Fachbereich C Physik UBW WORKSHOP, Berlin, 18. 12.2012 1 Surface roughness and field emission measurements on diamond turned Cu samples o Motivation and.

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Fachbereich C Physik UBW WORKSHOP, Berlin, Surface roughness and field emission measurements on diamond turned Cu samples o Motivation and strategy o Measurement techniques and samples o Surface quality o Field emission (FE) results o Conclusion and outlook Stefan Lagotzky, Günter Müller Berg. Universität Wuppertal Tomoko Muranaka, Sergio Calatroni CERN, Geneva

Fachbereich C Physik UBW WORKSHOP, Berlin, Motivation and strategy o Dark current/Electric Breakdown is the main field limitation of accelerating structures for CLIC (E acc =100 MV/m, E pk =243 MV/m) o Deep and quantitative understanding of the origins of breakdown processes is important o Investigation of the Cu surface quality after different fabrication procedures Strategy 1.Preparation of Cu samples with all/selected preparation steps 2.Investigation of the actual surface quality. Roughness? Cleanliness? 3.Measuring of the initial enhanced field emission (EFE, dark currents) of the samples after the preparation 4.Investigation of the EFE from single emitters. Stability? 5.High resolution SEM identification of the emitting defects (if possible) Presenting here: First results of surface quality measurements and EFE measurements

Fachbereich C Physik UBW WORKSHOP, Berlin, FE & SEM measurement techniques Field emission scanning microscope (FESM): o Regulated V(x,y) scans for FE current I =1 nA & gap ∆z  emitter density at E=U/∆z o Spatially resolved I(E) measurements of single emitters  E on, β FN, S o Ion bombardment (Ar, E ion = 0 – 5 kV) and SEM (low res.) o In-situ heat treatments up to 1000°C mbar - localisation of emitters - FE properties 500 MV/m mbar Ex-situ SEM + EDXIdentification of emitting defects Correlation of surface features to FE properties (positioning accuracy ~ ±100 µm) UBW WORKSHOP, Berlin,

Fachbereich C Physik UBW WORKSHOP, Berlin, DPG-Frühjahrstagung, Göttingen, 27. Feb o Full surface quality scans by OP: o white light irradiation and spectral reflection (chromatic aberration) o up to 20×20 cm 2 and 5 cm height difference o 2 µm (3 nm) lateral (height) resolution o further zooming by AFM: o ±2 µm precision of positioning with respect to the optical profilometer o 95x95 µm 2 scanning range o 3 (1) nm lateral (height) resolution o contact or non-contact modes o CCD camera for positioning control o granite plate with an active damping system for undisturbed nm measurement o clean laminar air flow from the back to reduce particulate contamination Optical profilometer (OP) with atomic force microscope (AFM): - surface rougness - defect geometry UBW WORKSHOP, Berlin,

Fachbereich C Physik UBW WORKSHOP, Berlin, Samples o Two flat Cu samples o Diameter: ~11 mm o One hole as mark to identify the position in different systems o Diamond turned and glued to a sample holder at CERN o Mounted to an adapter for the FESM at BUW o Surface cleaned with ionized N 2, cleanroom condition (class 100) with 5 bar pressure o Teflon protection cap to avoid damage and contaminations after polishing and cleaning o Only 1 sample measured yet Protection cap sample holder FESM adapter Investigated surface

Fachbereich C Physik UBW WORKSHOP, Berlin, Surface quality (OP) 1.Survey scan (20 µm resolution) 2.High resoultion (2µm) measurements 2x2 mm² 1x1 mm² o Few particles/scratches can be found (d ≥ 1 µm) o Ridges as result of diamond turning? o Slightly waved surface (λ~ 0,5 – 1 mm)

Fachbereich C Physik UBW WORKSHOP, Berlin, Surface quality (AFM) AFM scan of ridges o More particles (Ø = 0.6 – 3 µm) observed o Polycrystalline structure? (d grain ~ 60 nm) o Ridges: o Height h = 70 nm o Curvature radius r = 30 – 50 nm Calculation of roughness and estimation of geometric field enhancement factor for FE

Fachbereich C Physik UBW WORKSHOP, Berlin, Roughness and geometric field enhancement Surface roughness: z(x i, y j ) = actual height value of profile n, m = No. of points in x and y direction = average height value Electric field enhancement factor: h = height of defect r = curvature radius E L = local electric field on defect E S = electric field on flat surface particles / protrusions: scratch:metal-insulator-metal (MIM): → emission area

Fachbereich C Physik UBW WORKSHOP, Berlin, Surface roughness OP R a =43 nm R q =54 nm (1x1 mm²) R a =126 nm R q =145 nm (2x2 mm²) AFM R a =20 nm R q =24 nm (100x100 µm²) R a =3 nm R q =4 nm (10x10 µm²) Comparison with Nb (OP): 120 µm BCP, single crystal (JLAB) R a =126 nm, R q =165 nm, (1x1 mm²) 40 µm BCP, single crystal (DESY) R a =57 nm, R q =77 nm, (1x1 mm²) 100 µm EP, polycrystalline R a =518 nm, R q =646 nm, (0,5x0,5 mm²) Even without electrochemical polishing: very flat surface!

