CSNSM Orsay Micro-Electronics groups Associated : 2 nd annual meeting P. Barrillon, S. Blin, S. Callier, S. Conforti, F. Dulucq, J. Fleury, C. de La Taille, G. Martin-Chassard, L. Raux, N. Seguin-Moreau, D. Thienpont + Xiongbo Ian from IHEP Beijing

2 july 09 C. de La Taille - OMEGA administration council 2 Microelectronics at in2p3 Large force of microelectronics experienced engineers (~50) Expertise in detectors, chip design and test Experience in designing and building large particle physics detectors (trackers, calorimeters…) Common Cadence tools charge of national coordination Actions : –Building blocks (SiGe, 130nm) –Networking –poles

2 july 09 C. de La Taille - OMEGA administration council 3 Motivation for poles Continuous increase of chip complexity (SoC, 3D…) Importance of critical mass –Daily contacts and discussions between designers –Sharing of well proven blocks –Cross fertilization of different projects Creation of poles at in2p3 –OMEGA at Orsay –Strasbourg –Dipole Lyon-Clermont

2 july 09 C. de La Taille - OMEGA administration council 4 HARDROC Orsay Micro-Electronics Groups Associated A strong team of 12 ASIC designers… –= 20% of in2p3 designers –= 60% of department research engineers –A team with critical mass : pole created in 2007 = OMEGA –Expertise in low noise, low power, high level of integration ASICs –2 designers/ project –2 projects/designer –Regular design meetings …Within an electronics dept. of 50 –Support for tests, measurements, PCBs… A steady production –A strong on-going R&D –Building blocks SiGe 0.35µm SKIROC MAROC 2 SPIROC SiPM

2 july 09 C. de La Taille - OMEGA administration council 5 Orsay micro-electronics team 9 research engineers (1 IR0, 2 IR1, 6 IR2) 1 phD student (ANR PMm2) thesis sept 2010 (Selma) 1 CDD engineer (ANR vitesse) (Damien) 1 visitor from China IHEP Beijing (Xiongbo)

2 july 09 C. de La Taille - OMEGA administration council 6 Recent chips Several chips developped for ATLAS LAr, OPERA, LHCb, CALICE in BiCMOS 0.8µm and installed on experiments Turn to Silicon Germanium 0.35 µm BiCMOS technology in 2005 Readout for MaPMT and ILC calorimeters Very high level of integration : System on Chip (SoC) Start of 3D integrated 130nm electronics for sLHC pixels SKIROC1 MAROC2 HARDROC1 SPIROC1 PARISROC1 HARDROC2 OMEGAPIX SPIROC2 MAROC3

2 july 09 C. de La Taille - OMEGA administration council 7 MAROC : 64 ch MAPMT chip for ATLAS lumi Complete front-end chip for 64 channels multi-anode photomultipliers –Auto-trigger on 1/3 p.e. at 10 MHz, 12 bit charge output –SiGe 0.35 µm, 12 mm2, Pd = 350mW Bonded on a compact PCB (PMF) for minimal space occupancy PMF Hold signal PM 64 channels Photons Variable Gain Preamp. Variable Slow Shaper ns Bipolar Fast Shaper Unipolar Fast Shaper Gain correction 64*6bits 3 discris thresholds (3*12 bits) Multiplexed Analog charge output LUCID S&H 3 DACs 12 bits 80 MHz encoder 64 Wilkinson 12 bit ADC 64 trigger outputs (to FPGA) Multiplexed Digital charge output 64 inputs S&H P. Barrillon, S. Blin, F. Dulucq, G. Martin

2 july 09 C. de La Taille - OMEGA administration council 8 Active board pictures MAROC side Lattice side 64 ch PMT MAROC2 chip bounded at CERN P. Barrillon, S. Blin, D. Cuisy, M. Gaspard, B. Lavigne

2 july 09 C. de La Taille - OMEGA administration council 9 MAROC Efficiency curves

2 july 09C. de La Taille - OMEGA administration council10 August 2008 beam tests Carried out at CERN. Matrix of 23 PMFs readout by the last version of the mother board or 2 test boards (by group of 2×5 = 10 PMFs) Offline analysis ongoing. Online one showed nice reconstruction of the beam position All PMFs worked nicely as well as the kapton cables Preliminary

2 july 09 C. de La Taille - OMEGA administration council 11 MAROC status 1000 chips MAROC2 produced in 2007 –300 to equip ALFA –500 to equip Double Chooz –200 packaged in PQFP240 for various users 25 chips MAROC3 fabricated in 2008 –ATLAS/LUCID application (Bologna) –Lower power dissipation Proposed adaptation to JEM/EUSO –Photon counting + radiation hardening for space environment Many external users –Hodoscope Menphyno (APC), PET (ISS Roma, Pisa, Valencia), Astrophysics : Air showers (EHWA Korea),

2 july 09 C. de La Taille - OMEGA administration council 12 Auger South JEM-EUSO Field Of view30° x 30°60°x 60° Collection surface : Ø (m) # channels FD24 x 440 = channels of MAPMT X 30 JEM-EUSO proposal [S. Dagoret CSLAL]

2 july 09 C. de La Taille - OMEGA administration council 13 ASIC Function: Analog part: 1.Photoelectron counting (implemented LAL) 2.Time Over Threshold (JAXA/Riken) Digital part (LAL): 1.Digitization, 2.Memory, 3.Send data to FPGA for triggering Other: PMT gain control (PMT protection) with APC Crucial points Power consumption < 1mW/canal trigger data flow ~ 384 bits / 2.5 μs Activities electronic tests qualification absolute and relative calibration with APC database LAL ASIC proposed contribution

2 july 09 C. de La Taille - OMEGA administration council 14 The full detector ~ 150 million $-100 million € JAPAN ~ 70 million$ - 50 million € US(NASA) ~ 36 million $ - 26 million € France(CNES) ~3.5 million € (asked to CNES) (~3.5 % full detector) Of which LAL electronic contribution up to 700 k € : Details of The ASIC project Cost estimate

2 july 09 C. de La Taille - OMEGA administration council 15 ILC front-end ASICs : the ROC chips SPIROC Analog HCAL (SiPM) 36 ch. 32mm² June 07 HARDROC Digital HCAL (RPC, µmegas or GEMs) 64 ch. 16mm² Sept 06 SKIROC ECAL (Si PIN diode) 36 ch. 20mm² Nov 06 Technological prototypes : full scale modules (~2m) EUDET EU funding (06-09) ECAL, AHCAL, DHCAL B=5T

2 july 09 C. de La Taille - OMEGA administration council 16 Hadronic Rpc Detector Read Out Chip –64 inputs, preamp + shaper+ 3 discris + memory + Full power pulsing –Chip embedded in detector –First DAQ tests in beam oct 08 1m2 RPC [IPNL] S. Callier, F. Dulucq, G. Martin, N. Seguin HaRDROC : ILC DHCAL readout

2 july 09 C. de La Taille - OMEGA administration council 17 Trigger efficiency measurements FSB0, 100K, 100fF, G=144 NO decoupling cap. 30 fC 10 fC Pedestal Dac unit Channel number 1pC 100 fC piedestal Low gain : DAC Unit ≈ 3 fC High gain : DAC Unit ≈ 1 fC Daisy chain readout.

2 july 09 C. de La Taille - OMEGA administration council 18 Total power on : 100 mW Total power off : 10 µW Power dissipation –1.5 mW/ch continuous –25 µs awake time –7.5 µW/ch with 0.5% duty cycle 10 µW/ch = 24h operation of full slab with 2 AAA batteries ! PA 5.46mA DAC 0.84mA 3 FSB 12.3mA BG 1.2mA SS 9.3mA vddd 0.67mA 3 Discris 7.3mA vddd2 0.4mA (=0 if 40MHz OFF) TOTAL 38mA Trigger 25 µs PWR ON Power pulsing

2 july 09 C. de La Taille - OMEGA administration council 19 HaRDROC status 240 chips HARDROC1 produced in june 2007 to equip 4-chip and 24-chip RPC and Micromegas detectors –Package PQFP240 –Not completely power-pulsed 400 chips HARDROC2 produced in june 2008 to equip 24-chip RPC and Micromegas for square meter –3 thresholds ( pC) –Power pulsed to <10 µW/ch –Package TQFP160 Essential for CALICE readout + DAQ2 validation Full production run : end 2009-beg 2010 –After validation on detector External requests : –medical imaging (IMNC), X-ray spectro (CSNSM), hodoscope (Obs Pce) TQFP: t=1.4 mm

2 july 09 C. de La Taille - OMEGA administration council 20 SPIROC : SiPM readout SPIROC : Silicon Photomul. Integrated Readout Chip –36 channels –Charge measurement –Time measurement –Autotrigger on MIP or spe –Sparsified readout compatible with EUDET 2 nd generation DAQ –Chips daisy-chained –Pulsed power -> 25 µW/ch –Fabricated in june 07 First SiPM readout ASIC S. Callier, F. Dulucq, J. Fleury, G. Martin, L. Raux

2 july 09 C. de La Taille - OMEGA administration council 21 SPIROC main features Internal input 8-bit DAC (0-5V) for individual SiPM gain adjustment Energy measurement : 14 bits –2 gains (1-10) + 12 bit ADC 1 pe  2000 pe –Variable shaping time from 50ns to 100ns –pe/noise ratio : 11 Auto-trigger on 1/3 pe (50fC) –pe/noise ratio on trigger channel : 24 –Fast shaper : ~10ns –Auto-Trigger on ½ pe Time measurement : –12-bit Bunch Crossing ID –12 bit TDC step~100 ps Analog memory for time and charge measurement : depth = 16 Low consumption : ~25 µW per channel (in power pulsing mode) Individually addressable calibration injection capacitance Embedded bandgap for voltage references Embedded 10 bit DAC for trigger threshold and gain selection Multiplexed analog output for physics prototype DAQ 4k internal memory and Daisy chain readout

2 july 09 C. de La Taille - OMEGA administration council 22 DAQ ASIC Chip ID register 8 bits gain Trigger discri Output Wilkinson ADC Discri output gain Trigger discri Output Wilkinson ADC Discri output..… OR36 EndRamp (Discri ADC Wilkinson) 36 TM (Discri trigger) ValGain (low gain or high Gain) ExtSigmaTM (OR36) Channel 1 Channel 0 ValDimGray 12 bits … Acquisition readout Conversion ADC + Ecriture RAM RAM FlagTDC ValDimGray 12 8 ChipID Hit channel register 16 x 36 x 1 bits TDC ramp StartRampTDC BCID 16 x 8 bits ADC ramp Startrampb (wilkinson ramp) 16 ValidHoldAnalogb RazRangN 16 ReadMesureb Rstb Clk40MHz SlowClock StartAcqt StartConvDAQb StartReadOut NoTrig RamFull TransmitOn OutSerie EndReadOut Chipsat

2 july 09 C. de La Taille - OMEGA administration council 23 HBU0 status [CALICE SPIROC1 Connectors: Signal Power SPIROC2 DIF FPGA CALIB USB / DAQ Flexleads 2 setups available ©M. Reinecke (DESY)

2 july 09 C. de La Taille - OMEGA administration council 24 Performance pedestal Qinj=50fC High gain channel linearity Linearity better than 1% ©W.Shen (Heidelberg) ©Beni (DESY)

2 july 09 C. de La Taille - OMEGA administration council 25 SPIROC status 200 chips SPIROC1 produced in nov 2006 –Package PQFP240 –Good analog performance –Bug in ADC ramp : no digital data out 50 chips SPIROC2 produced in june 2008 to equip AHCAL and ECAL EUDET modules –EUDET milestone –Package TQFP208 –Difficult slow control loading Measurements slowly coming in –Collab LAL, DESY, Heidelberg Full production run : end 2009 –After validation on detectors External requests : –astrophysics PEBS (Aachen), medical imaging (Roma, Pisa, Valencia, Siemens, GEMS), nuclear physics (IPNO), Vulcanology (Napoli) ©W. Karpinski (Aachen)

2 july 09 C. de La Taille - OMEGA administration council 26 SKIROC for W-Si ECAL Silicon Kalorimeter Integrated Read Out Chip (Nov 06) –36 channels with 15 bits Preamp + bi-gain shaper + autotrigger + analog memory + Wilkinson ADC –Digital part outside in a FPGA for lack of time and increased flexibility –Technology SiGe 0.35µm AMS. Chip received may 07 S. Callier, M. Cohen-Solal, F. Dulucq, J. Fleury, N. Seguin 1 MIP in SKIROC

2 july 09 C. de La Taille - OMEGA administration council 27 Front-end board for ECAL PCB – FRONT PCB – BACK An ASU (Active Sensor Unit) VFE ASIC bonded in a PCB ASIC buried in the PCB ASU stitching : zero thickness connection No component  All features embedded in ASIC S. Callier, D. Cuisy

2 july 09 C. de La Taille - OMEGA administration council 28 Summary of ILC chips 2 nd prototypes of HARDROC (DHCAL) and SPIROC (AHCAL+ECAL) submitted in june 08 DAQ part being validated with HaRDROC Power pulsing tests essential now at system level Front-end boards first prototypes coming in –Difficulties with ECAL boards DAQ interface (DIF boards) prototyped One engineering run with all 3 chips (ECAL, DHCAL and AHCAL) beg 2010 : can be used as « production run » Tests are very complex and lagging behind Still need to validate noise, autotrigger, ADC, power pulsing with detector.

