Date of download: 6/6/2016 Copyright © ASME. All rights reserved. From: Three-Dimensional Integrated Circuit With Embedded Microfluidic Cooling: Technology, Thermal Performance, and Electrical Implications J. Electron. Packag. 2016;138(1): doi: / Schematic of 3D IC with microfluidic cooling Figure Legend:
Date of download: 6/6/2016 Copyright © ASME. All rights reserved. From: Three-Dimensional Integrated Circuit With Embedded Microfluidic Cooling: Technology, Thermal Performance, and Electrical Implications J. Electron. Packag. 2016;138(1): doi: / Optical and scanning electron microscopy image of the heat sink Figure Legend:
Date of download: 6/6/2016 Copyright © ASME. All rights reserved. From: Three-Dimensional Integrated Circuit With Embedded Microfluidic Cooling: Technology, Thermal Performance, and Electrical Implications J. Electron. Packag. 2016;138(1): doi: / Fabrication process of the heat sink sample Figure Legend:
Date of download: 6/6/2016 Copyright © ASME. All rights reserved. From: Three-Dimensional Integrated Circuit With Embedded Microfluidic Cooling: Technology, Thermal Performance, and Electrical Implications J. Electron. Packag. 2016;138(1): doi: / Flow loop schematic Figure Legend:
Date of download: 6/6/2016 Copyright © ASME. All rights reserved. From: Three-Dimensional Integrated Circuit With Embedded Microfluidic Cooling: Technology, Thermal Performance, and Electrical Implications J. Electron. Packag. 2016;138(1): doi: / Pin-fin array dimensions Figure Legend:
Date of download: 6/6/2016 Copyright © ASME. All rights reserved. From: Three-Dimensional Integrated Circuit With Embedded Microfluidic Cooling: Technology, Thermal Performance, and Electrical Implications J. Electron. Packag. 2016;138(1): doi: / (a) Heat transfer coefficient, (b) mean temperature difference from wall to fluid, (c) convective resistance, and (d)pressure drop for single-phase Figure Legend:
Date of download: 6/6/2016 Copyright © ASME. All rights reserved. From: Three-Dimensional Integrated Circuit With Embedded Microfluidic Cooling: Technology, Thermal Performance, and Electrical Implications J. Electron. Packag. 2016;138(1): doi: / (a) Local two-phase heat transfer coefficient, (b) boiling curve, (c) pressure drop, and (d) vapor quality Figure Legend:
Date of download: 6/6/2016 Copyright © ASME. All rights reserved. From: Three-Dimensional Integrated Circuit With Embedded Microfluidic Cooling: Technology, Thermal Performance, and Electrical Implications J. Electron. Packag. 2016;138(1): doi: / Flow visualization of sample 1 at 381 W Figure Legend:
Date of download: 6/6/2016 Copyright © ASME. All rights reserved. From: Three-Dimensional Integrated Circuit With Embedded Microfluidic Cooling: Technology, Thermal Performance, and Electrical Implications J. Electron. Packag. 2016;138(1): doi: / Three-dimensional interconnect link Figure Legend:
Date of download: 6/6/2016 Copyright © ASME. All rights reserved. From: Three-Dimensional Integrated Circuit With Embedded Microfluidic Cooling: Technology, Thermal Performance, and Electrical Implications J. Electron. Packag. 2016;138(1): doi: / Delay, wire length, and TSV capacitance versus (a) micropin-fin pitch and (b) TSV height Figure Legend:
Date of download: 6/6/2016 Copyright © ASME. All rights reserved. From: Three-Dimensional Integrated Circuit With Embedded Microfluidic Cooling: Technology, Thermal Performance, and Electrical Implications J. Electron. Packag. 2016;138(1): doi: / Delay and R CONV versus (a) micropin-fin pitch and (b) TSV height Figure Legend: