A novel two-dimensional microstrip sensor with charge division readout M. Fernández, R. Jaramillo, F.J. Muñoz, I. Vila IFCA (CSIC-UC) D. Bassignana, M.

Slides:



Advertisements
Similar presentations
Combined Measurement Results of dedicated RD50 Charge Multiplication Sensors Christopher Betancourt 2, Tom Barber 2, Gianluigi Casse 1, Paul Dervan 1,
Advertisements

1 Research & Development on SOI Pixel Detector H. Niemiec, T. Klatka, M. Koziel, W. Kucewicz, S. Kuta, W. Machowski, M. Sapor, M. Szelezniak AGH – University.
May 14, 2015Pavel Řezníček, IPNP Charles University, Prague1 Tests of ATLAS strip detector modules: beam, source, G4 simulations.
Progress with 2D Microstrip Detectors with Polycrystalline Silicon Electrodes 19 th RD50 Workshop November 23 th CERN, Geneva D. Bassignana, M. Lozano,
Bulk Micromegas Our Micromegas detectors are fabricated using the Bulk technology The fabrication consists in the lamination of a steel woven mesh and.
128 September, 2005 Silicon Sensor for the CMS Tracker The Silicon Sensors for the Inner Tracker of CMS CMS Tracker and it‘s Silicon Strip Sensors Radiation.
Position sensing in a GEM from charge dispersion on a resistive anode Bob Carnegie, Madhu Dixit, Steve Kennedy, Jean-Pierre Martin, Hans Mes, Ernie Neuheimer,
IFIC, Valencia Charles University, Prague Peter Kodyš, September 14-16, 2004, RD50 – Workshop Florencia1 Laser.
Thursday, November 7th ECFA meeting - Valencia - A.-M. Magnan 1 CALICE Summary of 2006 testbeam for the ECAL Anne-Marie MAGNAN Imperial College London.
Performance of the DZero Layer 0 Detector Marvin Johnson For the DZero Silicon Group.
20th RD50 Workshop (Bari)1 G. PellegriniInstituto de Microelectrónica de Barcelona G. Pellegrini, C. Fleta, M. Lozano, D. Quirion, Ivan Vila, F. Muñoz.
Embedded Pitch Adapters a high-yield interconnection solution for strip sensors M. Ullán, C. Fleta, X. Fernández-Tejero, V. Benítez CNM (Barcelona)
STS Simulations Anna Kotynia 15 th CBM Collaboration Meeting April , 2010, GSI 1.
Why silicon detectors? Main characteristics of silicon detectors: Small band gap (E g = 1.12 V)  good resolution in the deposited energy  3.6 eV of deposited.
Summary of CMS 3D pixel sensors R&D Enver Alagoz 1 On behalf of CMS 3D collaboration 1 Physics Department, Purdue University, West Lafayette, IN
Characterization of double sided silicon micro-strip sensors with a pulsed infra- red laser system for the CBM experiment Pradeep Ghosh 1,2 & Jürgen Eschke.
Silicon microstrip sensor R&D for the ILC Experiments
NEW COMMENTS TO ILC BEAM ENERGY MEASUREMENTS BASED ON SYNCHROTRON RADIATION FROM MAGNETIC SPECTROMETER E.Syresin, B. Zalikhanov-DLNP, JINR R. Makarov-MSU.
ALBA Synchrotron – 17 June 2010 Centro Nacional de MicroelectrónicaInstituto de Microelectrónica de Barcelona First Measurements on 3D Strips Detectors.
1 SiLC sensors for the LP-TPC Thomas Bergauer Institute for High Energy Physics (HEPHY) Austrian Academy of Sciences, Vienna for the SiLC Collaboration.
Wire Bonding and Analogue Readout ● Cold bump bonding is not easy ● Pixel chip is not reusable ● FE-I3 is not available at the moment ● FE-I4 is coming.
1 G. Pellegrini The 9th LC-Spain meeting 8th "Trento" Workshop on Advanced Silicon Radiation Detectors 3D Double-Sided sensors for the CMS phase-2 vertex.
Silicon Sensors for Collider Physics from Physics Requirements to Vertex Tracking Detectors Marco Battaglia Lawrence Berkeley National Laboratory, University.
Summary of CMS 3D pixel sensors R&D Enver Alagoz 1 On behalf of CMS 3D collaboration 1 Physics Department, Purdue University, West Lafayette, IN
WP9.4 baseline deliverable summary 10 December 2014 Thomas Bergauer (HEPHY Vienna)
Charge Collection Study of Heavily Irradiated Silicon Microstrip Detectors Chris Lucas (University of Bristol) Irena Dolenc Kittelmann, Michael Moll, Nicola.
8 July 1999A. Peisert, N. Zamiatin1 Silicon Detectors Status Anna Peisert, Cern Nikolai Zamiatin, JINR Plan Design R&D results Specifications Status of.
Status report on A 2D position sensitive microstrip sensor with charge division. A segmented Low Gain Avalanche Detector for tracking E. Currás, M. Fernández,
DESPEC A Algora IFIC (Valencia) for the Ge array working group.