2 july 09 C. de La Taille - OMEGA administration council 29 Joël PouthasIPN Orsay “PMm2” (2006 – 2009), funded by the ANR : LAL, IPNO, LAPP, Photonis –Replace large PMTs (20”) by groups of smaller ones (12”) – central 16ch ASIC (PaRISROC) –12 bit charge + 12 bit time –water-tight, common High Voltage –Only one wire out (DATA + VCC) –Target low cost Application : large water Cerenkov neutrino External requests : –Neutrino (DUSEL, LENA) PARiSROC for PMm 2 S. Conforti, F. Dulucq, M. El Berni, G. Martin, I. Xiongbo

2 july 09 C. de La Taille - OMEGA administration council 30 PARISROC1 performance

2 july 09 C. de La Taille - OMEGA administration council 31 PARISROC1 performance ©B Genolini (IPNO) Threshold = 220 DAC channels 0.3 pe 1 pe ©B Genolini (IPNO)

2 july 09 C. de La Taille - OMEGA administration council 32 3D technology Increasing integration density, mixing technologies Wafer thinning to <50 µm Minimization of interconnects Large industrial market –Processors, image sensors… ©A. Klumpp (IZM)

2 july 09 C. de La Taille - OMEGA administration council 33 Complete back end of line (BEOL) processing by adding Cu metal layers and top Cu metal (0.8 um) Front End of line (FEOL) : Chartered 130 nm CMOS (eq. IBM) Via first process : via diameter = 2 µm 6 um Cu Tezzaron 3D process ©B Patti (Tezzaron)

2 july 09 C. de La Taille - OMEGA administration council 34 Flip 2 nd wafer on top of first wafer. Bond second wafer to first wafer using Cu-Cu thermo-compression bond. Example: bonding identical wafers CuCu bond 12um Thin second wafer to about 12um to expose super via. Add metallization to back of 2 nd wafer for bump bond or wire bond. OR Add Cu to back of 2 nd wafer to bond 2 nd wafer to 3 rd wafer Flip 3 rd wafer Bond 3 nd wafer to 2 rd wafer. Thin 3 rd wafer to expose super via. Add final passivation and metal for pads Cu for wafer bond to 3 rd layer Face to face Face to back Tezzaron 3D process

2 july 09 C. de La Taille - OMEGA administration council 35 Fermilab is planning a dedicated 3D multi project run using Tezzaron for HEP. There will be 2 layers of electronics fabricated in the Chartered 0.13 um process, using only one set of masks. (Useful reticule size 15.5 x 26 mm) The wafers will be bonded face to face. For devices without integrated sensors, bond pads will be fabricated for bump bonding to sensors to be done later at Ziptronix as shown below. Pixel sensors BTEV pixel ROIC wafer Fermilab 3D multiproject run [R. Yarema]

2 july 09 C. de La Taille - OMEGA administration council um V1P1 3tier test chip FNAL Example of 3D chip at FNAL

2 july 09 C. de La Taille - OMEGA administration council 37 OMEGAPIX: 3D ATLAS pixels at SLHC Analog tier : preamplifier + shaper + discriminator + DAC to fix the threshold Digital tier: one 24 DFlipflop register OMEGAPIX includes 1536 channels divided in 24 columns and 64 ch/col. G. Martin, D. Thienpont F. Wicek, I. Guo (LPNHE)

2 july 09 C. de La Taille - OMEGA administration council 38 Conclusion MAROC, HaRDROC, SKIROC, SPIROC… –SoC : System on chip (ADC, TDC, DAQ…) –High synergy between chips –Production in 2010 in a dedicated run ILC main customer –Many external requests –Long and difficult measurements… Diversification –3D electronics 130nm –Spatial applications

