Date of download: 5/30/2016 Copyright © 2016 SPIE. All rights reserved. The stages of the SU-8 process along with their interdependence and effect on final structure characteristics. Figure Legend: From: Accurate layer thickness control and planarization for multilayer SU-8 structures J. Micro/Nanolith. MEMS MOEMS. 2011;10(1): doi: /

Date of download: 5/30/2016 Copyright © 2016 SPIE. All rights reserved. The standard process flow for a multilayer SU-8 structure, and that with mechanical lapping and polishing stages. Figure Legend: From: Accurate layer thickness control and planarization for multilayer SU-8 structures J. Micro/Nanolith. MEMS MOEMS. 2011;10(1): doi: /

Date of download: 5/30/2016 Copyright © 2016 SPIE. All rights reserved. (a) SEM showing expansion of lower layers of a five layer structure (fifth layer not shown), and (b) comparison showing reduction of expansion. Figure Legend: From: Accurate layer thickness control and planarization for multilayer SU-8 structures J. Micro/Nanolith. MEMS MOEMS. 2011;10(1): doi: /

Date of download: 5/30/2016 Copyright © 2016 SPIE. All rights reserved. Layout of the structures measured to establish resist thickness across the substrate. Figure Legend: From: Accurate layer thickness control and planarization for multilayer SU-8 structures J. Micro/Nanolith. MEMS MOEMS. 2011;10(1): doi: /

Date of download: 5/30/2016 Copyright © 2016 SPIE. All rights reserved. Thickness measurements taken at five points on the sample during the lapping process: (a) using P1200 grit SiC lapping paper and (b) using P2500 SiC lapping paper. Figure Legend: From: Accurate layer thickness control and planarization for multilayer SU-8 structures J. Micro/Nanolith. MEMS MOEMS. 2011;10(1): doi: /

Date of download: 5/30/2016 Copyright © 2016 SPIE. All rights reserved. SEM of (a) dimples in the final structure due to an uneven surface after the lapping of the previous layer and (b) comparing polished and unpolished surfaces of a finished three-layer structure (layers 2 and 3 shown). Figure Legend: From: Accurate layer thickness control and planarization for multilayer SU-8 structures J. Micro/Nanolith. MEMS MOEMS. 2011;10(1): doi: /

Date of download: 5/30/2016 Copyright © 2016 SPIE. All rights reserved. SPMs results showing surface of crosslinked SU-8 after (a) lapping with P1200 paper (rms surface roughness = 170 nm), (b) followed with 10 min polishing with a 1 μm alumina suspension (rms surface roughness = 30 nm), (c) followed with a further 30 min polishing with a 0.05 μm suspension (rms surface roughness = 10 nm), and (d) surface of crosslinked SU-8 with no lapping or polishing stage (rms surface roughness is below resolution of measurement equipment). Please note different scale for each. Figure Legend: From: Accurate layer thickness control and planarization for multilayer SU-8 structures J. Micro/Nanolith. MEMS MOEMS. 2011;10(1): doi: /

Date of download: 5/30/2016 Copyright © 2016 SPIE. All rights reserved. SEMs of multilayer SU structures fabricated using the described techniques: (a) three and (b) two layer structures, (c)–(e) five-layer structure, and (f) four layer structure forming part of a millimeter-wave filter (Ref. ). Figure Legend: From: Accurate layer thickness control and planarization for multilayer SU-8 structures J. Micro/Nanolith. MEMS MOEMS. 2011;10(1): doi: /