GEM activities at LZU Xiaodong Wang ( 王晓冬 ) 09,25,2013
Preparation of the drift cathode and PCB Simulation of the triple GEMs based on ansys and Garfield++ Next work …… test Outline The 2 th online meeting about GEM actives process
A : B =10:4 mass ratio A B Araldite , AY103-1/HY991 Arrange two micron mylar film coated aluminum at the tension device
We used 2 kg force to stretch the foil as a mirror And then, we placed the drift board with the Araldite glue at the tension device
Put the Lead blocks at the drift board. in order to the foil bonding strongly Wait time: ………24hours Cut into small pieces
We used a blank board (2mm) bonding at pcb in order to avoid gas leakage. Because we put some via holes in the PCB. Problem : Too much glue lead it to leakage. Next step we have to improve skill
Two electrons drift and induce an avalanche effect in the holes Triple standard GEMs filed solution map by ANSYS