The new MEG tracker Marco Grassi INFN - Pisa Overview Timescale Tasks Funding
Selected technology We selected the following detector single volume gaseous detector cylindrical shape with longitudinal wires U–V stereo for hit positioning along the chamber axis low mass gas ( He : iC 4 H 10 – 85:15 most probable) thin wires and small cell size Tentative goals Single hit resolution ~130 m in r Momentum resolution ~130KeV Angular resolution ~5 mrad DC-TC matching eff. ~ 90 % Referee - 15 Mar 20132
Pictorial view of Positron Spectrometer Not shown: COBRA Tracker Mechanics Tracker electronics Referee - 15 Mar 20133
Key elements Benefit from past experience and know how similar chambers were already successfully operated for many years new assembly technique has been defined and proved Use or reuse of existing infrastructures Work in parallel PSI INFN Lecce INFN Roma INFN Pisa Referee - 15 Mar 20134
Personal comments The schedule is tight no room for long R&D Multi - institutions project responsibilities & Tasks subdivision frequent meetings Kick-off meeting in Lecce Weekly phone meeting Robust system avoid technical challenges if not absolutely necessary put extra safety margin Referee - 15 Mar 20135
Schedule and Milestones Prototypes Short prototypes for hit resolution (Rome, Lecce) Si telescope for high precision tracking (Pisa) Simple prototype for ageing (Pisa) Long prototype to validate wire selection and mounting (Pisa) “complex” prototype for validation of construction procedure (Lecce) Mechanical prototype to compare End-Plates structures (Lecce, Pisa) Referee - 15 Mar 20136
Next year commitments Referee - 15 Mar 20137
Full schedule Referee - 15 Mar Internal milestones 10/2013 end of prototyping phase and end-plate design completion 06/2014 ready for assembly 04/2015 shipment to PSI contingency 06-09/2015 start of test run
COST Referee - 15 Mar 20139
Task: prototypes Referee - 15 Mar Existing prototypes Single hit resolution Rome 8x8 chamber Lecce “tritubo” Lecce “large chamber” (Mu2e) Ageing Pisa prototype Mounting procedure Lecce “large chamber” (Mu2e) FE electronics Single and 6 channels differential Other prototypes Charge division Wire type and cell stability Full length simple prototype End-plate structure Mechanical prototypes FE electronics Single ended with cabling HV system Electronics vs commercial vs PSI solutions Final mounting procedure Single ended with cabling Several prototypes dedicated to answer specific questions
geometry prototypes constraints Tasks Referee - 15 Mar material simulation reconstruction performances end plates support structure gas vol. integration target assembling procedures mounting tools wiring tools assembly survey electronics cabling completion installation Gas system commissioning HV system monitor chamber PSI Lecce Rome/Pisa/Lecce Pisa/PSI Lecce/BINP Rome Pisa/Lecce all Pi/Le/Rm Pisa/Lecce Psi/Rome Rome Pisa PSI/Rome Pisa
Use of specific tools Referee - 15 Mar
Use of specific tools Referee - 15 Mar
Timing summary Referee - 15 Mar TaskStartcompletion GeometriaOra06/2013 Assembly procedureOra06/2013 End plate design05/201310/2013 Support struct. design05/201312/2013 Material procurement10/201306/2014 Mounting tool10/201306/2014 Wiring tool10/201306/2014 Assembly06/201402/2015 Laboratory test02/201504/2015 Integration at PSI05/201506/2015 Contingency06/201509/2015
Richieste per Marzo Fase critica: dall’approvazione all’estate 2013 Dettagli delle soluzioni tecniche finali Uso di semplici prototipi specifici su alcuni aspetti Prototipo finale Richieste di assegnazioni finanziarie limitate per la fase critica. Dettagli secondo la lettera inviata Referee - 15 Mar
Parte finanziaria Referee - 15 Mar
Parte finanziaria Referee - 15 Mar
Dettagli Pisa Referee - 15 Mar Prototipi corti Invecchiamento Fili argentati0.5 kE Materiali2.0 kE Gas alto flusso1.5 kE Tritubo per guadagno e monitor Costruzione2.0 kE Prototipi lungo semplice Stabilità cella Divisione di carica Struttura 2.0 kE End plate2.0 kE Volume gas2.0 kE Consumo2.0 kE Prototipo endplate Possibile alternativa endplate bsaeline Materiale 1.0 kE Lavorazione2.0 kE PCB1.0 kE