1 PFP IPDR 2010/6/ Particles and Fields Package (PFP) Instrument Preliminary Design Review SWEA David L. Mitchell Paul Turin Ellen Taylor (with many contributions from CESR)

2 PFP IPDR 2010/6/ CESR / UCB-SSL Collaboration CESR, Toulouse Analyzer MCP Anode HVPS SSL, Berkeley Pedestal Digital / FPGA LVPS (same as for STEREO SWEA)

3 PFP IPDR 2010/6/ SWEA Team – SSL David L. Mitchell (Instrument Lead) Paul Turin (Mechanical) Ellen Taylor (Electrical) Chris Smith (Thermal) –with support from John Hawk at NASA-GSFC Dorothy Gordon (FPGA) Peter Harvey (FSW [PFDPU]) Peter Berg, Selda Heavner (Power Supplies) Tim Quinn (GSE) Steve Marker (Facilities) Kate Harps, Jim Keenan, Misty Willer (Purchasing, Contracts)

4 PFP IPDR 2010/6/ Christian Mazelle (Lead CoI) Jean-Jacques Thocaven (PM, Electronics) Jean-André Sauvaud, Dominique Toublanc (CoIs) Andrei Fedorov (Detector simulations, Calibrations) Jean Rouzaud (Mechanics, Environmental tests) Claude Aoustin (CESR Technical Manager) Philippe Rouger (Electronics) Eric Lecomte (Integration, Coating) Qiu Mei Lee (Documentation) David Moirin BTS Industrie (Quality Assurance) Marc Bouyé OMP (Thermal) CNES can bring expertise on request (components, EMC…) SWEA Team – CESR

5 PFP IPDR 2010/6/ SWEA Documentation Performance Requirements –MAVEN-PM-RQMT-0005, Mission Requirements (Level 2) –MAVEN-PFIS-RQMT-0016, PFP Requirements (Level 3) –MAVEN-PF-SWEA-002, SWEA Specification (Level 4) Differences from STEREO SWEA –SWEA_STEREOtoMAVENChanges Interface Documents –MAVEN-PF-SWEA-001I_CESRtoSSLICD (analyzer to pedestal) –MAV-SWE-ICD-001 SWEA MICD (pedestal to spacecraft) –MAVEN_PF_SYS_0xx, PFP interfaces and specifications Environments –MAVEN-SYS-RQMT-0010 (Environmental Requirements Document) –MAVEN_ESC_specification (electrostatic cleanliness) Software –MAVEN_PF_FSW_002 –MAVEN_PF_SWEA_012A_FPGA_Specification (Level 5)

6 PFP IPDR 2010/6/ SWEA Peer Reviews Analyzer/Front-end peer review at CESR, February 3-4 –Actions and responses discussed in this presentation: Analyzer, Front-end Electronics (Mitchell, Turin) –Actions and responses discussed in other presentations: Thermal (Smith) Digital/LVPS peer review at UCB/SSL, May –Actions and responses discussed in other presentations: Digital/FPGA (Taylor, Gordon) Power Converter (Berg) Flight Software (Harvey)

7 PFP IPDR 2010/6/ SWEA Science David L. Mitchell June 15, 2010

8 PFP IPDR 2010/6/ : Solar Wind Electrons Baseline: MAVEN shall determine flux and velocity distributions of solar wind, magnetosheath and ionospheric electrons from eV with an energy resolution sufficient to distinguish ionospheric photoelectrons from solar wind electrons and ability to resolve magnetic cusp horizontal spatial scales. Better than 30 o angular resolution; better than 20% energy resolution. Rationale: Electron energy-distribution measurements determine the electron impact ionization rates, allow distinction to be made between the different regions created by solar-wind interactions with the upper atmosphere, determine magnetic topology near magnetic cusps, and constrain behavior of auroral electrons. MAVEN Level 1 Requirements

9 PFP IPDR 2010/6/ SWEA Science Goals Magnetic Topology & Plasma Regime Crustal Magnetospheres/Cusps Draped Field Lines o o o

