Date of download: 5/28/2016 Copyright © ASME. All rights reserved. From: Numerical Simulation and Parametric Study of Heat-Driven Self-Cooling of Electronic Devices J. Thermal Sci. Eng. Appl. 2015;7(1): doi: / Self-cooling concept Figure Legend:

Date of download: 5/28/2016 Copyright © ASME. All rights reserved. From: Numerical Simulation and Parametric Study of Heat-Driven Self-Cooling of Electronic Devices J. Thermal Sci. Eng. Appl. 2015;7(1): doi: / (a) BM, (b) MM, (c) sectional view AA of modified model with single stage TEGs (MMa), (d) sectional view A-A of modified model with double cascade TEGs (MMb), and (e) sectional view A-A of modified model with triple cascade (MMc) TEGs Key: (1) Hot plates, (2) heater (between hot plates), (3) spreaders, (4) TEGs, (5) main fin heat sink (Fin-m), (6) auxiliary-fin heat sink (Fin-a), and (7) fan Figure Legend:

Date of download: 5/28/2016 Copyright © ASME. All rights reserved. From: Numerical Simulation and Parametric Study of Heat-Driven Self-Cooling of Electronic Devices J. Thermal Sci. Eng. Appl. 2015;7(1): doi: / Workflow of the simulation method Figure Legend:

Date of download: 5/28/2016 Copyright © ASME. All rights reserved. From: Numerical Simulation and Parametric Study of Heat-Driven Self-Cooling of Electronic Devices J. Thermal Sci. Eng. Appl. 2015;7(1): doi: / Comparison between numerical model and experimental data by Martínez et al. [20] Figure Legend:

Date of download: 5/28/2016 Copyright © ASME. All rights reserved. From: Numerical Simulation and Parametric Study of Heat-Driven Self-Cooling of Electronic Devices J. Thermal Sci. Eng. Appl. 2015;7(1): doi: / Cooling fan performance and power consumed by the fan as a function of volume rate of air in the fan for different fin density. The subscripts 1.5, 2.1, and 2.6 represent N fin equal to 1.5 fins/cm, 2.1 fins/cm, and 2.6 fins/cm, respectively. The subscripts 4 V, 8 V, and 12 V represent the fan performance curve when the supplied voltage is equal to 4 V, 8 V, and 12 V, respectively. Figure Legend:

Date of download: 5/28/2016 Copyright © ASME. All rights reserved. From: Numerical Simulation and Parametric Study of Heat-Driven Self-Cooling of Electronic Devices J. Thermal Sci. Eng. Appl. 2015;7(1): doi: / Maximum temperature of the heated plate, Tg, and power produced by the TEG, P gen, as a function of heating power supplied to the heater. The subscripts 1.5, 2.1, and 2.6 represent N fin equal to 1.5 fins/cm, 2.1 fins/cm, and 2.6 fins/cm, respectively. Figure Legend:

Date of download: 5/28/2016 Copyright © ASME. All rights reserved. From: Numerical Simulation and Parametric Study of Heat-Driven Self-Cooling of Electronic Devices J. Thermal Sci. Eng. Appl. 2015;7(1): doi: / Cooling fan performance and power consumed by the fan as a function of volume rate of air in the fan for different H fin. The subscripts 23, 32, and 50 represent H fin equal to 23 mm, 32 mm, and 50 mm, respectively. The subscripts 4 V, 8 V, and 12 V represent the fan performance curve when the supplied voltage is equal to 4 V, 8 V, and 12 V, respectively. Figure Legend:

Date of download: 5/28/2016 Copyright © ASME. All rights reserved. From: Numerical Simulation and Parametric Study of Heat-Driven Self-Cooling of Electronic Devices J. Thermal Sci. Eng. Appl. 2015;7(1): doi: / Maximum temperature of the heated plate and power produced by the TEG, P gen, as a function of heating power supplied to the heater. The subscripts 23, 32, and 40 represent the H fin equal to 23 mm, 32 mm, and 40 mm, respectively. Figure Legend:

Date of download: 5/28/2016 Copyright © ASME. All rights reserved. From: Numerical Simulation and Parametric Study of Heat-Driven Self-Cooling of Electronic Devices J. Thermal Sci. Eng. Appl. 2015;7(1): doi: / Comparison between BM and MMa for the maximum temperature of the heated plate, Tg and power produced by the TEG, P gen, as a function of heating power supplied to the heater Figure Legend:

Date of download: 5/28/2016 Copyright © ASME. All rights reserved. From: Numerical Simulation and Parametric Study of Heat-Driven Self-Cooling of Electronic Devices J. Thermal Sci. Eng. Appl. 2015;7(1): doi: / Temperature distribution (a) BM (Max T: °C and Min T: 43.1 °C) and (b) MMa (Max T: 80.5 °C and Min T: 46.3 °C) for heating power = 230 W, N fin = 2.15 fins/cm, H fin = 23 mm Figure Legend:

Date of download: 5/28/2016 Copyright © ASME. All rights reserved. From: Numerical Simulation and Parametric Study of Heat-Driven Self-Cooling of Electronic Devices J. Thermal Sci. Eng. Appl. 2015;7(1): doi: / Maximum temperature of the heated plate, T g and power produced by the TEG, P gen as a function of heating power supplied to the heater for MMa. The subscripts 1.5, 2.1, and 2.6 represent N fin equal to 1.5 fins/cm, 2.1 fins/cm, and 2.6 fins/cm, respectively. Figure Legend:

Date of download: 5/28/2016 Copyright © ASME. All rights reserved. From: Numerical Simulation and Parametric Study of Heat-Driven Self-Cooling of Electronic Devices J. Thermal Sci. Eng. Appl. 2015;7(1): doi: / Temperature distribution for MMa model (a) N fin = 2.25 (Max T: 98 °C and Min T: 56.4 °C), (b) N fin = 3.5 (Max T: 71.1 °C and Min T: 34.1 °C), and (c) N fin = 5.2 (Max T: 53.0 °C and Min T: 20.6 °C) for heating power = 280 W and H fin = 23 mm Figure Legend:

Date of download: 5/28/2016 Copyright © ASME. All rights reserved. From: Numerical Simulation and Parametric Study of Heat-Driven Self-Cooling of Electronic Devices J. Thermal Sci. Eng. Appl. 2015;7(1): doi: / Maximum temperature of the heated plate, T g and power produced by the TEG, P gen as a function of heating power supplied to the heater for MMa, MMb, and MMc Figure Legend: