Newest Micropackaging Concepts Including MEMS & Photonics Ken Gilleo ET-Trends LLC Ken@ET-Trends.com © ET-Trends LLC

AGENDA Telecom Background Today’s Telecom Revolution Challenges & Opportunities Packaging & Assembly Issues Packaging Panorama Conclusions © ET-Trends LLC

Telecom History 30,000 BC: visual signals (pre-photonics) 3,000 BC: bond fires (battle victories) 1,000 BC: smoke signals (digital) 1775 AD: Paul Revere (low tech-photonics; digital) 1880 AD: Photophone (true photonics; analog) 1890 AD Marconi: radio (RF; digital) © ET-Trends LLC

Last 50 Years Radio improves Solid State invented/implemented Fiber optics made practical Cellular advances INTERNET – a major event! © ET-Trends LLC

Today’s Telecom Revolution Telecom surpasses computers as driver Internet bandwidth accelerates products More wireless products; Internet-able Everything gets more portable Convergence; phone, pager, computer, TV, radio, music All of this drives packaging innovation! Nokia © ET-Trends LLC

RF Wireless; Bluetooth, etc Long-Haul Fiber Backbone Net Centric Satellite RF RF Wireless; Bluetooth, etc Submarine Fiber Link amplifiers Free Space Photonics Long-Haul Fiber Backbone Metro Ring Loop Access Regional Ring gilleo Submarine Fiber Link © ET-Trends LLC World Wide Hub

Packaging Change Drivers Miniaturization Area Height Weight Performance High lead count High frequency; processors, RF MEMS/MOEMS; a new technology cluster Reduction Boost © ET-Trends LLC

Packaging Miniaturization Flip Chip FCOB (on board) FCIP (in package) CSP MultiChip Package Single plane Stacked © ET-Trends LLC

Flip Chip Trends Less than 20% are FCOB Virtually all high I/O chips are FCIP New underfills Molded (FCIP) No Flow (FCOB) Cost reduction continues Bumping Integral underfill © ET-Trends LLC

Chip Scale Packaging Flex-based doing well Wafer-level; strong trend Area molding reduces cost © ET-Trends LLC

MEMS & MOEMS * Old new paradox Traditional; simple; sensors Advanced; complex, embryonic Most important technology of 21st century? Major packaging challenge Many assembly issues Opto * Micro-Electro-Mechanical Systems © ET-Trends LLC

The Nano World Where all technology converges Optics Electronics The convergence point of electronics, mechanics, physics, chemistry and biology, etc. Electronics Mechanics MEMS MOEMS OE OM Biology Chemistry Optics © ET-Trends LLC Where all technology converges

Why MEMS? Semiconductor processing used Merges mechanical motion & electronics VERSATILE sensing computing motion control © ET-Trends LLC

MEMS Structures Ink jet IBM MEMS DNA Detector © ET-Trends LLC Electrostatic Relay - UW Grippers - UW

Applications © ET-Trends LLC

Packaging Challenges MEMS devices can be very fragile. pre-package handling concerns. post-handling issues; can be shock sensitive. Most require hermetic package ($$$). MOEMS (covered later) requires a window & controlled atmosphere. Biggest challenge: cost-effective, high volume packaging. © ET-Trends LLC

MEMS Packaging Types Traditional hermetic; metal or ceramic New Cap-on-Chip wafer-level device-level Near- and non-hermetic Selective packaging for accessibility © ET-Trends LLC

Cap-on-Chip (level-0) a Wafer-Level Process! Seal Vacuum MEMS Chip Can now be handled like an ordinary die - almost! © ET-Trends LLC

Cap-on-Chip Overmolding 1. Apply cap to device or wafer; solder, weld, bond. MEMS IC 2. Attach & bond device 3. Conventional overmolding followed by solder ball attach. © ET-Trends LLC

Cap-on-Carrier Silicon or Metal Cap Molded or Liquid Encapsulant MEMS IC Solder, weld, or polymer This packaging method is suitable for accelerometers, gyroscopes and other motion detectors that can be sealed. © ET-Trends LLC

MOEMS & Photonics Projection Mirrors Photonics Switches Gratings Micro-opto-electro-mechanical systems Projection Mirrors Photonics Switches Gratings Fiber Aligners Modulators, Shutters Movable Lenses A Market powered by the Internet! A Technology that will power the Internet! © ET-Trends LLC

TI MOEMS: Micro-Mirrors on off on World’s most complex machine! on on on off on 3 M Co. © ET-Trends LLC Ref. “Digital Light Processing TM for High-Brightness, High-Resolution Applications” Larry J. Hornbeck, Ti.com

MOEMS Micro-Mirror WINDOW HEAT SINK HERMETIC Getter Weld or seal Ceramic HEAT SINK HERMETIC 250,000 mirrors MEMS Digital Mirrors one section © ET-Trends LLC

Flip Chip for MOEMS? Light Pipe Encapsulant MEMS FLIP CHIP Underfill © ET-Trends LLC

MOEMS Window Cap? Optical Encapsulant Transparent Cap MOEMS © ET-Trends LLC

Assembly Issues Stiction Safe handling; some are shock sensitive Orientation; can be critical PWB & joint; changes affect MEMS sensitivity Testing; not well established for some devices Need free path for light, sound, molecules Stiction © ET-Trends LLC

(air bag sensor example) Stiction Problem (air bag sensor example) Stuck Analog Devices Chip Sensing Mechanism (Analog Devices) High surface area = high attraction = “STICTION” Result of rough handling = “dead” component © ET-Trends LLC

Assembly – New Rules? MEMS MOEMS, photonics All can change behavior Component skew Component non-coplanarity Solder joint mass and shape Flux residue More heat sensitive; lead-free problem? MOEMS, photonics Light path Fiber connection © ET-Trends LLC

Packaging Panorama Advanced BGAs Flex-Based MultiChip Array Molded CSP Wafer-Level © ET-Trends LLC

Some drawings from Joe Fjelstad 10 December 1996 TRENDS Time TO Can DIP Density/efficiency PQFP FC BGA Notes: CSP © ET-Trends LLC Some drawings from Joe Fjelstad 3 3

Flip Chip BGA © ET-Trends LLC

Thermally Enhanced FC BGA Heat Spreader Thermally Conductive Interface AMKOR © ET-Trends LLC IBM

Flex-BGA TapeArray™ BGA Singulated edge Mold Compound Die Attach Polyimide Tape Wire Bond TapeArray™ BGA Singulated edge © ET-Trends LLC

MultiChip Packages Single-Plane Stacked © ET-Trends LLC Drawings from Pacific Consultants, LLC

Area Molded for high throughput ChipArray® © ET-Trends LLC

Molded in strip format © ET-Trends LLC

CSPs © ET-Trends LLC µBGA is a registered trademark of Tessera, Inc. Shellcase NS µBGA is a registered trademark of Tessera, Inc. © ET-Trends LLC

Wafer Scale CSP Lower Cost CSP All processing on the wafer Fan-in structure Wafer Level Packaging: © ET-Trends LLC Shellcase

Conclusions Telecom is driving packaging & assembly Portability drives down size Performance drives up density New packages are smaller; 202s, FC, CSP Handling issues; size & fragility Catch the waves by learning & innovating © ET-Trends LLC