10 PFP IPDR 2010/6/ SWEA Science Goals Electron Impact Ionization Magnetic Pileup Region Ionosphere MGS MAG/ER

11 PFP IPDR 2010/6/ Photo-ionization of CO 2 by solar 304 Å Escape associated with heavy ions (M> 16) 2.35 R M Shadow PEBESCAPE MPB h -electrons R (MSO) X (MSO) Mars Express SWEA Science Goals

12 PFP IPDR 2010/6/ REQUIREMENTSWEA DESIGN PF65: SWEA shall measure energy fluxes from 10 4 to 10 8 eV/cm 2 -sec-ster-eV Compliance. SWEA designed to measure energy fluxes from 10 3 to 10 9 eV/cm 2 -sec-ster-eV. PF66: SWEA shall have a geometric factor > cm 2 - ster Compliance. Geometric factor from simulations and laboratory calibrations of STEREO SWEA yield a geometric factor of 0.01 cm 2 -ster. PF67: SWEA shall measure electrons from 10 – 1000 eVCompliance. SWEA analyzer range is 5 eV to 6 keV, with full deflections up to 1.6 keV. PF68: SWEA shall have energy resolution dE/E of at least 25% Compliance. SWEA designed with an energy resolution of 18%, which can be adjusted down to 9% for energies below 50 eV. PF69: SWEA shall have time resolution of at least 20 seconds Compliance. SWEA completes a full analyzer and deflector sweep cycle in 2 seconds. SWEA bit rate supports 4-second resolution in ionosphere mode. PF70: SWEA shall have angular resolution of at least 45 degrees Compliance. SWEA design provides 22.5-degree resolution in azimuth, and better than 14 degree resolution in elevation. PF71: SWEA shall have a FOV which covers at least 50% of the sky Compliance. SWEA FOV (360 o x 130 o ) covers 90% of the sky, minus spacecraft blockage, for energies up to 1.6 keV. PF Level 3 Requirements

13 PFP IPDR 2010/6/ SWEA Data Products FPGA provides a single science data product to the PFDPU –Counts per accumulation interval for each of the 16 anodes (as a function of analyzer and deflector sweeps) –Complete measurement sequence takes 2 seconds. PFDPU computes three data products, with cadence depending on altitude Solar Wind Mode altitude > 500 km 544 bps Energy spectra every 16 sec Pitch angle distr. every sec 3D distributions every 64 sec Ionosphere Mode altitude < 500 km 1216 bps Energy spectra every 4 sec Pitch angle distr. every 4-8 sec 3D distributions every 64 sec

14 PFP IPDR 2010/6/ SWEA Resources SWEA Mass ComponentCBE (kg) Electrostatic analyzer0.703 MCP+Anode board0.070 Preamp board0.080 HV power converter0.150 LV power converter0.200 Digital board0.200 Electronics housing0.150 Connector, Cabling0.045 Total Allocation 1.94 Contingency 21% SWEA Power ComponentPeak (mW) Average (mW) Front-end electronics Digital electronics Total Secondary SWEA LVPS Eff. (75%) PFDPU LVPS Eff. (90%) Total Allocation1240 Contingency15%

15 PFP IPDR 2010/6/ Spacecraft Accomodation SWEA axis parallel to SC Z when deployed Boom location: Separation from s/c potentials Large, clear field of view Sensor head in shadow Electronics box in sunlight FOV: 360 o x ±65 o

16 PFP IPDR 2010/6/ Hardware Implementation: Baseline STEREO SWEA Design

17 PFP IPDR 2010/6/ CESR and SSL have a long history of successful hardware collaboration: ISEE, GIOTTO, WIND 3D-P, MGS, CLUSTER-CIS, STEREO Instrument lifetimes greatly exceed requirements: WIND, MGS (9 years instead of 2), CLUSTER-CIS (10 years of operation soon) SWEA Heritage SWEA design already flying on STEREO Engineering model available at CESR for tests Calibration facility available at CESR Most of STEREO technical team expertise available STEREO SWEA data analysis team feedback All tools available for MAVEN SWEA instrument fabrication Same companies will be in charge of MAVEN instrument fabrication (electronics, mechanics, environmental tests) AIT compatibility with Planetary Protection under evaluation. Staff has followed ExoMars PP course (class 4 PP project) MAVEN SWEA fully funded by CNES until 2016 SWEA design already flying on STEREO Engineering model available at CESR for tests Calibration facility available at CESR Most of STEREO technical team expertise available STEREO SWEA data analysis team feedback All tools available for MAVEN SWEA instrument fabrication Same companies will be in charge of MAVEN instrument fabrication (electronics, mechanics, environmental tests) AIT compatibility with Planetary Protection under evaluation. Staff has followed ExoMars PP course (class 4 PP project) MAVEN SWEA fully funded by CNES until 2016

18 PFP IPDR 2010/6/ Instrument Geometry

19 PFP IPDR 2010/6/ Factor ~4 less Real less than ideal because of actual grid transparencies (interference between two entrance grids), MCP efficiencies, and grid support shadow. SWEA sensitivity appropriate for Mars environment. Geometric Factor

20 PFP IPDR 2010/6/ Dynamic Range (RFA-08) 10 years of MGS electron data (including solar max and several extreme events) provides basis for needed dynamic range. Expected count rates of STEREO SWEA at Mars approach saturation only during the most extreme events observed by MGS. Resolution: Utilize SWEA’s V0 capability to reduce geometric factor by ~50% for energies below 50 eV. Provides additional head room for extreme events.

21 PFP IPDR 2010/6/ of the sensor at low energy can be controlled by varying the voltage bias U 0 between the internal and external grids: where is the energy resolution for zero bias (0.175) and is the incident energy of the electron Thus to increase the energy resolution about 2 times, we apply Variation of Energy Resolution

22 PFP IPDR 2010/6/ Validation using MEX Measurements (1)

23 PFP IPDR 2010/6/ Simulated Count Rate Reduction of count rates with increase of energy resolution Validation using MEX Measurements (2)

24 PFP IPDR 2010/6/ Deflector Positions (RFA-05) STEREO SWEA response function not sufficiently flat as a function of deflection potential Simulations performed to optimize the deflector positions Upper Deflector (UD) Lower Deflector (LD)

25 PFP IPDR 2010/6/ Deflector Positions (RFA-05) Simulations performed to optimize the deflector positions Key ● STEREO SWEA ● UD + 1 mm, LD mm ● UD + 1 mm, LD mm Collimation by deflectors eliminated Max energy for full deflection reduced from 2.4 keV to 1.6 keV

26 PFP IPDR 2010/6/ Inner Hemisphere Scalloping (RFA-07) RFA-07: Determine optimal scalloping for analyzer inner hemisphere to minimize electron forward scattering which results in a low energy tail to the instrument response function Simulations performed to evaluate different scalloping options None Round Tooth Round Tooth Round scalloping on both hemispheres gives the best response, improving secondary electron suppression by a factor of 3.

27 PFP IPDR 2010/6/ SWEA Electrical Ellen Taylor June 15, 2010

28 PFP IPDR 2010/6/ SWEA Electrical Block Diagram UCBCESR

29 PFP IPDR 2010/6/ SWEA Electrical Requirements –MAVEN-PF-SWEA-002 SWEA Instrument Specification Functional and Performance Requirements Resource Allocations (board size, power budget) Environmental Requirements (thermal, vibration, radiation) –MAVEN-PF-QA-002C UCB Mission Assurance Implementation Plan Parts Level Burn-In Derating –MAVEN-PF-SYS-003C Power Converter Requirements Power voltages, current, ripple, transients –MAVEN-SWEA-012A FPGA Specification PFDPU CLK/TLM/CMD Interface HV Enable (RAW and MCP) and DAC Control (Sweep and Fixed) Operational Heater Control Pre-amp Input, Test Pulser Output Housekeeping and Memory (external SRAM) I/F

