, Saclay, 04 Dec. 2008

To be decided: - with TOT ? - with spectroscopic TOT ? - differential signals standard: PECL, NECL, CML ?

To be decided: - with TOT ? And where ? On [E] or on [T] channel ? - with spectroscopic TOT ? Or quasi spectroscopic? - differential signals standard: PECL, NECL, CML ? TOT circuitry? - requirements has to be decided ? - E or/and T ch.?

~450 mW/ch + jFET 1 or 2 stages ~60 mW/ch + jFET GaAs(HEMT) +Transimpedance preamplifier-amplifier ~450 mW/ch + jFET 1 or 2 stages GaAs(HEMT) +Si-Ge amplifier+ Si-Ge ultrafast comparator ~60 mW/ch + jFET

Potential solution with “motherboard” LYCCA architecture (8 -16 channels) Potential solution without “motherboard” Input Output architecture (2 - 4 channels) Ch1- timing Ch. 1 output Ch. 1 input Ch. 2 input Ch. 2 output Ch2- timing Advantages: very fast compact, small size low PS  (450mW/ch) Disadvantages: power consumption  in vacuum ? motherboard architecture impedance matching for UHF ? w. motherboard cooling in vacuum (~ 2D structure) no motherboard architecture impedance matching for UHF solution only for small number of channels, distribution of infrastructure signals (PS, adj.) no motherboard

Sensitivity: A(t) ~100 mV/10 fC slope: [ walk ]  dynamic range, even for constant rise/fall times CFD, ELD (extrapolated leading edge), ARC correlated 2. channel [ jitter ] intrinsic noise, intrinsic jitter noise distribution bandwidth Timing jitter Intrinsic jitter Ratio: amplifier rise time/ collection time intrinsic jitter BW[Hz] bandwidth, Nd ~spectral density noise dispersion intrinsic time resolution M. Ciobanu et al, A FEE card comprising a high-gain amplifier and a fast discriminator for TOF measurements

IE1I+IE2I

LVDS, CML differential interfaces common-mode range compared to Electronic Design, Vol.46, No.25,1988 LVDS, CML differential interfaces common-mode range compared to single-ended noise margin. The effective noise margin is 2 to 4 times better using LVDS, CML…