Haga clic para modificar el estilo de texto del patrón Infrared transparent detectors Manuel Lozano G. Pellegrini, E. Cabruja, D. Bassignana, CNM (CSIC)
1 Device Simulations & Hardware Developments for CBM STS Sudeep Chatterji CBM Group GSI Helmholtz Centre for Heavy Ion Research CBM Collaboration Meeting,
SIAM M. Despeisse / 29 th January Toward a Gigatracker Front-end - Performance of the NINO LCO and HCO Matthieu Despeisse F. Osmic, S. Tiuraniemi,
1/14 Characterization of P-type Silicon Detectors Irradiated with Neutrons M.Miñano 1, J.P.Balbuena 2, C. García 1, S.González 1, C.Lacasta 1, V.Lacuesta.
Solid State Detectors for Upgraded PHENIX Detector at RHIC.
- Performance Studies & Production of the LHCb Silicon Tracker Stefan Koestner (University Zurich) on behalf of the Silicon Tracker Collaboration IT -
9 th “Trento” Workshop on Advanced Silicon Radiation Detectors Genova, February 26-28, 2014 Centro Nacional de MicroelectrónicaInstituto de Microelectrónica.
Paul Dolejschi Progress of Interstrip Measurements on DSSDs SVD.
Abstract Beam Test of a Large-area GEM Detector Prototype for the Upgrade of the CMS Muon Endcap System V. Bhopatkar, M. Hohlmann, M. Phipps, J. Twigger,
CBM Collaboration Meeting. GSI, Darmstadt CBM Silicon Tracking System. CBM-01 sensors characterization. V.M. Pugatch Kiev Institute for Nuclear.
Development of radiation hard Sensors & Cables for the CBM Silicon Tracking System Sudeep Chatterji On behalf of CBM-STS Collaboration GSI Helmholtz Centre.
CSIC WP9.4 Activities Status report AIDA 2 nd Annual meeting WP9.4 Iván Vila Álvarez Instituto de Física de Cantabria.
Tracking R&D at SCIPP: Charge Division Long Ladder Readout Noise Non-Prompt Tracks with SiD CERN Linear Collider Workshop October
Paul Dolejschi Characterisation of DSSD interstrip parameters BELLE II SVD-PXD Meeting.
Simulation of new P-Type strip detectors 17th RD50 Workshop, CERN, Geneva 1/15 Centro Nacional de MicroelectrónicaInstituto de Microelectrónica de Barcelona.
Infrared Laser Test System Silicon Diode Testing 29 May 2007 Fadmar Osmić Contents: Setup modifications new amplifier (Agilent MSA-0886) new pulse generator.
A novel two-dimensional microstrip sensor for charge division readout D. Bassignana, M. Lozano, G. Pellegrini CNM-IMB (CSIC) M. Fernández, R. Jaramillo,
Giulio Pellegrini Actividades 3D G. Pellegrini, C. Fleta, D. Quirion, JP Balbuena, D. Bassignana.
ADC values Number of hits Silicon detectors1196  6.2 × 6.2 cm  4.2 × 6.2 cm  2.2 × 6.2 cm 2 52 sectors/modules896 ladders~100 r/o channels1.835.
MICRO-STRIP METAL DETECTOR FOR BEAM DIAGNOSTICS PRINCIPLE OF OPERATION Passing through metal strips a beam of charged particles or synchrotron radiation.
SiW ECAL Marcel Reinhard LLR – École polytechnique LCWS ‘08, Chicago.
V.Aulchenko 1,2, L.Shekhtman 1,2, B.Tolochko 3,2, V.Zhulanov 1,2 Budker Institute of Nuclear Physics, , Novosibirsk, Russia Novosibirsk State University,
QA Tests Tests for each sensor Tests for each strip Tests for structures Process stability tests Irradiation tests Bonding & Module assembly Si detectors1272.
0 Characterization studies of the detector modules for the CBM Silicon Tracking System J.Heuser 1, V.Kyva 2, H.Malygina 2,3, I.Panasenko 2 V.Pugatch 2,
Zheng Li, 96th LHCC open session, 19th November 2008, CERN RD39 Status Report 2008 Zheng Li and Jaakko Härkönen Full author list available at
June T-CAD Simulations of 3D Microstrip detectors a) Richard Bates b) J.P. Balbuena,C. Fleta, G. Pellegrini, M. Lozano c) U. Parzefall, M. Kohler,
Development of SSD and DSSD for J-PARC experiment.
FCAL R&D towards a prototype of very compact calorimeter
Application of VATAGP7 ASICs in the Silicon detectors for the central tracker (forward part) S. Khabarov, A. Makankin, N. Zamiatin, ,
Setup for measurements with SCT128 in Ljubljana: SCTA128VG chip
Igor Mandić1, Vladimir Cindro1, Gregor Kramberger1 and Marko Mikuž1,2
ILC Detector Activities in Korea
Test Beam Measurements october – november, 2016
HVCMOS Detectors – Overview
Pradeep Ghosh for the CBM Collaboration Goethe-Universität, Frankfurt
Peter Kodyš, Zdeněk Doležal, Jan Brož,
Setup for testing LHCb Inner Tracker Modules
Enhanced Lateral Drift (ELAD) sensors
Why silicon detectors? Main characteristics of silicon detectors:
Gain measurements of Chromium GEM foils
A DLC μRWELL with 2-D Readout
Presentation transcript:

A novel two-dimensional microstrip sensor with charge division readout M. Fernández, R. Jaramillo, F.J. Muñoz, I. Vila IFCA (CSIC-UC) D. Bassignana, M. Lozano, G. Pellegrini CNM-IMB (CSIC) 5ª Jornadas Futuros Aceleradores, Valencia Oct 26 th 2010

_Outline — Sensor’s working principle. — Prototype manufacturing. — Electrical characteristics. — Laser and radioactive source characterization. — Test SPS. — Conclusions and outlook. I. Vila, 5th Workshop on Future Accelerators, Valencia Oct. 26th 20102

_Charge division concept — Charge division used in wire chambers to determine the coordinate along the sensing wire. — Same concept with conventional microstrips with slightly resistive electrodes I. Vila, 5th Workshop on Future Accelerators, Valencia Oct. 26th 2010 L 2a L 3a L 4a L 5a L 6a L 1a X Y P1P1 P2P2 P3P3 P4P4 1 P5P5 P6P6 L 2b L 3b L 4b L 5b L 6b L 1b Al Resistive material t t t1t1 t2t2 V Particle P4P4 S1S1 S2S2 Ampl1Ampl2 S 1 =f(y) S 2 =f(L-y) 3

_Concept Demonstrator: P-Si sensor 4I. Vila, 5th Workshop on Future Accelerators, Valencia Oct. 26th 2010 Designed and produced at IMB-CNM. strip length= 14 mm. Two different prototypes with different strip widths: 20 μm and 40 μm. metal guides to drive the contact pads at the same edge of the detector. implant pitch= 160 μm read out pitch= 80 μm Multiple guard rings. standard technology of silicon microstrip detectors. P-on-n, 300 μm thick detectors. Only one chip to read out the detector Resistive material = highly doped polysilicon.

_Electrical Characterization 5I. Vila, 5th Workshop on Future Accelerators, Valencia Oct. 26th 2010 Strip WidthV depl V bd R bias R int C int C coupl R electrode / □R electrode /μm 20μm40 V> 400 V1,31 MΩ> GΩ1,32 pF248 pF400 Ω/□20 Ω/μm 40μm40 V> 200V1,37 MΩ> GΩ1, 60 pF487 pF400 Ω/□10 Ω/μm

_Readout Electronics ALIBAVA SYSTEM – Sensors P20 & P40 bonded at IFIC 6I. Vila, 5th Workshop on Future Accelerators, Valencia Oct. 26th 2010

FE chip calibration Chip 1 did not perform calibration P20 channels electrons/ADU

Laser characterization: test stand 8I. Vila, 5th Workshop on Future Accelerators, Valencia Oct. 26th 2010 — Laser head on 3D platform (  5 um accuracy): _ Gaussian profile with microspot width 2  < 10um _ Wavelength 1080 nm _ Pulse duration < 1ns _ Pulse energy  10% gaussian fluctuation.