30 PFP IPDR 2010/6/ SWEA Digital Board Interfaces MAVEN-PF-SWEA-001I CESR to SSL ICD –Preamp Pulse Characteristics –Test Pulser Frequencies –HV Enable and Converter Synch –DAC Control Voltages –Sweep Waveforms –Analog Housekeeping –Connector Pin-out MAVEN-PF-SYS-004B PFDPU ICD –PFDPU Serial I/F description (CMD/CLK/DATA) –Power Interface (28V/RTN) MAVEN-PF-SYS-013E Harness –Connector Pin-outs MAVEN-PF-SYS-003C Power Req. –Power I/F (voltages, current, characteristics) MAV-RQ Particle and Fields to Spacecraft ICD –Heater, Thermister and Cover Actuator Interface

31 PFP IPDR 2010/6/ Heritage and Design Similarities MAVEN SWEA digital board has direct heritage from STEREO SWEA: –Minor interface changes (separate connector to SC for temp sensor, heater and actuator, external PFDPU connector) –Changed interface logic to 3.3V from 5V (added translators 54ACT244 on FPGA outputs, UT54ACS164245SEI on pre-amp inputs to FPGA) –Minor FPGA part change (RT54SX72S from RT54SX32S) –Removed STE digital circuitry and interface –Removed latch-up circuitry –Minor part changes due to obsolescence, desire to have common parts buy and circuitry MAVEN SWEA digital board is very similar to MAVEN SWIA and STATIC: –FPGA and SRAM same as SWIA, different than STATIC –Housekeeping (HK MUX and ADC parts) same –Fixed and Sweep DACs same minus offset DACs need for STATIC

32 PFP IPDR 2010/6/ Digital Board Design Command/Data Interface to PFDPU Accumulate counts from each of the 16 anodes Bin data for transfer to PFDPU Enable HVPS and MCP high voltage Control voltage sweeps for analyzer inner hemisphere and deflectors Provide programmable threshold for anode pulse amplifiers SRAM for storing lookup tables and accumulators Generate test pulses Control ADC and MUX to read instrument housekeeping monitors Note: Digital board does not control heaters (S/C) or cover actuators (S/C)

33 PFP IPDR 2010/6/ FPGA Block Diagram

34 PFP IPDR 2010/6/ SWEA and SWIA FPGA Similarities Commonalities –Both require anode counting frontends –Both implement Command & Telemetry Interfaces (CDI functionality for receiving commands and sending messages) –Housekeeping Control and Message Format –Memory Control –Fixed and Sweep DAC Control –Timing Backbone (reconfigured to accommodate the different accumulation intervals) –Lookup table memory and control (Loader and Checksummer) –High Voltage turn-on is a protected command –Overcurrent Protection (shown in SWEA block diagram) to be implemented identically in both FPGAs Differences –SWIA: 24 Anodes (14 WFOV and 10 NFOV) –SWEA: 16 Anodes –SWIA: 4 second cycle with 2304 Accumulation Intervals –SWEA: 2 second cycle with 488 Accumulation Intervals –SWIA Implements Products –SWEA Includes Operational Heater Control

35 PFP IPDR 2010/6/ Electronic Parts SWEA Active Parts List from MAVEN-PF-QA-003K Common Buy Parts STATUS: –In process of working parts list with GSFC –Blue highlighted parts are commercial, no direct knowledge of heritage –Replacement parts identified –Space study complete, layouts started

36 PFP IPDR 2010/6/ SWEA Mechanical Paul Turin June 15, 2010

37 PFP IPDR 2010/6/ SWEA Assembly CESR supplied detector and MCP assembly UCB supplied electronics and mounting interface

