R. Kluit Nikhef Amsterdam ET Nikhef Electronics Technology TGL Ruud Kluit 118-Apr-16.

Slides:



Advertisements
Similar presentations
Hybrid pixel: pilot and bus K. Tanida (RIKEN) 06/09/03 Si upgrade workshop Outline Overview on ALICE pilot and bus Requirements Pilot options Bus options.
Advertisements

SMART TEMPERATURE SENSOR digital temperature sensor
1 Program Introduction MDT Chamber Production Silicon Tracker Project Software & Physics Frank Linde (15’) Marcel Vreeswijk (25’) Nigel Hessey (25’) Stan.
Background: G Renee Managemen Corporation is a privately held engineering consulting firm located in Coconut Grove, Fl specializing in the design and development.
Kay Graf Physics Institute 1 University of Erlangen ARENA 2006 University of Northumbria June 28 – 30, 2006 Integration of Acoustic Neutrino Detection.
What disciplines students learn in Electrical and Computer Engineering Technology.
The LHCb Inner Tracker LHCb: is a single-arm forward spectrometer dedicated to B-physics acceptance: (250)mrad: The Outer Tracker: covers the large.
21 Sept 2009 Markus Friedl Electronics 1 Electronics 2 Machine Shop HEPHY Scientific Advisory Board Meeting.
Velo Module 0 minus minus Paula Collins. Investigating Module 0 thermal performance Baseline module design combines elements of different CTE (and Young’s.
By E. Anassontzis, A. Belias, E. Kappos, K. Manolopoulos, P. Rapidis on behalf of the KM3NeT Collaboration.
R. Kluit Electronics Department Nikhef, Amsterdam. Integrated Circuit Design.
Status ‘Si readout’ TPC at NIKHEF NIKHEFAuke-Pieter Colijn Alessandro Fornaini Harry van der Graaf Peter Kluit Jan Timmermans Jan Visschers Saclay CEA.
Bump Bonding and Thinning of Hybrid Pixel Detectors Kiyoshi Tanida (RIKEN) Johann M. Heuser (RIKEN) PHENIX upgrade workshop, Aug 2002 Contents Bump bonding.
18-Jan-021W. Karpinski System Test Design verification of petals and interconnect boards and control links without detectors a)mechanics b)electrical.
CMS Upgrade Workshop November Fermilab POWER DISTRIBUTION SYSTEM STUDIES FOR THE CMS TRACKER Fermilab,University of Iowa and University of Mississippi.
DCS TCSG November 10th 1999, H.J.Burckhart1 Status of the general purpose I/O system LMB u DCS Architecture u LMB u Local Monitor Box (LMB) u Concept u.
Signal Intel CDC Columbia, SC 11WW14 Hendrick, Matt R Gregory, Adam
Towards a Detector Control System for the ATLAS Pixeldetector Susanne Kersten, University of Wuppertal Pixel2002, Carmel September 2002 Overview of the.
PMF: front end board for the ATLAS Luminometer ALFA TWEPP 2008 – 19 th September 2008 Parallel Session B6 – Programmable logic, boards, crates and systems.
CaRIBOu Hardware Design and Status
Status report on MURAY telescope R&D
Engineering and Technology By Sean McIntee. Fiber Optic Communication System Five Parts: –Encoder/Modulator –Transmitter –Fiber –Detector –Demodulator.
U.S. Deliverables Cost and Schedule Summary M. G. D. Gilchriese U.S. ATLAS Review Revised Version November 29, 2000.
Status of SVD Readout Electronics Markus Friedl (HEPHY Vienna) on behalf of the Belle II SVD Collaboration BPAC October 2012.
Background Physicist in Particle Physics. Data Acquisition and Triggering systems. Specialising in Embedded and Real-Time Software. Since 2000 Project.
The LHCb Outer Tracker Front End, what does it look like and what is the status Talk for the LHCb Electronics Working Group /TS A Collaboration.
Status report on the development of a readout system based on the SALTRO-16 chip Leif Jönsson Lund University LCTPC Collaboration Meeting
AMS-RICH Detector. J. Berdugo – CIEMAT (Madrid, Spain) 1 AMS-02 Phase II Flight Safety Review AMS Ring Imaging CHerenkov PURPOSE: 1.Precise measurement.
Electromagnetism Introduction.
Jorgen Christiansen, CERN PH-ESE 1.  Spokes persons and Institute chair elected ◦ SP’s: ATLAS: Maurice Garcia-Sciveres, LBNL CMS: Jorgen Christiansen,
