Microelectronics for HEP A. Marchioro / CERN-PH-ESE

A. Marchioro / CERN 2 Preliminary list of Participants ILC/CLIC: C. de La Taille LHC: P. Farthouat, M. Hansen France: Strasbourg, M. Winter Germany: U. Bonn, N. Wermes Italy: INFN Genova, G. Darbo Netherlands: Nikhef, R. Kluit Poland: Warsaw, W. Dabrowski Switzerland: PSI, R. Horisberger Additional info received from: A. Weber/Oxford

A. Marchioro / CERN 3 Objectives Establish information, support and coordination links between users working in the design of modern ASICs for HEP Support special needs arising in design, manufacturing, testing and integrating HEP ASICs Facilitate information exchange, avoid design duplications, avoid common mistakes Provide a specialized service to small design groups Coordinate technology access for HEP users as to allow access to advanced technologies with sufficient engineering support

A. Marchioro / CERN 4 How-to Collect requirements from users in HEP community Summarize most common needs in a series of logical objectives and establish a plan to provide them Allocate internal funds Monitor progress of internal subgroups

A. Marchioro / CERN 5 Activities 1. ASIC Technologies 2. Enabling Tools 3. Shareable IP blocks 4. Auxiliary Technologies

A. Marchioro / CERN ASIC Technologies CMOS 130 and 90 nm SiGe 180 and 130 nm Legacy: Regular 0.25  m High voltage 0.35 or 0.18  m Common MPW organization for selected technologies

A. Marchioro / CERN Enabling Tools Modern CAE tools, add-ons to Europractice tools System level simulation tools Training and education IC-Tester, wafer probing Common irradiation facilities (and procedures)

A. Marchioro / CERN 8 Tools and infrastructure example Provide a centralized “design reference” workstation(s) with up-to-date design kits, simulation models, libraries, software releases, DRC-decks etc. for external design groups with limited self-support capabilities Provide computing platforms for pre-design submission verification (example: large DRC and LVS jobs) Provide expertise for rarely used tools

A. Marchioro / CERN Shareable IP blocks Optimized and validated digital libraries Generators (memories, FIFOs, EC blocks) Commonly used interfaces: I2C, SPI etc. Commonly used standard I/O RH interfaces Timing blocks (PLL, DLL etc.) Basic analog blocks (Voltage Reference, simple ADC and DAC) ►This is a large activity and can benefit from multiple contributors

A. Marchioro / CERN Auxiliary Technologies Low cost standard packaging Standard (~200  m) and advanced (< 50  m) bump-bonding Direct Chip-to-Chip stacking Low density, two layers Advanced high density multi-layers (in which time scale?) ►This is a large activity and requires multiple contributors

A. Marchioro / CERN Auxiliary Technologies (2) What is a needed as basic services? Standard IC packaging technologies, multi- stack chips, C4. What requires collaboration with industry? Technologies already sufficiently mature (i.e. present in large volume commercial products) or close to full qualification to be used reliability in HEP What requires original R&D? Several Companies are proposing very advanced packaging technologies but when will these become realities and for whom? Lab A { Lab B { Lab C {

A. Marchioro / CERN 12 Integration facility (clean room) and sensor qualification It has been suggested to include a 4th activity under this work package: “Monitoring the R&D and later the Fabrication Process of Silicon Sensors using dedicated Test Structures” Requiring QA standards, clean room facilities, test equipment, Notwithstanding the undisputable need of this proposed activity, it seems to go beyond the scope of an “microelectronics electronics infrastructure” activity. Under which WP does this activity fit best?

A. Marchioro / CERN 13 Organization HEP wide support group Can be organized across a number of major Institutions with input from everybody This central networking activity shall concentrate on common support and common design blocks. Specific project blocks and their integration go beyond the scope of this work package. The project financing of this work package shall be to the profit of common designs and will only indirectly be to the profit of specific projects. Technical work performed under this network will be made available (with technical support) to the community at large. Interested group contact:

A. Marchioro / CERN 14 Nation-wide substructure The CERN service can become most effective if support activities are also replicated at the national level. DEUK…FRIT Central support User