38 PFP IPDR 2010/6/ Stowed on S/C Caged to forward deck up to 20kg balance mass

39 PFP IPDR 2010/6/ Deployed on S/C SWEA axis parallel to SC Z when deployed (balance mass not shown) FOV

40 PFP IPDR 2010/6/ SWEA Analyzer Analyzer section very similar to STATIC and SWIA: Concentric Hemispheres, Deflectors, one-shot Aperture Cover Uses TiNi Aerospace P SMA actuator for Cover release Inner and outer grids covering aperture T 0 purge No attenuator

41 PFP IPDR 2010/6/ Pedestal Exploded View SWEA analyzer LVPS Pedestal housing Digital board Cover Board mounted SC harness and enable connectors HV enable plug Purge port (fitting TBD)

42 PFP IPDR 2010/6/ Baseplate Vent port (screened for EMC) HV Enable plug (green tag item) Area possibly needed for solar absorber SC harness connector Mounting holes (4)

43 PFP IPDR 2010/6/ Differences from STEREO SWEA Modifications to STEREO SWEA analyzer –Deflectors moved slightly to improve response – 1mm up,.3mm down. Resulting FOV blockage fix in process (trim a housing corner). –Exposed surface finishes will be changed to deal with thruster and deep-dip heating (more in thermal section). Modification of STEREO SWEA pedestal design –STE instrument and supporting electronics removed -- only LVPS and digital board –½ height, simpler mounting to boom at pedestal periphery –Simpler electrical and mechanical interfaces

44 PFP IPDR 2010/6/ Structural Analysis - Analyzer As discussed in the Systems presentation, the SWEA analyzer was designed for 30g limit load and 14.7grms random qual level (MAVEN: 66g and 23.1grms). Suitability of the design will be determined after the 1 st CLA results are in. Analysis results from STEREO:

45 PFP IPDR 2010/6/ Structural Analysis - Pedestal Pedestal: Worst-case margins for MAVEN MAC and Random loads: Lowest 1 st mode frequency = 198Hz

46 PFP IPDR 2010/6/ SWEA to S/C MICD

47 PFP IPDR 2010/6/ SWEA to Pedestal MICD

48 PFP IPDR 2010/6/ SWEA Peer Review Actions A separate peer review was held Feb 3, in Toulouse, France. All actions are closed.

49 PFP IPDR 2010/6/ Contents AIT: CESR Team Facilities Main subcontractors Documentation Cleanliness & contamination issues AIT flow chart CESR Assembly, Integration, and Test

50 PFP IPDR 2010/6/  Mechanics: J Rouzaud (G Peyre – Comat)  Integration, coatings, gluing, HV optocouplers : E Lecomte  Electronics, boards integration & tests: JJ Thocaven, P Rouger  Calibrations: A Fedorov, P Rouger, C Mazelle  Procedures, anomalies, QA: D Moirin (BTS)  Harnesses, boards assembling: Microtec  Environmental tests : P Rouger + Microtec AIT Staff

51 PFP IPDR 2010/6/  Class 1000 clean room for MCPs and detector assembly (CESR)  Class clean room for electronics and mechanics assemblies (available early may 2010) (CESR)  Small clean room for electronics gluing and coating (CESR)  Vacuum chamber and particles beam in class clean room (see A. Fedorov presentation)  Thermal chambers (-60°C to +120°C) – CESR  Class clean rooms available in sub contractors premices (Comat, Microtec)  EMC test facility: in Microtec (sub contractor) AIT Facilities

52 PFP IPDR 2010/6/  COMAT AerospaceMech. Fabrication & integrationsame as for STEREO (Toulouse)Tools for assemblysame staff as for STEREO Assembly docs (procedures, as_built, control reports, QA,…)  CORIMA (Loriol-FR)Entrance grids fab & gold treatment same as for STEREO  Collini & Fluhmann(Swi)Black copper same as for STEREO  SWIPELEC (Bordeaux-FR)MCP grids same as for STEREO  HIREX (Toulouse)EEE parts screening same as for STEREO EEE parts procurement(Tecnologica group)  CIRETEC (Toulouse)PCB fabricationCNES/ ESA qualified  MICROTEC (Toulouse)Parts & PCB welding, same as for STEREO Harnesses  Mecano-ID (Toulouse)Environmental tests AIT Main Sub-Contractors

