BCM electronics: status and plans BI forum (Feb. 10 th and 11 th 2016) Hooman Hassanzadegan ESS, BI section 1.

Slides:



Advertisements
Similar presentations
01/11/2002SNS Software Final Design Review1 V123S Event Link Encoder, Transmission System and PLL Receiver Thomas M. Kerner (BNL) SNS Global Controls.
Advertisements

On the development of the final optical multiplexer board prototype for the TileCal experiment V. González Dep. of Electronic Engineering University of.
The MAD chip: 4 channel preamplifier + discriminator.
Digital RF Stabilization System Based on MicroTCA Technology - Libera LLRF Robert Černe May 2010, RT10, Lisboa
26-Sep-11 1 New xTCA Developments at SLAC CERN xTCA for Physics Interest Group Sept 26, 2011 Ray Larsen SLAC National Accelerator Laboratory New xTCA Developments.
ESS LLRF System Anders J Johansson.
Test of LLRF at SPARC Marco Bellaveglia INFN – LNF Reporting for:
20 Feb 2002Readout electronics1 Status of the readout design Paul Dauncey Imperial College Outline: Basic concept Features of proposal VFE interface issues.
CMS WeekDec 2002E. Hazen HF Electronics Status Report E. Hazen, J. Rohlf, E. Machado Boston University.
6 June 2002UK/HCAL common issues1 Paul Dauncey Imperial College Outline: UK commitments Trigger issues DAQ issues Readout electronics issues Many more.
Drew and Bob’s Draft #1 Mechanical: sbc sits inside of 9u card, If SBC is 1 slot, the whole beta system is 1 slot SBC 9u PMC fpga fifos Basic design ideas:
Status of LAV FEE electronics G. Corradi, C. Paglia, D. Tagnani & M. Raggi, T. Spadaro, P. Valente.
Wir schaffen Wissen – heute für morgen 24 August 2015PSI,24 August 2015PSI, Paul Scherrer Institut Status WP 8.2 RF Low Level Electronic Manuel Brönnimann.
GEM Electronic System Status New releases of electronic boards: ◦ MPD v 4.0 ◦ Backplane 5 slot short (for UVa design) ◦ APV Front-End with Panasonic connector.
INTRODUCE OF SINAP TIMING SYSTEM
Leo Greiner IPHC testing Sensor and infrastructure testing at LBL. Capabilities and Plan.
DLS Digital Controller Tony Dobbing Head of Power Supplies Group.
LSST Electronics Review – BNL, January LSST Electronics Review BNL January Power & Voltage Plan R. Van Berg Electronics Mini-Review.
XFEL The European X-Ray Laser Project X-Ray Free-Electron Laser Dariusz Makowski, Technical University of Łódź LLRF review, DESY, 3-4 December 2007 Advanced.
Leo Greiner IPHC meeting HFT PIXEL DAQ Prototype Testing.
Zheqiao Geng 6/5/2012 Plan for Evaluating LLRF Deployment Solution at LCLS-II.
HBD FEM the block diagram preamp – FEM cable Status Stuffs need to be decided….
September 19-20, 2007 A.Zaltsman EBIS RF Systems RF System Overview Alex Zaltsman September 19-20, 2007 DOE Annual Review.
HBD FEM Overall block diagram Individual building blocks Outlook ¼ detector build.
SNS Integrated Control System Timing Clients at SNS DH Thompson Epics Spring 2003.
HBD FEE test result summary + production schedule 16mv test pulse result –5X attenuator + 20:1 resistor divider at input (to reduce the noise on the test.
Acquisition Crate Design BI Technical Board 26 August 2011 Beam Loss Monitoring Section William Vigano’ 26 August
Final FED 1 Testing Set Up Testing idea and current status Preliminary results Future development Summary M. Noy
March 9, 2005 HBD CDR Review 1 HBD Electronics Preamp/cable driver on the detector. –Specification –Schematics –Test result Rest of the electronics chain.
Update on final LAV front-end M. Raggi, T. Spadaro, P. Valente & G. Corradi, C. Paglia, D. Tagnani.
ESS LLRF and Beam Interaction. ESS RF system From the wall plug to the coupler Controlled over EPICS Connected to the global Machine Protection System.
Kay Rehlich xTCA RT2012 MicroTCA.4 Timing Distribution and Power Supply Issues.
How to Monitor Beam: Beam Current Monitors (for the Machine Protection Review) Hooman Hassanzadegan (ESS, BI section) ESS, Lund Date:
UK Neutrino Factory Meeting Front End Test Stand (F.E.T.S.) Engineering Status by P. Savage 22nd April 2009.
Connector Differential Receiver 8 Channels 65 MHz 12 bits ADC FPGA Receive/buffer ADC data Format triggered Events Generate L1 Primitives Receive timing.
HBD/TPC Electronics Status Works done to for a)Prototype detector readout b)Understand packing density and heat loading issues c)Address the overall system.
High Speed Digital Systems Lab Spring/Winter 2010 Project definition Instructor: Rolf Hilgendorf Students: Elad Mor, Ilya Zavolsky Integration of an A/D.
BPM stripline acquisition in CLEX Sébastien Vilalte.
1 Timing of the calorimeter monitoring signals 1.Introduction 2.LED trigger signal timing * propagation delay of the broadcast calibration command * calibration.
Mai 31th 2011 Christophe Beigbeder PID meeting1 ETD meeting Test setup : Activities in Bari, Univ of Maryland and at Orsay Test setup : Activities in Bari,
PXIE Beam Instrumentation Status Update – Preparing for MEBT 1.1 Beam Vic Scarpine Feb. 9, 2016.
X SuperB Workshop - SLAC Oct 06 to Oct 09, 2009 A.Cotta Ramusino, INFN Ferrara 1 SuperB IFR: outline of the IFR prototype electronics A.C.R
Readout controller Block Diagram S. Hansen - CD-1 Lehman Review1 VXO Ø Det Links to 24 SiPM Front End Boards Clock Event Data USB ARM uC A D Rd Wrt 100Mbit.
23/06/2011 Linac4 BCC meeting. 23/06/2011 Linac4 BCC meeting Watchdog = Machine protection element whose function is to cut the beam if losses exceed.
M. Munoz April 2, 2014 Beam Commissioning at ESS.
29/05/09A. Salamon – TDAQ WG - CERN1 LKr calorimeter L0 trigger V. Bonaiuto, L. Cesaroni, A. Fucci, A. Salamon, G. Salina, F. Sargeni.
SVD FADC Status Markus Friedl (HEPHY Vienna) Wetzlar SVD-PXD Meeting, 5 February 2013.
ESS Front End diagnostic
HF ROBOX PRR3 Apr 2003E. Hazen HF Front-End Electronics ● System Description – Overview – PMT Board, ROBOX, Patch Panel – Signal Cable, Front-end boards.
Krzysztof Czuba, ISE, Warsaw ATCA - LLRF project review, DESY, Dec , XFEL The European X-Ray Laser Project X-Ray Free-Electron Laser Master Oscillator.
ESS LLRF and Beam Interaction
Beam Interlock System SPS CIBU Connection Review
Injectors BLM system: PS Ring installation at EYETS
Ewald Effinger, Bernd Dehning
New xTCA Developments at SLAC
The ELENA BPM System. Status and Plans.
WP02 PRR: Master Oscillator and RF Reference Distribution
MicroTCA Common Platform For CMS Working Group
Front-end for BAMs Samer Bou Habib How to edit the title slide
Front-end electronic system for large area photomultipliers readout
RF Local Protection System
Report on ATF2 Third Project Meeting ATF2 Magnet Movers ATF2 Q-BPM Electronics Is SLAC ILC Instrumentation Group a good name?
BCM-BIS Interface Szandra Kövecses
Krzysztof Czuba ESS LLRF Quarterly Meeting
Safety, reliability and maintainability
Towards final BCM firmware and interface to MPS Hooman Hassanzadegan BI forum, Nov 2018, Lund
Electronics, motion control and verification
Status of the ESS High Power RF Systems
Response to the BCM PDR recommendations
Rack installation and local tests for the MEBT Chopper Rack
Presentation transcript:

BCM electronics: status and plans BI forum (Feb. 10 th and 11 th 2016) Hooman Hassanzadegan ESS, BI section 1

2 BCM no. and distribution Draft summary of BCM number per linac section

3 BCM requirements (general) 3

4 Extract from the L-4 BCM requirements 4

5 BCM requirements (MPS) 5

6 BCM requirements (Beam Physics, LLRF, BI) 6

77 Slide taken from Tom Shea’s presentation: Beam Instrumentation to Protect the ESS Linac, , CERN

88

9 Bergoz ACCT toroids Examples of Bergoz in-air (left) and flanged (right) ACCT toroids. Both sensors include a calibration winding. The later also includes shielding and ceramic break. With the current Bergoz design, the ceramic will be exposed to the beam (ex. after particles are deflected by quad). The ceramic may then break as a result of charge building up on it (happened two times at SNS as reported by Tom Shea). This can be prevented by putting a thin conductive plate in front of the ceramic leaving a little gap on one end so that it doesn’t make a path for the image current. Based on the current design, the calibration cable needs to be terminated in 100 Ohm near the toroid.

10 Mechanical integration ACCT integration into the DTL inter-tanks ACCT integration into the LWU Example of ACCT integration into the RFQ-MEBT interface (IFMIF)

11 BCM system layout Wrt the ACCT differential receiver, options include: -A custom RTM paired with a commercial AMC -A differential receiver FMC plugged onto a carrier AMC -A custom interface module matching the differential signal to a commercial RTM Current thinking is to provide two identical outputs for the “Drv” so that they can be fed in parallel into two AMCs for redundancy.

12 Bergoz front-end electronics The Bergoz front-end unit (i.e. ACCT-E-RM) converts the ACCT output current into a proportional voltage with a full-scale range of +/-10 V. It is important to connect the ACCT-E-RM output to high impedance. The ACCT-E-RM is supplied by a Bergoz +/-15 V power supply. Both the ACCT-E-RM and power supply are rail mount The front-end electronics should be installed in a small wall-mount box in the klystron gallery at the head of the RF stub.

13 Drv/Cal module The ACCT-E-RM output is fed into the Drv/Cal module that should sit next to the ACCT-E-RM and supplied by the same power supply. The Drv/Cal module will then convert the single-ended output of the ACCT-E-RM to differential and feed this signal into a CAT-8A cable that is terminated in 100 Ohm at both ends. The Drv/Cal module will also generate a calibration current pulse out of the digital calibration pulse from the RTM. The Drv/Cal module will then convert this pulse to have a fixed current and feeds it into the ACCT calibration winding. The Drv/Cal module will be a new development. Circuit schematics has been received form M. Werner (DESY) based on an ESS-DESY MoU and technical annex.

14 AMC/RTM Solution A – Struck (or similar) ADC/FPGA AMC to be paired with a custom RTM: Solution B – IOxOS (or similar) carrier AMC with a COTS differential receiver FMC: - Custom ACCT RTMor - Commercial RTM + custom interface module + +

15 Struck SIS8300-L specifications Ten 16-bit/125 MSPS ADC input channels 4x4 Gbit (default) DDR3 memory Two Gigabit transmitter/receiver SFP slots Two dedicated user clock inputs (TCLKA and TCLKB) 8 bidirectional differential interfaces to the backplane bus Virtex 6 FPGA

16 Redundancy by two ADC/FPGA modules in parallel. Beam destination has to be communicated to the ADC/FPGA modules (over backplane). This scheme assumes that valves are always open during beam operation. Signal splitter: the output of the ACCT-E box is connected to a dual output differential signal transmitter. Attention: a power supply with higher current may be necessary! RFQ LEBTMEBT DTL FCFC FCFC FCFC LEBT CHOP IS valve MEBT CHOP FCFC valve 1234>4 Beam destination: LEDP… 42.4? m 2.4? m6.4? m 10.0? m ADC/FPGA module BIS PERMIT SS SSS S S ADC/FPGA module FCFC S Faraday Cup Signal splitter at ACCT-E box Explanation: FCT Draft differential interlock layout provided by M. Werner (DESY) Differential ACCT layout (preliminary)