AMS HVCMOS status Raimon Casanova Mohr 14/05/2015.
Nikhef in MC-pad Els Koffeman Nikhef & University of Amsterdam.
07-Jan-2010 Jornadas LIP 2010, Braga JC. Da SILVA Electronics systems for the ClearPEM-Sonic scanner José C. DA SILVA, LIP-Lisbon Tagus LIP Group * *J.C.Silva,
Takeshi Matsuda LC TPC Collaboration March 5, 2008 TPC Endcap Materials.
Development of Pixel Phase 2 chip. Goals New Pixel Chip needed to go beyond the Phase 1 baseline chip – Should be the solution for Phase 2 pixel – Should.
Barcelona 1 Development of new technologies for accelerators and detectors for the Future Colliders in Particle Physics URL.
Compilation of Dis-/Advantages of DC-DC Conversion Schemes Power Task Force Meeting December 16 th, 2008 Katja Klein 1. Physikalisches Institut B RWTH.
CNESTEN Centre National de l’Energie, des Sciences et des Techniques Nucléaires B.P. 1382, R.P Rabat, Maroc fax : ,
CMS 1.Goal of the experiment CMS is a general purpose apparatus for LHC designed to study the physics of p-p collisions at the center-of- mass energy of.
Electronics Group in Zeuthen K.-H. Sulanke Liebenberg,
ATLAS DCS ELMB PRR, March 4th 2002, H.J.Burckhart1 Embedded Local Monitor Board ELMB  Context  Aim  Requirements  Add-ons  Our aims of PRR.
Juan Valls - LECC03 Amsterdam 1 Recent System Test Results from the CMS TOB Detector  Introduction  ROD System Test Setup  ROD Electrical and Optical.
GlueX Collaboration May05 C. Cuevas 1 Topics: Infrastructure Update New Developments EECAD & Modeling Tools Flash ADC VXS – Crates GlueX Electronics Workshop.
ATLAS DCS Workshop on PLCs and Fieldbusses, November 26th 1999, H.J.Burckhart1 CAN and LMB in ATLAS u Controls in ATLAS u CAN u Local Monitor Box u Concept.
Microelectronics for HEP A. Marchioro / CERN-PH-ESE.
Provocative. Who needs detector hardware (until 2025)? ATLAS LHCb KM3 ALICE Darwin/XENON ILC/CLIC Virgo/GW Auger ? medical imaging, beam therapy.
K.Wyllie, CERNIWORID 2004 Readout of the LHCb pixel hybrid photon detectors Ken Wyllie on behalf of the LHCb collaboration and industrial partners The.
G. Kieft Nikhef Amsterdam Electronics- Technology PMT tubes PMT bases PMT asic’s Automatic tester for PMT bases Camac test set-up for PMT tubes LeCroy.
1 FANGS for BEAST J. Dingfelder, A. Eyring, Laura Mari, C. Marinas, D. Pohl University of Bonn
R. Kluit Electronics Department Nikhef, Amsterdam. Integrated Circuit Design.
August 24, 2011IDAP Kick-off meeting - TileCal ATLAS TileCal Upgrade LHC and ATLAS current status LHC designed for cm -2 s 7+7 TeV Limited to.
1/20 LHCb upgrade, Jeroen van Tilburg Nikhef Jamboree, 14 Dec 2015 Preparing for the LHCb upgrade.
Electronics Department Amsterdam 5-July-2010 Sander Mos 1 Status and progress of NIK* Logic WPFL - 5 July 2010 Amsterdam * Network Interface Kit.
IMB-CNM interest in ILC We are a Microelectronics Institute, but with high interest in HEP activities Currently members of SILC Collaboration –Foreseen.
29/05/09A. Salamon – TDAQ WG - CERN1 LKr calorimeter L0 trigger V. Bonaiuto, L. Cesaroni, A. Fucci, A. Salamon, G. Salina, F. Sargeni.
Technology and R&D Summary and next steps Burkhard Schmidt.
Organizing future KM3NeT production 06-July-2010.
Knowledge Transfer at CERN
DAQ read out system Status Report
Technical Design for the Mu3e Detector
Development, manufacturing and commercialisation of precision equipment for science
WP microelectronics and interconnections
Introduction to Electronics
GlueX Electronics Review Jefferson Lab July 23-24, 2003
Front-end electronic system for large area photomultipliers readout
ERDIT – cost proposal.
SKILLS OF THE PROPOSER Type of partner
The LHCb Front-end Electronics System Status and Future Development
Manufacturing Processes
Perugia SuperB Workshop June 16-19, 2009
Presentation transcript:

R. Kluit Nikhef Amsterdam ET Nikhef Electronics Technology TGL Ruud Kluit 118-Apr-16

R. Kluit Nikhef Amsterdam ET Flex layer ~30% 25 positions: 6 MSc (1 PhD), 12 BEng, 5 Technicians. 2 Temp,+ outsourcing & short contracts Electronics technology 218-Apr-16

R. Kluit Nikhef Amsterdam ET Electronics Technology engineering competences 18-Apr-163

R. Kluit Nikhef Amsterdam ET Analog electronics Design Amplification, Sensor signal Digitization, controls systems, analog signal processing. Specific environments, e.g. vacuum, small volume, etc. Electro-magnetic interference qualification (EMC) 4 Advanced Virgo: Linear Alignment electronics 18-Apr-16

R. Kluit Nikhef Amsterdam ET Advanced Programmable logic; FPGA’s (0.5-2M FF’s) Multi-site project groups, =collaboration. High volume & high speed data transport. Hardware && Software ! Embedded Systems 5 LHCb Scifi: Front-end readout module. Km3Net: Readout & timing system: < 1ns accuracy in several km 3. (Digital electronics) 18-Apr-16

R. Kluit Nikhef Amsterdam ET Data Comm. & Fiber Optics 6 High speed data transport (E.g. 10Gbps) in DAQ systems Optical communication components & network design Km3Net Optical Network: =Nikhef design. Special components for critical environments: E.g. In radiation & under water. R&D on photonic-Integrated circuits Dedicated Lab for fiber optics. 18-Apr-16

R. Kluit Nikhef Amsterdam ET Advanced CMOS IC technologies Contribute to Systems On Chip (SOC) > 200M transistors Multi site projects (5->20 designers) E.g. CERN RD53: ATLAS & CMS common development IC design 7 ATLAS IBL FE-Chip : FEI4 87M tr. ET: readout part. Km3Net PMT’s; amplifier & HV generator IC’s (50k) (100% Nikhef development) R&D & medical: TimePix Pixel sensor IC’s Nikhef: Fast Time measurement. 18-Apr-16

R. Kluit Nikhef Amsterdam ET Printed Circuit boards High density & high frequency design. Production in Industry 818-Apr-16 Thermal behavior

R. Kluit Nikhef Amsterdam ET Km3Net optical data communication, PMT readout IC, HV. ATLAS DAQ ATLAS DAQ R&D Pixel Detector readout systems R&D Pixel Detector readout systems Virgo electronics Virgo electronics Pixel detector ICs; LHCb, ATLAS, ALICE, R&D Pixel detector ICs; LHCb, ATLAS, ALICE, R&D 9 LHCb Scifi Readout system LHCb Scifi Readout system Embedded systems (optical) Data-Communication Analog electronics IC-design PCB design Embedded systems (optical) Data-Communication Analog electronics IC-design PCB design + + Mechanical engineering + + Software engineering Detector R&D Apr-16 Summary: Outsourcing: -PCB production & assembly -Cable manufacturing -Series testing & manufacturing -”none core” design. Outsourcing: -PCB production & assembly -Cable manufacturing -Series testing & manufacturing -”none core” design. Tooling & Instrumentation: Design & simulation High-end: (advanced) High-Frequency instruments Tooling & Instrumentation: Design & simulation High-end: (advanced) High-Frequency instruments