53 PFP IPDR 2010/6/  As built lists (materials, EEE parts, processes)  As built assembling procedures  Environmental testing reports (if any)  Log book  Non conformity reports with appropriates corrective actions  Photographic documentation of FM hardware  Analysis reports (mechanical, electrical, …)  Tests reports AIT Documentation

54 PFP IPDR 2010/6/  Microchannel plate cleanliness requirements (same as for STEREO) Sensitivity to humidity, dust & hydrocarbons Discharge created by 100 microns particles can damage MCPs Outgassing near MCP to be avoided Special procedure to clean MCPs and restore properties  Permanent purging system installed on SWEA with dry nitrogen at 5 liters/ hour Plastic hermetic container filled with dry nitrogen acceptable for transportation (couple of hours) few hours without purge flow is possble in clean room environment MCPs or sensor equiped with MCPs is stored in vacuum at CESR  Hermetic red tag cover on SWEA analyser can be removed only in a class 1000 clean room and has to be kept on SWEA analyser during I&T Cleanliness and Contamination Issues (1)

55 PFP IPDR 2010/6/  All mechanical parts are cleaned with alcohol  All assembled parts are stored in vacuum chamber in CESR clean room  Integration in clean rooms Class 1000 CESR clean room for MCPs and analyser Class CESR clean room for electronic boards In subcontractors clean rooms (Comat or Microtec)  Unit bakeout for outgassing before first calibration tests  SWEA analyser stored in vacuum before calibration or before delivery to UCB  Bakeout of full SWEA instrument at UCB Cleanliness and Contamination Issues (2)

56 PFP IPDR 2010/6/ Note: STEREO-SWEA Engineering model analyser will be re-furbished according to STEREO to MAVEN changes and modifications indications will be given to SSL (date TBD) in parallel with AIT activities SWEA – MAVEN Prototype AIT

57 PFP IPDR 2010/6/ SWEA Calibration Plan Andrei Federov June 15, 2010

58 PFP IPDR 2010/6/ The goal: To create a wide uniform e- beam as close to the sensor as possible. The total current of the beam and its cross-section distribution should be measured. New CESR Electron Gun: Schematic

59 PFP IPDR 2010/6/ Hamamatsu Xenon lamp on the movable support Fused silica window New CESR Electron Gun: External

60 PFP IPDR 2010/6/ Palladium photocathode and an acceleration system: 1. Energy up to 10keV 2. Strictly parallel e- beam 3. No disturbed e- trajectories at the beam perifery New CESR Electron Gun: Internal

61 PFP IPDR 2010/6/ The photocathode at the end of the light tube. The beam current monitor. The beam monitor on the Y- Z axis stage. 1. Beam cross-section 2. Beam parallelism 3. Beam energy distribution New CESR Electron Gun: Internal

62 PFP IPDR 2010/6/ Flux distribution for close lamp position. 20% of variation within 40mm circle. We know the absolute beam for each sensor position Beam Cross Section

63 PFP IPDR 2010/6/ Y: 0.1mm Elevation (Thet) : +/- 90 deg, 0.1deg Azimuth (Phi) : +/- 170 deg, 0.1deg Sensor Positioning

64 PFP IPDR 2010/6/ Calibration Control

65 PFP IPDR 2010/6/ Simulated (left) and measured (right) Elevation-K response For D = 0 Simulated (left) and measured (right) Elevation-K response For D = K = E/Uan D = Udef/E Elevation, deg (mechanical) Virtual Elevation Azimuth, deg Calibration Plan

66 PFP IPDR 2010/6/ Define D – Elevation profile 2. For Az = const, for Elevations (step = 3 deg) : K-D response 3. Calculate dGF/dAz for this point (each anode) Elevation-D profile