17 Baseline & droop Scaler Check shape Scaler Check shape Scaler Check shape Scaler Check shape Scaler Check shape Scaler Check shape Scaler Check shape Scaler Check shape Scaler Check shape Scaler Check shape Cross- bar- switch Diff- Interlock Permit handler BIS- Interface Manual calibration support From ADC BIS Test signals Data interface to DDR memory (provided by ESS) Serial Timing data receiver (provided by ESS) BCM Firmware block diagram (draft) V Not all connections are shown! provided by ESS / MPS Number of diff. Interlock stages: see description! FPGA pins MEBT chopper protection PERMIT BIS Backbone Trigger Draft BCM firmware block diagram layout provided by M. Werner (DESY)

18 Differential current measurement with the ACCTs differential ACCT signal transmission over differential lines differential ACCT signal transmission over optical fiber The implementation of the optical line needs significant effort. The idea is to start with the differential line that should be enough for down to the DTL end. The optical line can be added later for the downstream sections where the ACCT separation is much larger.

19 Based on the Bergoz ACCT specifications, the ACCT-to-FE cable length should not be longer than 25 m. In areas where this will not be possible, the FE electronics can be slightly modified by the manufacturer to allow longer cable lengths at the expense of degrading the ACCT response time, rise time and bandwidth to some degree. The ACCT-FE cable length is expected to be about 25 m in the LEBT and MEBT sections. The length then increases to about 35 m in the DTL and m in the high-energy end of the linac. ACCT cabling We need to talk to Bergoz to see how much the ACCT response will become slower as a result of the increased cable length.

20 Trigger/consistency check: Although the ACCT firmware will include a self-trigger mechanism that will trigger on the edge of the beam pulse, an external trigger will still be needed for the purpose of consistency check. The beam can then be stopped if the frequency of the trigger is not within the acceptable range, or if a beam pulse does not arrive shortly after each trigger. Beam/machine mode data: The beam/machine mode data need to be transferred to the ACCT readout electronics using the timing system. The ACCT readout electronics will know the expected pulse current/width from the beam mode and the expected beam destination from the machine mode. This information will then be used to correctly configure the electronics including the width of the averaging filters and the masking/unmasking of some interlocks. ADC clock: Although this is not strictly required, it is generally preferred that the ADC clock frequency be locked to RF. An external ADC clock of MHz (¼ of the MHz RF frequency) can be provided by the timing receiver module and transferred to the ACCT AMC through a dedicated clock line of backplane. Timing requirement for the electronics

21 An ACCT toroid should be delivered by Oct to Catania-Italy for the ESS LEBT (type and size should be confirmed by Catania). A pre-version of the LEBT ACCT firmware should to be developed and integrated into the generic Struck SIS8300-L firmware by the end of This pre-version will include MPS feature, but interfacing with the timing system and ACCT calibration is not foreseen for this version. The commercial electronics, including the MTCA chassis, power supply, CPU, MCH, Struck SIS8300-L and RTM should be procured and integrated by Oct > this may be postponed to the end of 2016 to match the firmware delivery date. Software development should go in parallel with the firmware and become available by the end of This effort can be minimized if an already-existing ACCT software could be modified and used for the new firmware. Assuming a commercial RTM (ex. SIS8900) will be used, a custom interface module should be provided to match the ACCT-E output to the RTM input. This can be a temporary solution until final boards become available. Test with the ion source and LEBT is planned to start in mid-March LEBT ACCT plan (next 15 months)

22 Supporting slides…

23 ACCT tests MTCA.4 demo crate hosting a Struck digitizer card and a RTM ACCT test setup (electronics lab.) TTL – LVDS converter board (trigger input for the digitizer)

24 EPICS integration and controls EPICS-integrated BCM GUI showing pulse current, charge and profile

25 MIS interface Based on the ESS MPS requirements, the MIS interface should consist of a beam_permit interface that is driven by the ACCT FPGA and a permit_test interface driven by the MIS. With the ACCT RTM option, both the both beam_permit and permit_test interface circuits will be implemented on the RTM. There will be one or two (for redundancy) of these interfaces on the ACCT RTM. Aggregation will then be done at firmware level. With the FMC option, the interface circuits should be replaced by another FMC with similar electrical specifications (details TBD). circuit schematics of the beam_permit and permit_test interfaces (source: ESS MPS group)