STMicroelectronics PARALLEL ARCHITECTURE PROCESSES FOR MEMS, MEMORIES, IMAGE SENSORS AND OTHERS 3D SYSTEMS  Ubaldo Mastromatteo* STMicroelectronics, Via Tolomeo 1, Cornaredo (MI)  VIPS Workshop – Pavia 22 April 2010

Outline Integrating functions in a module IP’s Through silicon interconnections Applications examples VIPS Workshop – Pavia 22 April 2010

Electronic System Partitioning Bipolar, BCD, CMOS, BiCMOS, VIP Power Management Information Processing (Superintegration) Multifunction Peripheral (System Oriented Tech.) Data Acquisition and Conversion Bipolar, CMOS, RF-BiCMOS, µ-Machinery Central Processing (µP, DSP) Digital CMOS Power Actuators Bipolar, BCD, CMOS, HVCMOS, VIP, µ-Machinery, Memories CMOS, Flash, DRAM, µ-Machinery Mains, Batteries, Alternators, Solar Cells Sensors Antennas Keyboards Line Interfaces Switches Lamps Motors Displays Solenoids Loudspeakers CRTs Inkjets VIPS Workshop – Pavia 22 April 2010

MEMS/PDI PA Module VIPS Workshop – Pavia 22 April 2010

Flip Module Sensor VIPS Workshop – Pavia 22 April 2010

Wafer to Wafer Bonding VIPS Workshop – Pavia 22 April 2010

Vertical Integration VIPS Workshop – Pavia 22 April 2010

IP Award Dear Ubaldo, Congratulations! Your U.S. Patent No. 7,227,213, titled "Process for Manufacturing a Through Insulated Interconnection in a Body of Semiconductor Material" has been selected to receive this year's Exceptional Patent Award - Category B. As you know, innovation is crucial for the wellbeing of the Company and all of its stakeholders, and you can be very proud of your contribution. Every year, a number of external legal and technical experts attend our Intellectual Property and Licensing Group's Annual Worldwide Patent Committee Meeting to review all of the Company's US patents granted the preceding year. The experts evaluate the technical and legal strengths of the patents and vote on the best patents. Your patent is among the select few patents chosen by our experts to receive this year's awards. …………………………….. Again, my congratulations and sincere appreciation for your hard work. Your contribution will help ST in our patent and technology licensing efforts to maintain our competitive edge in the marketplace. Best regards, Lisa K. Jorgenson Group Vice President Intellectual Property & Licensing (sent ) VIPS Workshop – Pavia 22 April 2010

Complete ARS Chip Stator Wafer Emitter Wafer Media R/W electronics Emitter electronics UHV seal thru-wafer vias Rotor Wafer VIPS Workshop – Pavia 22 April 2010

FEEDTHROUGH ETCH Rotor process VIPS Workshop – Pavia 22 April 2010

FEEDTHROUGH ISOLATION Rotor process VIPS Workshop – Pavia 22 April 2010

BACKSIDE BONDING ALIGNMENT MARKS Rotor process VIPS Workshop – Pavia 22 April 2010

OXIDE ON EPIPOLY ETCH Rotor process VIPS Workshop – Pavia 22 April 2010

ROTOR WAFER THINNING ROTOR WAFER THINNING Rotor + Stator process VIPS Workshop – Pavia 22 April 2010

High Voltage Feedthroughs High Voltage Feedthrough Bottom Wafer Top Wafer BottomWafer TopWafer 100µm High Voltage Pads Oxide Filled Trench Wafers Gap = 2µm VIPS Workshop – Pavia 22 April 2010

Types of vias interconnections VIPS Workshop – Pavia 22 April 2010

Optical sensors cameras evolution VIPS Workshop – Pavia 22 April 2010

Wafer Level Package VIPS Workshop – Pavia 22 April 2010

1) Conductive through vias VIPS Workshop – Pavia 22 April 2010

2) On silicon camera process Connected to I/Os VIPS Workshop – Pavia 22 April 2010

3) Glass sealing VIPS Workshop – Pavia 22 April 2010

4) Wafer Backgrinding / Polishing VIPS Workshop – Pavia 22 April 2010

5) Back metal contacts VIPS Workshop – Pavia 22 April 2010

6) IR Coating VIPS Workshop – Pavia 22 April 2010

7) Singulation VIPS Workshop – Pavia 22 April 2010

WAFER LEVEL CAMERA - ST Process - MINIMUM SIZE - SEALING IN CLASS VERY ACCURATE DIMENSIONS VIPS Workshop – Pavia 22 April 2010

Glue (dry film) Onto Silicon Glass (with IR) VIPS Workshop – Pavia 22 April 2010

GLASS ATTACHMENT Glass Silicon wafer holes VIPS Workshop – Pavia 22 April 2010

BOTTOM VIEW BALL ATTACHMENT ON WAFER VIPS Workshop – Pavia 22 April 2010

TOP VIEW BOTTOM VIEW AFTER SINGULATION VIPS Workshop – Pavia 22 April 2010

Wafer Scale Module with Lens Solder balls Silicon Top glass IR Extra Glass Diaphragm Hemispherical lens Wafer Level Package VIPS Workshop – Pavia 22 April 2010

Microactuator 3D view Cap: H293 mask 150 (Ring) Microactuator body: H293 mask 930 (MotorTrench) Basement pillars: H294 mask 930 (Trench) Interconnections: H294 mask 500 (Poly Runner) Gold metal for head: H293 mask 960 (RW Anch) Head Substrate Through vias VIPS Workshop – Pavia 22 April 2010

Microactuator 3D exploded view Cap: H293 mask 150 (Ring) Microactuator body: H293 mask 930 (MotorTrench) Interconnection pillars: H294 mask 930 (Trench) Anchor Cap/micoractuator: H293 mask 700 (RotorAnch) Interconnections: H294 mask 500 (Poly Runner) Anchor Microactuator/basement: H294 mask 920 (Cr/Pd) Gold metal for head: H293 mask 960 (RW Anch) VIPS Workshop – Pavia 22 April 2010

H293+H294 - Step #12 – Cap release 2 nd sacrificial oxide etch Vias perno H293 H294 Metallic flexure StatorRotor Mobile cap Align marks DeviceWafer Edge VIPS Workshop – Pavia 22 April 2010

Intelligent Interconnections VIPS Workshop – Pavia 22 April 2010

Stacking memories VIPS Workshop – Pavia 22 April 2010

Thank you for the attention VIPS Workshop – Pavia 22 April 2010