67 PFP IPDR 2010/6/ Repeat the same for all Az (step = 2 deg) and all anodes GF Azimuth Profile

68 PFP IPDR 2010/6/ RFA Summary RFA #TitleAssigned ToOriginatedClosed SWEA-01Deflector Surface TreatmentTurin2/4/20103/22/2010 SWEA-01aDeflector Surface TreatmentJedrich2/4/20105/22/2010 SWEA-02Grid HeatingTurin2/4/20103/15/2010 SWEA-03Exposed Surface HeatingTurin2/4/20103/22/2010 SWEA-04Aluminum DeflectorsRouzaud2/4/20105/25/2010 SWEA-05Deflector ShapeFederov2/4/20105/25/2010 SWEA-06Actuator Connector PinsCurtis2/4/20102/8/2010 SWEA-07Inner Hemisphere ScallopingFederov2/4//20103/9/2010 SWEA-08Reduce Geometric FactorMitchell2/4/2010 SWEA-09SWEA MICDTurin2/4/20104/21/2010 SWEA-10Planetary ProtectionJedrich2/4/20105/20/2010 SWEA-11CESR DocumentsThocaven2/4/20103/3/2010 SWEA-12Purge Gas QualityThocaven2/4/20102/12/2010 SWEA-13Thruster HeatingHabenicht2/4/20102/23/2010 SWEA-14QAThocaven2/4/20103/5/2010 SWEA-15Thermal EngineerJedrich2/4/20103/17/2010 SWEA-16Cover DesignRouzaud2/4/20105/25/2010 SWEA-17ScheduleMeilhan2/4/20104/28/2010 SWEA-18EEE Parts ListThocaven2/4/20104/14/2010 SWEA-19CESR MAIPThocaven2/4/20103/3/2010 SWEA-20Energy SweepMitchell2/4/20103/8/2010 MAVEN_PF_MGT_004E_SWEAPeerReviewActions

69 PFP IPDR 2010/6/ CNES contract: to deliver same instrument as for STEREO (limited funding and manpower). Heritage from STEREO in-flight data. Better understanding of the instrument. Minor h/w modifications implemented on MAVEN SWEA. Minor changes only deal with: - deflector positions to flatten response vs. deflection potential - improved scalloping on detector spheres - different surface coatings to improve low energy response - interfaces discussed with SSL at Instrument Peer Review (Feb. 3, CESR). - improve reliability (higher screening than for STEREO for key electronic parts). SWEA Status

70 PFP IPDR 2010/6/ Activities implying long time deliveries have been initiated. Mechanical parts are being fabricated by same contractor as for STEREO/SWEA. Still some missing parts due to modifications (deflectors, spheres, grids). PCBs have been delivered by ESA-qualified manufacturer. Most of electronic parts have already been delivered. Detectors (MCPs) delivered April Stored in vacuum chamber after inspection. FM Mechanical Integration during Fall 2010 FM Test and Calibration during Spring 2011 FM Delivery to UCB mid-2011 (due at SSL by 12/8/2011) CESR Work Progress and Schedule

71 PFP IPDR 2010/6/ Testing & Calibration at UCB-SSL Same calibration facilities as for SWIA and STATIC Verify instrument performance based on CESR testing and calibration End-to-End Testing: analyzer, front-end and digital electronics, data products Environmental Testing: EMC, Magnetics, Vibration, TVac

72 PFP IPDR 2010/6/ SWEA Schedule Digital EM Layout/Fab/Testing Complete 9/28 LVPC EM Layout/Fab/Testing Complete 9/28 EM Electronics Housing Fab/Assemble 7/19-9/20 EM Analyzer Refurbish/Test 6/14-8/27 EM Harness Fab 7/19 EM I&T 9/29-12/2 EM Delivery to PFDPU I&T 12/2/10 FM 6/15/11-7/19/12