Innovative products Innovative technologies

Business area

Production options Surface Mount Technology Through-hole technology Productivity: 15 stands for manual assembly Specialities:  PoP assembling  Long PCB’s assembling  Flex PCB’s assembling  Heavy board handling  BGA reballing 2 SMT lines: JUKI, ERSA, EKRA

Technical options Stencil manufacturing PCB depaneling Tape and die cutting service Selective conformal coating Tape & Reel packaging Hot bar soldering

Our role in the project Optimised desoldering process for thermal-stress-minimized disassembly – tests in an industrial enviroment (Task 4.1) Re-work of desoldered components (Task 4.2): remove excessive solder and/or remaining underfiller prepare surfaces for optimal resoldering, apply new solder balls implementation of the process in adapted and newly developed equipment ensuring ESD protection throughout the remanufacturing process elaboration of methods of marking and packing of components Reuse of components in new devices (Task 4.3)

About SEMICON Ltd. Since 1987: almost 30 years of experience 65 employees Main quarter 43/43a Zwolenska Str. Warsaw, Poland Industry segments: Automotive Defense Medical Consumer electronics Lighting Telecom Power industry Production department 71a Ezopa Str. Warsaw, Poland ISO and AQUAP Certificates: ISO 9001:2008 ISO 14001:2004 AQAP 2110:2010 Main East-European laser modules manufacturer Compliance to RoHS and IPC

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