Sensors and Bump Bonding Outlook 2008

Fadmar Osmić – NA62 GTK Meeting, January 29, Sensors Layout of the sensor wafer needed for the demonstrator chip –Foreseen one mask-set which contains 1 large sensor (60 x 27) surrounded by demonstrator-like sensors Discussion with ITC-irst planned for spring –First ideas on the layout –Guard ring designs –Pre-bumping testability (bias-grid, all-al, …)? Estimated Costs –Total costs (mask+1batch) ~40kCHF

Fadmar Osmić – NA62 GTK Meeting, January 29, Bump-Bonding Meeting with VTT for first discussion –Hopefully possible mid February (week 8) at CERN - tbc Discussion topics: Development of the FC Bonding technique of the GTK demonstrator –Reminder: No thinning needed Problem: no full size wafers (MPW), standard FC-technique not available!!! –Timescale: this year  technique necessary for the demonstrator beginning 2009 –Two options suggested by VTT Gold-wire stud bonding with epoxy (VTT Oulu) single ball placement (German company) –Topology (where should the contact pad be located in each pixel) and acceptable pad-size should be clarified before the discussion –Costs ???