GTK Controls and Safety Thermal results with the ceramic heater Kaitlin Howell, Georg Nüßle, Paolo Petagna,

Slow Controls / Safety December 2, 2011GTK Cooling Meeting2 EventEffectReaction Failure ASIC8 seconds until temperature stability (temp. liquid) No intervention for cooling needed Hydraulic FailureNo mass flow, temperature rises with 2.3°C/s Signal to power off ASICS Total Power Failure Temperature rises with 0.1°C/s No danger, module will slowly reach room temperature LeakagePollute vacuum in beamline Signal to close safety valves in beam line before and after GTK station

GTK Module Failure Scenarios December 2, 2011GTK Cooling Meeting3 Possible FailurePrevention / Check Geometry imperfections during microfabrication Hydraulic test to determine the pressure drop / mass flow characteristic NanoPort failure, bad gluingHydraulic test with 1.5 times nominal mass flow, Nanoports are rated to 35bar and we tested them up to 70 bar Bad thermal contact after gluing of sensor assembly and cooling plate Pass/fail hydraulic test with thermal camera (red lamp as heat source) Damage during mounting of sensor assembly and cooling plate Electric and hydraulic test of functionality after mounting onto PCB and wire bonding Misalignment between flange and sensor Document will accompany each module and contains the position of the sensor in respect to the flange

NanoPort Connectors December 2, 2011GTK Cooling Meeting4 NanoPort Assemblies are developed to provide consistent fluid connections for Lab-on-a-Chip devices. These fittings bond easily to chip: once attached, NanoPort connections withstand pressures up to 103 bar (35bar in our case). NanoPorts will adhere to silicon, quartz and glass, and they will handle 0.17 N-m to 0.68 N-m of torque, depending on the substrate (typical fittings require only 0.03 – 0.11 N-m to tighten). NanoPort components are made of inert, biocompatible PEEK™ polymer and perfluoroelastomer. And the design of these products eliminates the risk of adhesive contamination in the fluid path. NanoPort connections add no additional volume to a fluid path — eliminating dead volume normally associated with chip-based connections.

Stress cycles on Cool Assembly December 2, 2011GTK Cooling Meeting5

GTK Station replacement December 2, 2011GTK Cooling Meeting6 View from the cooling: Replacement of one module is estimated to take ca. 2h Cooling power can be provided within minutes after reconnection (cooling plant continues to run during replacement) Dominated by external factors: Access time after beam stop Reconnection of Electronics Reestablish vacuum