Arizona Space Grant Symposium

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Presentation transcript:

Arizona Space Grant Symposium Printed Circuit Board Design and Fabrication Techniques for the EagleSat CubeSat Lisa Ferguson Dr. Gary Yale Arizona Space Grant Symposium April 16, 2016

Overview Design and fabrication techniques for space-ready custom printed circuit boards Current research Design iteration management Fabrication considerations Engineering Model Space flight hardware

Design Process Schematic Board Layout Paper Model Functional Prototype Flight Hardware EagleSat-1 Functional Prototype

Revision Management Revision block attached to all schematics and board layouts All schematics and board layouts created in Diptrace

Schematic Iterative Process Team & Faculty Collaboration Many proto-schematics before official revision Schematics used for verification of board layout Proto-Schematic vs Schematic Revision

Board Layout Digital mockup of physical hardware Layout Considerations Center of Mass Fabrication Process Component Accessibility Full System Integration Board layout revisions as schematics evolve

Board Layout Communications Subsystem Revision 1 Revision 11

Paper Sizing Model 1:1 Scale Model Printed on Cardstock Cut to match dimensions Use: Part Sizing Full System Visualization Modeling and Demonstration Communication Board Paper Model

Engineering Model Professionally Fabricated PCB Follow space hardware assembly techniques Considerations: Shock & Vibration Complete Pad Connectivity Solder Joint Sterility Communications Functionality Prototype

Space Hardware Fabrication Class 10,000 Positive Pressure Laminar Flow Hood Ionization for ESD dissipation Soldering Microscope “Build a little, Test a little” Isopropyl Alcohol Sanitation Thermal Bake-out Space Hardware Fabrication Station

Correct Soldering Smooth, shiny surface Gentle wetting angle No icicling or cold joint fractures Achieved through proper temperature for appropriate duration Ideal Through Hole Solder Joint Ideal Surface Mount Solder Joint

Incorrect Soldering Copper Oxidization Mold Growth Incomplete Through-Hole Solder Joint Pad Shorting

Space Flight Hardware Professionally fabricated PCBs Complete bill of material ordered Two copies of each subsystem populated Earth Model Space Flight Model Handoff to NASA for pre-flight testing

Acknowledgements Dr. Gary Yale Jim Weber EagleSat Program Arizona Space Grant Consortium

Thank You for Listening Questions