Laser Longitudinal scan. Laser scanned along the polysilicon electrode 9I. Vila, 5th Workshop on Future Accelerators, Valencia Oct. 26th 2010 (S1 L S1 S1 R ) (S2 L S2 S2 R ). Poly-Si Electrode Near Side. Al via Far Side

Longitudinal coordinate from Q div — Naïve computation of position along the strip: 10I. Vila, 5th Workshop on Future Accelerators, Valencia Oct. 26th 2010 Fit residuals within ± 50 um band !!! [mm]

Spice simulation using electrical parameters five strips (R str, C cou, R met ). interstrip circuital elements (C int, R int, C m, C p ). bulk representation (R sub, C sub ). Longitudinal coordinate: Simulation vs. measurement — Overall shape reproduced. — Bias introduced by direct coupling of the pulse to the Al via. 11I. Vila, 5th Workshop on Future Accelerators, Valencia Oct. 26th 2010

SNR determination — Laser characterization demonstrated the soundness of the charge division method for strip sensors. — Increased level of noise but not much (900 ENC) — In the real world: What signal/noise ratio we should expect for a MIP particle ? ↓ Sr90 beta source 120 GeV Pion test beam at SPS. 12I. Vila, 5th Workshop on Future Accelerators, Valencia Oct. 26th 2010

Sr90 Beta source — Collimated (1mm)  -source, at the strip center — Signal / Noise  15 13I. Vila, 5th Workshop on Future Accelerators, Valencia Oct. 26th Electrons Electrons

Test SPS — During the first week of October testing at SPS pion beam in parasitic mode: _ Standalone Testing (ALIBAVA daq) around 800Kevt. _ Inside the EUDET mimosa telescope (APV25 daq) 14I. Vila, 5th Workshop on Future Accelerators, Valencia Oct. 26th 2010

Test SPS (2) 15I. Vila, 5th Workshop on Future Accelerators, Valencia Oct. 26th 2010 — SPS beam very stigmatic along the longitudinal (strip) direction. — Last run with ALIBAVA as DUT inside EUDET telescope (BUT TLU too long trigger delay)

Test SPS (3) Signal Spectrum & pulse shapes 16I. Vila, 5th Workshop on Future Accelerators, Valencia Oct. 26th 2010

Short term plans — Almost all the data to be analyzed from the test beam: ALIBAVA & AVP25 (Including EUDET telescope tracking). — New 2D strip sensor of larger dimensions (  3 cm) already produced at CNM under electrical test. — Designed with contacts at both strip ends to be read out by two independent FE chips. 17I. Vila, 5th Workshop on Future Accelerators, Valencia Oct. 26th 2010

Conclusions — We have demonstrated the feasibility of the charge division method in microstrip sensors to determine the coordinate along the strip. — Resolution in the determination of the strip coordinate much better that 100 um. — We have used the standard (cheap) technology to produce this genuine 2D single sided strip detector. — Possible application targets: _ Future detector outer trackers (trigger capable modules) _ Ions tracking systems. _ Neutron imaging (+ conversion element). _ Space applications. — Aiming to technological transfer Pat. ES ) 18I. Vila, 5th Workshop on Future Accelerators, Valencia Oct. 26th 2010

THANK YOU 19I. Vila, 5th Workshop on Future Accelerators, Valencia Oct. 26th 2010

BACK-UP 20I. Vila, 5th Workshop on Future Accelerators, Valencia Oct. 26th 2010

Signal directly induced in the metal via from sensor far side (1) 21I. Vila, 5th Workshop on Future Accelerators, Valencia Oct. 26th 2010

Signal directly induced in the metal via from sensor far side (2) 22I. Vila, 5th Workshop on Future Accelerators, Valencia Oct. 26th 2010

Signal directly induced in the metal via from sensor far side (3) 23I. Vila, 5th Workshop on Future Accelerators, Valencia Oct. 26th 2010

Signal directly induced in the metal via from sensor far side (4) 24I. Vila, 5th Workshop on Future Accelerators, Valencia Oct. 26th 2010