2 july 09 C. de La Taille - OMEGA administration council 39 Chip submissions in June 2008 : Hardroc2, Parisroc1, Spiroc2 Nov 2008 : test structures for ATLAS calo upgrade March 2009 : Omegapix (Chartered 3D 130nm) June 2009 : Hardroc2b September 2009 : Parisroc2, Spiroc0 Beg 2010 : Omegapix2 Beg 2010 : Production run SiGe CALICE

2 july 09 C. de La Taille - OMEGA administration council 40 Engineering run Reticle size : 20x20 mm2 –65 reticles/Wafer Arrangement to be finalized –10 HR3 –3 SP3 –1 SK2 Will be launched as soon as measurements are complete ! –Exp. Beg SKIROC2 SPIROC3 HR3

2 july 09 C. de La Taille - OMEGA administration council 41 Collaboration  Commitments ATLAS luminometry: roman pots readout –MAROC2 for MultiAnode PMT [S. Blin] CALICE/EUDET ILC calorimeters readout ASICs –HaRDROC for RPC DHCAL (ANR 2007) [N. Seguin] –SKIROC for SiW ECAL (EUDET ) [J. Fleury] –SPIROC for SiPM AHCAL (and japanese ECAL) (EUDET) [L. Raux] –Full production beg 2010 –Coordination of FP6 EUDET JRA3 (with S. Sefkow DESY) PMM2 : ANR large area photodectors –PARISROC [G. Martin] ATLAS 3D tracker R&D –OMEGAPIX [G. Martin]

2 july 09 C. de La Taille - OMEGA administration council 42 Collaboration  External contracts European contract EUDET ( ) –R&D for detectors at the ILC. Calorimetry : design of chips for ECAL, AHCAL and DHCAL. –36 ppm engineer + 130k€ chip foundries ANR PMm2 ( ) [LAL, IPNO, LAPP] –R&D for large arrays of photomultipliers (“square meter PM”). –36 ppm engineer + 130k€ chip foundries ANR DHCAL ( ) [IPNL, LAL, LAPP, LLR] –R&D for a cubic meter digital hadron calorimeter at the ILC. –140k€ chip foundry for 5000 chips ANR vitesse ( ) [LAL, CPPM, LPNHE] –3D electronics for trackers. R&D for ATLAS at SLHC. –36 ppm engineer k€ chip foundries

2 july 09 C. de La Taille - OMEGA administration council 43 Collaboration  International Joint Labs Japan : FJPPL ( ) Collaboration with KEK group (M Tanaka) on ASIC R&D for megaton-like experiment linked to PMm². China : FCPPL (2007-) Collaboration with IHEP (Beijing). One Chinese visitor for 6 months (1/2/08  31/7/08) on photomultiplier readout design. Collaboration on Parisroc and Building blocks. One Chinese PhD student (1/9/08  1/9/09). Korea : FKPPL (2007-) Collaboration with EHWA (Seoul). R&D on PCBs for CALICE ECAL

2 july 09 C. de La Taille - OMEGA administration council 44 Collaborations ILC Si-W ECAL ( ) with LLR & LPCClermont ILC RPC-Fe DHCAL (2006-) with LLR, IPNL & LAPP ILC Scintillator (SiPM)-Fe AHCAL (2003-) with DESY ILC Scintillator (SiPM)-W ECAL(2005-) with KEK ATLAS luminometer ALFA ( ) with CERN ATLAS luminometer LUCID ( ) with Bologna ATLAS tracker (2007-) with CPPM, Bonn, Munich & LBL Double Chooz ( ) with NEVIS lab PMm² ( ) with IPNO & LAPP SuperNemo Front-end (2008-) with LPC Caen SymbolX (2008-) with APC North Auger ( ) with IPNO Medical imaging with MaPMT (2007-) with ISS Roma Medical imaging PET with MsiPM (2007-) with INFN Pisa Medical imaging with MaPMT ( ) with IMNC Medical imaging with MaPMT (2008-) with CSNSM PEBs : Balloon experiment with SiPM (2008-) with Aachen Generic detector R&D (2007-) Space telescope for EECR measurement (2006-) with EHWA Korea FJPPL (2006-) with KEK FCPPL (2007-) with IHEP Beijing FKPPL (2008-) with EHWA

