Date of download: 5/30/2016 Copyright © 2016 SPIE. All rights reserved. SEM images of TiO 2 /SiO 2, after etching in ICP-RIE for 15 min with (a) Al mask.

Slides:



Advertisements
Similar presentations
Date of download: 5/28/2016 Copyright © 2016 SPIE. All rights reserved. SEM images of (a) one-level piston MMA, (b) one-level tilt MMA, and (c) two-level.
Advertisements

Date of download: 5/28/2016 Copyright © 2016 SPIE. All rights reserved. Diagrammatic representation of the eyeball model showing location of the main optical.
Date of download: 5/29/2016 Copyright © 2016 SPIE. All rights reserved. Setup for mask diffraction analysis. The upper bold arrow indicates the illumination.
Date of download: 5/29/2016 Copyright © 2016 SPIE. All rights reserved. Schematics of the water-immersible scanning mirror design: (a) side view and (b)
Date of download: 5/30/2016 Copyright © 2016 SPIE. All rights reserved. Scheme of the experimental setup: 1-guided-vane pump; 2-fine ceramic porous filter;
Date of download: 5/30/2016 Copyright © 2016 SPIE. All rights reserved. Working principle of the immersion schemes: (a) focusing in air, (b) focusing through.
Date of download: 5/30/2016 Copyright © 2016 SPIE. All rights reserved. The stages of the SU-8 process along with their interdependence and effect on final.
Date of download: 5/31/2016 Copyright © 2016 SPIE. All rights reserved. (a) Schematic of printhead (Picojet) and (b) its computational domain. Figure Legend:
Date of download: 5/31/2016 Copyright © 2016 SPIE. All rights reserved. Design of the multisite elongated neural microelectrode array showing the recording.
Date of download: 5/31/2016 Copyright © 2016 SPIE. All rights reserved. Immersion lithography relies on the insertion of a high-refractive-index liquid.
Date of download: 6/1/2016 Copyright © 2016 SPIE. All rights reserved. (a) The schematic diagram and (b) the photograph of the graphene saturable absorber.
Date of download: 6/1/2016 Copyright © 2016 SPIE. All rights reserved. Schematic of the electrochemical micromachining process. Figure Legend: From: Modeling.
Date of download: 6/1/2016 Copyright © 2016 SPIE. All rights reserved. Main processes for surface micromachining of an InP-based FP cavity structure: (a)
Date of download: 6/2/2016 Copyright © 2016 SPIE. All rights reserved. (a) Lerdemo line edge detection (black lines) of top-down CDSEM image. (b) Height-height.
Date of download: 6/3/2016 Copyright © 2016 SPIE. All rights reserved. (a) The working principle of the tilt-beam CD-SEM. The feature of interest is imaged.
Date of download: 6/3/2016 Copyright © ASME. All rights reserved. NO x Sensor Ammonia-Cross-Sensitivity Factor Estimation in Diesel Engine Selective Catalytic.
Date of download: 6/3/2016 Copyright © ASME. All rights reserved. From: Porous Silicon Morphology: Photo-Electrochemically Etched by Different Laser Wavelengths.
Date of download: 6/3/2016 Copyright © 2016 SPIE. All rights reserved. Overlay budget analysis of gate layer for sub-60-nm memory device. Scanner contributions.
Date of download: 6/6/2016 Copyright © 2016 SPIE. All rights reserved. Sample data showing the importance of including a leading multiplier in the cost.
Date of download: 6/9/2016 Copyright © 2016 SPIE. All rights reserved. Process flow chart of the trilevel resist system using the polysilazane on the spin-on.
Date of download: 6/21/2016 Copyright © 2016 SPIE. All rights reserved. Typical SiO2 microneedles with (a) circular tip and (b) triangular tip additionally.
Date of download: 6/21/2016 Copyright © 2016 SPIE. All rights reserved. (a) Traditional simplified lithographic system showing components considered in.
Date of download: 6/21/2016 Copyright © 2016 SPIE. All rights reserved. The aerial image intensity profile of eight model terms for a typical pattern.
Date of download: 6/22/2016 Copyright © 2016 SPIE. All rights reserved. The schematic of FBAW filters structure. Figure Legend: From: Development of 2.4-GHz.
Date of download: 6/22/2016 Copyright © 2016 SPIE. All rights reserved. Flowchart for the proposed unified unimodal biometric system. Figure Legend: From:
Date of download: 6/23/2016 Copyright © 2016 SPIE. All rights reserved. (a) Scanning electron microscopy (SEM) picture of an 8-μm-radius microdisk resonator.
Date of download: 6/24/2016 Copyright © 2016 SPIE. All rights reserved. Bragg mirror with PSCLC and quarter-wave plate. Figure Legend: From: Asymmetric.
Date of download: 6/25/2016 Copyright © ASME. All rights reserved. From: The Effect of Gas Models on Compressor Efficiency Including Uncertainty J. Eng.
Date of download: 6/25/2016 Copyright © 2016 SPIE. All rights reserved. Photograph (top) and structure (bottom) of the transmitter module. Figure Legend:
Date of download: 6/25/2016 Copyright © 2016 SPIE. All rights reserved. Transmission loss compensation by reducing absorber CD. Figure Legend: From: Throughput.
Date of download: 6/26/2016 Copyright © 2016 SPIE. All rights reserved. Schematic of the planar probe in the (a) flat and (b) folded configurations. Figure.
Date of download: 6/29/2016 Copyright © 2016 SPIE. All rights reserved. Illustration of optimum D-S combinations. Figure Legend: From: In situ measurement.
Date of download: 6/29/2016 Copyright © 2016 SPIE. All rights reserved. Experimental SEM images of an ArF-photoresist pattern. The images are 2000 nm long.
Date of download: 7/1/2016 Copyright © 2016 SPIE. All rights reserved. Schematic view of the layered structure of the fabricated cantilever device. Figure.
Date of download: 7/1/2016 Copyright © 2016 SPIE. All rights reserved. Process of repair and postrepair treatment. Figure Legend: From: Evaluation of multilayer.
Date of download: 7/2/2016 Copyright © 2016 SPIE. All rights reserved. BWS of PCF-BGs-liquids as temperature changes from −15°C to 65°C. Figure Legend:
Date of download: 7/2/2016 Copyright © 2016 SPIE. All rights reserved. Structure of the EFPI sensor head. Figure Legend: From: Fiber temperature sensor.
Date of download: 7/2/2016 Copyright © 2016 SPIE. All rights reserved. Fragmentation-based hotspot signature extraction. (a) Layout patterns and the Hanan.
Date of download: 7/6/2016 Copyright © 2016 SPIE. All rights reserved. X-ray diffraction (XRD) 2θ-ω scans around (00·2) reflection for InxGa1−xN layers.
Date of download: 7/6/2016 Copyright © 2016 SPIE. All rights reserved. Inital PAG density taken as input for the PEB simulation compared to the underlying.
Date of download: 7/7/2016 Copyright © 2016 SPIE. All rights reserved. Left: Cropped top-down SEM-CD images for 1st, 2nd, 4th, and 100th captured image.
Date of download: 7/7/2016 Copyright © 2016 SPIE. All rights reserved. Schematic of RIE system: (a) capacitive coupled plasma (CCP) RIE, and (b) inductive.
Date of download: 7/8/2016 Copyright © 2016 SPIE. All rights reserved. Points are the nominal spot locations on the calibration standard and the test specimen.
Date of download: 7/8/2016 Copyright © 2016 SPIE. All rights reserved. Resist loss observed for narrow lines caused by the leakage of light into dark mask.
Date of download: 7/8/2016 Copyright © 2016 SPIE. All rights reserved. Schematic of the barometric pressure sensor. Figure Legend: From: Complementary.
Date of download: 7/8/2016 Copyright © 2016 SPIE. All rights reserved. Cross section of capacitor TEG. Figure Legend: From: Dielectric-thickness dependence.
Date of download: 7/8/2016 Copyright © 2016 SPIE. All rights reserved. Cross section of MOS capacitor TEG. Figure Legend: From: Evaluation of damage induced.
Date of download: 7/9/2016 Copyright © 2016 SPIE. All rights reserved. Schematic diagram of magnetic fields and their sensing on a tooth of an electric.
Date of download: 7/9/2016 Copyright © 2016 SPIE. All rights reserved. Schematics of a 2-θ angular scatterometry configuration. Figure Legend: From: Physical.
Date of download: 7/10/2016 Copyright © 2016 SPIE. All rights reserved. Optical proximity correction. Figure Legend: From: Optical proximity correction.
Date of download: 7/11/2016 Copyright © 2016 SPIE. All rights reserved. (a) Schematic of the proposed Fabry–Pérot (FP) cavity with curved surfaces. The.
Date of download: 7/11/2016 Copyright © 2016 SPIE. All rights reserved. In extreme ultraviolet lithography (EUVL), the leakage of the EUV light in the.
Date of download: 9/16/2016 Copyright © 2016 SPIE. All rights reserved. Typical thin film heads (TFH) process comparison with typical semiconductor processes.
Date of download: 9/17/2016 Copyright © 2016 SPIE. All rights reserved. Talbot self-imaging effect with monochromatic (a) and broadband (b) radiation.
Date of download: 9/17/2016 Copyright © 2016 SPIE. All rights reserved. Photograph of phase II prototype system. Figure Legend: From: High dynamic range.
Date of download: 9/17/2016 Copyright © 2016 SPIE. All rights reserved. (a) Schematic definition of line edge roughness (LER) and line width roughness.
Date of download: 9/18/2016 Copyright © 2016 SPIE. All rights reserved. Schematic overview of impact of low-k1 on pattern fidelity. Figure Legend: From:
Date of download: 9/19/2016 Copyright © 2016 SPIE. All rights reserved. The average protection level is shown with a solid line (averaged over y−z plane.
Date of download: 11/12/2016 Copyright © 2016 SPIE. All rights reserved. A sketch of a micro four-point probe with integrated CNTs in situ grown from nickel.
Date of download: 11/12/2016 Copyright © 2016 SPIE. All rights reserved. (a) A close-up SEM of a rotary comb actuated device. The innermost and outermost.
Date of download: 10/7/2017 Copyright © ASME. All rights reserved.
Date of download: 10/15/2017 Copyright © ASME. All rights reserved.
From: Statistics for optimal point prediction in natural images
Date of download: 10/21/2017 Copyright © ASME. All rights reserved.
From: Light Activated Shape Memory Polymer Characterization
From: Optimal Test Selection for Prediction Uncertainty Reduction
Date of download: 11/3/2017 Copyright © ASME. All rights reserved.
Date of download: 12/17/2017 Copyright © ASME. All rights reserved.
Date of download: 12/28/2017 Copyright © ASME. All rights reserved.
Effects of Tensile Stress on the Corrosion Rate of Magnesium1
Presentation transcript:

Date of download: 5/30/2016 Copyright © 2016 SPIE. All rights reserved. SEM images of TiO 2 /SiO 2, after etching in ICP-RIE for 15 min with (a) Al mask and (b) Cr mask. Figure Legend: Characterization of dry etching of TiO 2 /SiO 2 distributed Bragg reflectors for tunable optical sensor arrays J. Micro/Nanolith. MEMS MOEMS. 2010;9(4): doi: /

Date of download: 5/30/2016 Copyright © 2016 SPIE. All rights reserved. Etch rates and selectivities (a) as a function of RF power, at fixed 500 W ICP power, and (b) as a function of ICP power at fixed 300 W RF power. Etch condition: Ar/SF 6 = 20/10 sccm, 20°C, 10 mTorr. ITO etch masks were used. Circles represent the selectivity, rectangles represent the etch rate, and triangles represent the dc bias. Figure Legend: Characterization of dry etching of TiO 2 /SiO 2 distributed Bragg reflectors for tunable optical sensor arrays J. Micro/Nanolith. MEMS MOEMS. 2010;9(4): doi: /

Date of download: 5/30/2016 Copyright © 2016 SPIE. All rights reserved. SEM image of the etched mirror at etch temperature of 20°C, pressure of 10 mTorr (a) at 1500 W ICP/300 WRF, Ar/SF 6 : 20/10 sccm, (b) at 500 W ICP/300 W RF, Ar/SF 6 :20/10 sccm, (c) at 500 W ICP/150 W RF, Ar/SF 6 : 20/10 sccm, (d) at 500 W ICP/250 W RF, Ar/SF 6 : 20/10 sccm, (e) at 500 W ICP/300 W RF, Ar/SF 6 : 20/20 sccm, and (f) at 500 W ICP/300 W RF, Ar/SF 6 : 10/10 sccm. Figure Legend: Characterization of dry etching of TiO 2 /SiO 2 distributed Bragg reflectors for tunable optical sensor arrays J. Micro/Nanolith. MEMS MOEMS. 2010;9(4): doi: /

Date of download: 5/30/2016 Copyright © 2016 SPIE. All rights reserved. Etch rates and selectivities as a function of (a) varied SF 6, at fixed 20 sccm of Ar and (b) varied Ar, at fixed 10 sccm of SF 6 gas flow rate. ITO etch masks were used. Circles represent the selectivity, and rectangles represent the etch rate. Figure Legend: Characterization of dry etching of TiO 2 /SiO 2 distributed Bragg reflectors for tunable optical sensor arrays J. Micro/Nanolith. MEMS MOEMS. 2010;9(4): doi: /

Date of download: 5/30/2016 Copyright © 2016 SPIE. All rights reserved. Etch rates and selectivities (a) as a function of the process pressure, and (b) as a function of the temperature. Etch conditions: 500 W ICP/300 W RF, Ar/SF 6 : 20/10 sccm. ITO etch masks were used. Circles represent the selectivity, and rectangles represent the etch rate. Figure Legend: Characterization of dry etching of TiO 2 /SiO 2 distributed Bragg reflectors for tunable optical sensor arrays J. Micro/Nanolith. MEMS MOEMS. 2010;9(4): doi: /

Date of download: 5/30/2016 Copyright © 2016 SPIE. All rights reserved. SEM images show the etched mirrors. Etch conditions: Ar/SF 6 : 20/10 sccm, 500 W ICP/300 W RF, 6 mTorr (a) at −30°C, residue was observed on the sidewall, etch rate of ∼ 70 nm/min; (b) at 20°C with etch rate of 80 nm/min, and (c) at 40°C with etch rate of ∼ 90 nm/min. ITO masks were used. Figure Legend: Characterization of dry etching of TiO 2 /SiO 2 distributed Bragg reflectors for tunable optical sensor arrays J. Micro/Nanolith. MEMS MOEMS. 2010;9(4): doi: /

Date of download: 5/30/2016 Copyright © 2016 SPIE. All rights reserved. SEM image shows the sidewall of the mirror. The WLI images plot the filter structure with four suspensions. Ra (average roughness) of the structure measured by WLI was approximately 1–10 nm. Etch conditions: 250 W RF/500 W ICP, 20°C, Ar/SF 6 : 10/10 sccm. AZnLoF2070 5:1 was used as the etch mask. Figure Legend: Characterization of dry etching of TiO 2 /SiO 2 distributed Bragg reflectors for tunable optical sensor arrays J. Micro/Nanolith. MEMS MOEMS. 2010;9(4): doi: /

Date of download: 5/30/2016 Copyright © 2016 SPIE. All rights reserved. Optical transmission spectrum of a filter structure, for three cavity layers, with transmittance of up to 90% and a FWHM of <3 nm. The sample was measured by microscope spectrometer. Figure Legend: Characterization of dry etching of TiO 2 /SiO 2 distributed Bragg reflectors for tunable optical sensor arrays J. Micro/Nanolith. MEMS MOEMS. 2010;9(4): doi: /