MAGNESIUM THIXOMOLDING DESIGN GUIDE ( v 1.0)

THIXOMOLDING PROCESS 1. Mg Dry Chips Fall Into Barrel Melt Chips Melting Begins AZ91D Magnesium Chips 1. Mg Dry Chips Fall Into Barrel 2. Screw Conveys Material Down Barrel Magnesium Chips 3. Heater Bands + Mechanical Screw add Energy to Material 1000-1100 F Melt Check Ring Semi-Solid “Slush” 4. Melting Material Driven Forward As Screw Returns 5. “Slush” In front of Check Ring Pushed Out Into Tool Cavity 6. New Cycle Begins

MAGNESIUM TXM PART CANDIDATES UTILIZE CURRENT TOOL Parkway-TPS Group Magnesium VOLUME CURRENT PART STIFFNESS STRENGTH PLASTIC CAST METAL SHEET METAL COMPOSITE CERAMIC REDESIGN NEW TOOL Parkway-TPS Group Magnesium NEW DESIGN Parkway-TPS Group Magnesium DESIGN FOR THIXOMOLDING

Designing for Magnesium TXM L w t Mg Stiffness Advantage = E Mg x I Part E Mg x t Part = E Current x I Part E Current x t Part 3 Mg Strength Advantage = s Mg x t Part s Current x t Part 2 Mg Weight vs Current = (L x W x t ) Part x Density Mg (L x W x t ) Part x Density Current MATERIAL PROPERTIES & PART GEOMETRY DELIVER VALUE

Converting Plastic to Magnesium TXM (ELECTRONIC HOUSING EXAMPLE) Design Example #1 : ELECTRONIC / ELECTRICAL HOUSING Current Material : 30% Carbon-filled PC Key Customer Requirements (KCR’s) Stiffness Strength (Bending & Impact) Shielding Heat Dissipation Appearance Light Weight Thin Wall Dimensional Stability Recyclability Cost L w t

KEY MECHANICAL PROPERTIES w t Redesigned to Match Stiffness Mg Nominal Wall = .77x Plastic Wall

(ELECTRONIC HOUSING EXAMPLE) (Carbon Filled, Metal Filled) w t EMI / RFI SHIELDING (ELECTRONIC HOUSING EXAMPLE) 120 100 80 60 40 20 Mg TXM DS Plating Metal Liners Metal Liners Vac. Met Ag Paint Note : Material Price only, may require plating, vacuum metallization, etc. SS Plating SHIELDING EFFECTIVENESS ( dB ) Ni/Cu Paint Inherently Shielding (Carbon Filled, Metal Filled) Plastics $1 $2 $3 $ 4 $11 $12 $13 Shielding Costs - $/ft ² of Coverage INHERENT, HIGH-LEVEL SHIELDING AT THINNER NOMINAL WALL

HEAT MANAGEMENT MOST EFFECTIVE HEAT MANAGEMENT (ELECTRONIC HOUSING EXAMPLE) L w t High Thermal Conductivity = Fast Heat Transfer Low Volumetric Specific Heat = Efficient Heat Dissipation High “Heat Deflection” Temperature = Operating Margin MOST EFFECTIVE HEAT MANAGEMENT

ADDITIONAL Mg TXM BENEFITS (ELECTRONIC HOUSING EXAMPLE) DIMENSIONAL STABILITY: MOLDED TO TIGHTER TOLERANCES LOWER THERMAL EXPANSION STABLE DIMENSIONS - unaffected by moisture, chemicals, etc. NO FLATNESS DISTORTION - minimal residual stress IMPROVED SURFACE FINISH: PAINTING, COATING, ETC. METHODS WELL-ESTABLISHED LOW C.T.E. IMPROVES COATING LIFE STABILITY OF SUPPLY: GLOBAL CAPACITY INCREASING UNLIMITED SUPPLY STABLE PRICING - not linked to oil commodity price ENVIRONMENTAL CONFORMANCE: ELIMINATION OF PLATING PROCESS & V.O.C.s “BLUE ANGEL” COMPLIANT IMMEDIATELY RECYCLABLE - no separation processes req. PERCEPTION OF “HIGH-TECH” METALLIC QUALITY

KEY CUSTOMER REQUIREMENTS SCORECARD KCR Mg TXM PLASTIC Stiffness X Strength (Bending & Impact) X Shielding Effectiveness X Operating Temperature X Heat Dissipation X Appearance X X Surface Finish X Light Weight X Thin Wall X Dimensional Stability X Recyclable X Overall Cost X Environmental Issues X Design Confidence X Customer Perception X L w t

DESIGNING WITH MAGNESIUM TXM (HEAT SINK EXAMPLE) Design Example #2: HEAT SINK - AUTOMOTIVE New Design: Material & Process Selections Open Key Customer Requirements (KCRs) Efficient Heat Transfer High Volume Manufacture @ Low Cost Durability Light Weight (No Wasted Weight)

HEAT TRANSFER BASICS HEAT SINK “COLD” BODY NEARBY HEAT SOURCE CONVECTION & RADIATION Dissipate / Remove Heat from Heat Sink into Surroundings to Protect “Cold” Body Q = h A ( Tsink - Tair ) Efficiency: Surface Area In Contact with Air (A) Maximum Surface Area / Volume Ratio Low Density Material CONDUCTION Move Heat Away Thru Heat Sink Q = K A (dT / dx) Efficiency: Thermal Conductivity (K) Contact with Heat Source (A) MATERIAL & GEOMETRY GEOMETRY

HEAT SINK DESIGN KEYS MAXIMIZE THERMAL CONDUCTIVITY: MATERIAL MAXIMIZE SURFACE AREA CONTACT TO HEAT SOURCE: DESIGN & PROCESS MAXIMIZE (SURFACE AREA / VOLUME) RATIO IN FINS: DESIGN & PROCESS MINIMIZE WEIGHT: MATERIAL & PROCESS MINIMIZE COST: MATERIAL & PROCESS

VOLUMETRIC THERMAL CONDUCTIVITY (Thermal Cond / Matl Density) HEAT SINK DESIGN VOLUMETRIC THERMAL CONDUCTIVITY (Thermal Cond / Matl Density) Why Thixomolded Magnesium ? Mg: High Thermal Conductivity per unit weight Mg: Lowest Density of Materials Considered Mg: Rigidity & Durability TXM: Complex Designs Manufacturable TXM: Thin Walls & Fins (t = .020") TXM: Thin Walls = Lightweight TXM: No Voids, Dross, Process Defects to Maximize Material Thermal Properties TXM: Cost-Effective High-Volume Process MATERIAL DENSITY OPTIMUM COMBINATION OF DESIGN, MATERIAL & PROCESS

GENERAL DESIGN BENEFITS