2 july 09 C. de La Taille - OMEGA administration council 45 Manpower  Position in Omega % ANREUIN2P3TOTAL PMm² 2006DHCAL 2007VITESSE 2008EUDET 2006LSSTSuperNemoATLAS LumiANR+EUIN2P3GRAND Pierre Barrillon Sylvie Blin Stéphane Callier 100 Selma Conforti 100 Frederic Dulucq Julien Fleury 100 Christophe de La Taille Gisèle Martin Ludovic Raux 100 Nathalie Seguin Vanessa Tocut Wei TOTAL FTE

2 july 09 C. de La Taille - OMEGA administration council 46 Manpower  Position in Omega % ANREUIN2P3TOTAL PMm² 2006DHCAL 2007VITESSE 2008EUDET 2006OthersJEM-EUSOATLAS LumiANR+EUIN2P3GRAND Pierre Barrillon Sylvie Blin Stéphane Callier Selma Conforti 100 Frederic Dulucq Julien Fleury 30 Christophe de La Taille Gisèle Martin Ludovic Raux 100 Nathalie Seguin Damien Thienpont 100 Xiongbo Yan TOTAL FTE

2 july 09 C. de La Taille - OMEGA administration council 47 Manpower  Position in Omega % ANREUIN2P3TOTAL PMm² 2006DHCAL 2007VITESSE 2008EUDET 2006OthersJEM-EUSOATLAS LumiANR+EUIN2P3GRAND Pierre Barrillon Sylvie Blin Stéphane Callier 100 Selma Conforti 100 Frederic Dulucq Julien Fleury 70 Christophe de La Taille Gisèle Martin Ludovic Raux Nathalie Seguin Damien Thienpont 100 CDD JEM EUSO 100 TOTAL FTE

2 july 09 C. de La Taille - OMEGA administration council 48 Communication  talks in conferences PIXEL’08 Fermilab sept 2008 –Invited Talk – microelectronics for SiPM readout, J. Fleury TWEPP ’08, Naxos Sept 2008 –Talk – Spiroc : front-end ASIC for SiPM reaodut, J. Fleury –Talk – PMF, front-end board for ATLAS luminometry, C. de La taille –Poster – Skiroc a front-end ASIC for ILC SiW ECAL, J. Fleury –Poster – Parisroc : digital part of PM readout, F. Dulucq –Poster – PMm2 ASIC Parisroc, G. Martin-Chassard IEEE – Nuclear Science Symposium, Dresden Oct 2008 –Talk – Spiroc : a front-end chip to readout SiPM, L. Raux –Talk - PMF, front-end board for ATLAS luminometry, P. Barrillon –Poster – Parisroc : digital part of PM readout, F. Dulucq TIPP’09, Tskuba march 2009 –Talk – Parisroc for large neutrino detectors, G. Martin-Chassard –Talk - PMF, front-end board for ATLAS luminometry, P. Barrillon FEE’09 Montauk may 2009 –Invited talk – Hardroc and Spiroc, N. Seguin-Moreau –Invited talk – Parisroc, C. de La Taille

2 july 09 C. de La Taille - OMEGA administration council 49 Communication  Web site Provide up-to-date datasheets, application notes, firmware, etc.

2 july 09 C. de La Taille - OMEGA administration council 50 Teaching Gisèle Martin Chassard Supelec, analogue microelectronics, labs, 20h Nathalie Seguin-Moreau Master MIP, analogue electronics, lectures and training, ups, 9h Ludovic Raux ENSTA, digital electronics, training, 24h Christophe de La Taille Supelec, analogue electronics, lectures, training and labs, 40h Ecole calorimétrie Beijing 2009 Ecole Joliot Curie 2008 Stephane Callier ESIEE, RF&HF measurement, labs, 16h EFREI, mixed microelectronics, lectures and training, 30h ENSTA, digital electronics, training, 24

2 july 09 C. de La Taille - OMEGA administration council 51 Pole follow-up by LAL Commitee appointed by G. Wormser –M. Jaffre, P. Matricon, N. Seguin-Moreau, L. Serin (chair), C. de La Taille + direction ex-officio (F. Couchot) –Report given to G. Wormser beg. May –Presented to Conseil du Laboratoire LAL (15/5) –Possible implications on LAL Electronics organization –->new extended commitee to tackle the issue (nov 09) Main conclusions : –more support and communication needed from LAL’s direction –Less hierarchical layers –More support for tests –Infrastructure and maintenance priority