Fachbereich C Physik UBW WORKSHOP, Berlin, Estimation of β geo for particulets H=113nm R ≤ 94nm → β ≥ 3.7 H=207nm R ≤ 94nm → β ≥ 4.7 H=107nm R ≤ 94nm → β ≥ 3.6 o Many particles: H 2.5 o Only low values for β geo o What about polycrystalline structure?

Fachbereich C Physik UBW WORKSHOP, Berlin, Estimation of β geo for grain boundaries H = 33 nm R ≤ 10nm β ≥ 5.8 o Grain boundaries: slightly higher β geo o Altogether only low β values o At which field EFE sets in? Modified Fowler-Nordheim (FN) law With β = 5,8: 1 nA/µm² at ~500 MV/m (Φ=4,4 eV)

Fachbereich C Physik UBW WORKSHOP, Berlin, Regulated E(x,y) maps for I = 1 nA, ∆z ≈ 50 µm of the same area FESM results 130 MV/m 160 MV/m 190 MV/m o EFE starts at 130MV/m and not 500MV/m o Emitter density increases exponentially with field o Activated emitters: E act =(1,2 – 1,4)∙E on →2nd measurement: shifted to lower fields E on = 120 MV/m Possible explanations: o Surface oxide o adsorbates

Fachbereich C Physik UBW WORKSHOP, Berlin, → activation by burning of conducting channels: MIV Switch-on state persists! for a long period without E under UHV at RT → permanent formation of conducting channels [1] Ambient oxide layer Nb Insulator MIM Nb (1) Nb surface oxide:  ad- or desorption lead to enhancement or reduction of field  resonance tunneling can occur: [2] (2) Adsorbates: Impact for cavities:  Heating or rf power ? [4] activate emitters (3) Reduction of isolating Nb 2 O 5 layer by heat treatment [3]: [1] R. V. Latham, “High vacuum insulation,” (1995) [2] J. D. Jarvis, et al. IFEL 2010, WEPB46 (2010) [3] T. Proslier et.al. Appl. Phys. Let., 93, (2008) [4] J. W. Wang, et al. SLAC-PUB-7684 (1997) o Enhance MIM-activation of particles o Enhance MIV-activation or surface defects Nb 2 O 5 natural (~5nm) isolating NbO 2 semiconducting NbO metalic Heating of a Nb surface can activate EFE FE due to oxides and adsorbates

Fachbereich C Physik UBW WORKSHOP, Berlin, o Field calibrated via U(z) o β and S: Calculation from FN-law o Local measurements of the strongest emitters Local measurements of a typical emitter on Cu FN-plot E on (1nA)=118MV/m

Fachbereich C Physik UBW WORKSHOP, Berlin, Sample size Anode size o Strong fluctuation of EFE o Fit for FN law reflects nearly const. current range o But: FN analysis provides impossible S values o Random current switching and S values of single emitters cannot only be described by FN law. o Influence of surface oxides and adsorbates is important, too (MIM and MIV). Results of β and S of strongest emitters

Fachbereich C Physik UBW WORKSHOP, Berlin, SEM correlations Emitter 1 Emitter 2 Emitter 4 Too many surface features and particles near the emission sites →Impossible to give a clear correlation →Surface features = inclusions after diamond turning? Damage layer?

Fachbereich C Physik UBW WORKSHOP, Berlin, Conclusions: o The Cu surface is very flat (even after diamond turning) o Remaining particulates and grains revealed the highest β geo (≥ 5.8) o EFE sets in between 120MV/m and 130 MV/m, earlier than expected from β geo o EFE from single emitter: very unstable with impossible values of S o Emission cannot be described by FN-law, but other mechanism are involved o No correlation to SEM images, too many particulates and surface features →Electrochemical polishing and Dry Ice Cleaning (DIC) of the surface should improve the EFE of the samples Outlook: o Measuring additional samples with the same fabrication o Measuring samples after the standard CLIC manufacturing procedure (diamond turning, slight chemical etching, vacuum firing in H2 atmosphere) o Installing a DIC system at the BUW and application to Cu samples Conclusions and Outlook