2 july 09 C. de La Taille - OMEGA administration council 52 Summary Strengths –Good international visibility –Organization of TWEPP conference –Good collaboration with CSNSM, IPNO & LLR (+others) –Good results to ANR calls –Additionnal manpower CDD 3D (Damien), CDD JEM EUSO Weaknesses –Complex tests, understaffed –Positionning inside LAL

2 july 09 C. de La Taille - OMEGA administration council 53 Questions & Comments

2 july 09 C. de La Taille - OMEGA administration council 54 Annexes Cost of ASICS Testboards Collaboration details

2 july 09 C. de La Taille - OMEGA administration council 55 Multi Project Run vs Dedicated Run HARDROC2: will be submitted in june 08 (MPW run) MPW: 1k€/mm 2 => Hardroc= 25 k€ –25 dies delivered in September 08, to be packaged –About 300 dies available (no guaranty): 100 euros/die + packaging –Price : 25 k€ € * nb_chips Engineering run: –Wafer 8’’ Available area= mm 2 -1 reticle=20x20 mm 2 =400 mm 2 -=> 65 reticles/wafer -16 chips (25 mm 2 ) / reticle => 1000 Hardroc/wafer -Cost : 150 k€ (masks) + 5k€/wafer - Price : 150 k€ + 5 € * nb_chips -valuable for more than 1250 chips

2 july 09 C. de La Taille - OMEGA administration council 56 TEST BOARD MAROC (COB) 64ch PM socket USB port GPIB port Control Altera

2 july 09 C. de La Taille - OMEGA administration council 57 Collaboration  Requests MAROC2/3 –ATLAS LUCID detector (Bologna) –Double Chooz (Nevis USA) –PET imaging with PMT64 (ISS Roma) –Medical imaging with SiPM matrixes (INFN Pisa) –KEK (1 TB) –Air shower imaging (EHWA Seoul) –Memphyno (APC) (5TB) –Russia (100 pc) –Valencia (1 TB) HaRDROC –Medical imaging Trecam (IMNC Orsay) –Xray satellite (CSNSM Orsay) –Pic du midi (200) SPIROC –PEB (Aachen) (spiroc0) (?) –Medical Roma –Medical Pisa –Mediacal Valencia –MEdical (GE) –PET (Siemens) –Vulkano Napoli –CLAS12 (IPNO) PARISROC –SNEMO : chip transfer to CAEN –IHEP Beijing (1 TB) –DUSEL (U Wisonsin ) –LENA ( –LAPP : chip transfer to LAPP

2 july 09 C. de La Taille - OMEGA administration council 58 Session fermée

2 july 09 C. de La Taille - OMEGA administration council 59 agenda Bilan et perspectives pour 2009 Périmètre du pôle OMEGA et intégration dans le LAL Cas particulier de microélectronique en dehors du pôle Cas de LSST, SuperNEMO, SuperB Participation a JEM-EUSO Besoins futurs prévisibles Prestations externes et start-up pour valorisation, partenariat avec MIND (C4I)wvasey

2 july 09 C. de La Taille - OMEGA administration council 60 Valorisation et interdisciplinarité Grands groupes d’imagerie médicale : –Siemens MI : Rencontre en automne 2008, partenariat envisagé pour intégrer des ASICs pour une caméra PET intégrée à un IRM. 2 cartes de test SPIROC fournies et une formation à l’utilisation de nos chips et de nos cartes de test. Opportunités pour étendre ce premier projet à un partenariat plus serré pour la fourniture d’ASIC pour l’imagerie (remplacement de l’électronique existante par des ASICs) – General Electrics research : Contact au printemps 2009 pour intégration d’ASICs pour une caméra PET intégrée à un IRM. Une carte de test SPIROC fournie. Nécessité urgente d’une structure a forte réactivité adaptée pour gérer ces projets

2 july 09 C. de La Taille - OMEGA administration council 61 Valorisation et interdisciplinarité Collaboration avec ISS Rome pour le développement de prototypes de nouvelle génération de mammographe. –Avec des MA-PMT (MAROC2) –Avec des SiPM (SPIROC1) Collaboration avec L’IMNC pour le développement d’une nouvelle camera PET (TRECAM)

2 july 09 C. de La Taille - OMEGA administration council 62 Valorisation et interdisciplinarité Projet de vulcanologie : analyse radiographique du Vésuve aux muons (INFN Naples, IPNL, Fermilab, …) –Une carte de test fournie pour le premier prototype –En contact depuis novembre 2008  Extension à d’autres volcans dangereux envisagée