Genesis Technology USA, Inc. Heatsink Technologies November 2, 2015 1.

Slides:



Advertisements
Similar presentations
Thermal Management Considerations for PCBs
Advertisements

Press Forming By Lewis & Joe What Is Press Forming Where Is It Used In
Conduction Conceptests
Basic Refrigeration Cycle
Manchester 09/sept/2008A.Falou & P.Cornebise {LAL-Orsay}1 CALICE Meeting/ Manchester Sept 2008 SLAB Integration & Thermal Measurements.
Using Copper Water Loop Heat Pipes to Efficiently Cool CPUs and GPUs Stephen Fried President Passive Thermal Technology, Inc.
12.4 Linear Thermal Expansion
Extended Surfaces Chapter Three Section 3.6.
TOUGHENED GLASS FIBER REINFORCED BODY TOUGHENED GLASS FIBER REINFORCED BODY ONE PIECE BODY FOR OPTIMUM INTEGRITY ONE PIECE BODY FOR OPTIMUM INTEGRITY STANDARD.
Part-C Main topics B1- Electronics cooling methods in industry Heat sinks and cold plates for electronic cooling "Heat sinks" Heat pipes in electronic.
Optimal Fin Shapes & Profiles P M V Subbarao Associate Professor Mechanical Engineering Department IIT Delhi Geometrical Optimization is the Basic Goal.
GCSE Valley College Name: Applying New Technologies: Investigating Engineering Products How is a Casio watch in manufactured: Materials.
Surface Mount Device Soldering Materials by Linz Craig.
1-D Steady Conduction: Plane Wall
Overview Test Interface (TIU PCB‘s) are extremely expensive.
Heat Sink Selection Thermal Management of Electronics
Design of Heat Sinks P M V Subbarao Mechanical Engineering Department IIT Delhi Success Based on Cooling Challenges …….
The Cooling System.
Lab-1,Week 1, EML 3016 C- Spring 2003 Electronic Device Cooling A thin (assume zero thickness) electronic chip has a square shape of an area 5x5 cm 2,
Adapted from “Cooling Systems” – CTAE Information Technology Essentials PROFITT Curriculum.
Energy efficiency – in focus. Design and Efficiency – DELL™ AX4-5 2 Power consumption:345 Watt* Heat emission:1535 BTU/h* Power consumption a TB:38,3.
ME421 Heat Exchanger and Steam Generator Design Lecture Notes 6 Double-Pipe Heat Exchangers.
INTRODUCTION Definition:
Chapter 30 Processes Used to Condition Plastic Materials.
IP The plug © Oxford University Press 2011 The plug.
Heat Transfer Equations For “thin walled” tubes, A i = A o.
Heating Systems.
Lecture 12 Different types of extrusion and their characteristics
© International Rectifier DirectFET  MOSFETs Double Current Density In High Current DC-DC Converters With Double Sided Cooling.
Building a PC. Motherboard Selection Ensure the selected motherboard is appropriate for the processor model and frequency you are planning to use AMD.
Submerged PC Cooling By: Patrick Hague Geoffrey Clark Christopher Fitzgerald Group 11.
LiH Casting & Testing1 Lithium Hydride Disc Casting & Testing Approaches C. M. Lei March 2, 2007.
ⓒ 2013 Zalman Tech Co., Ltd. CNPS2X CNPS2X Mini-ITX CPU Cooler Sales Guide.
LASOR research supported under DARPA/MTO DoD-N Program Award Number W911NF Packaging Emily F. Burmeister, Walter Yuen, Henrik N. Poulsen, John.
IPC Stress Relief Lands and terminals shall be located by design so that components can be mounted or provided with stress relief bends in.
Electronics Enclosures
IPC Thermal Transfer Components, which for thermal reasons require extensive surface contact with the board or with a heatsink mounted on the.
Heat Transfer from Extended Surfaces Heat Transfer Enhancement by Fins
Cooling Systems. High temperatures can shorten the life expectancy of electronic components. High temperatures can shorten the life expectancy of electronic.
What is a Microprocessor ? A microprocessor consists of an ALU to perform arithmetic and logic manipulations, registers, and a control unit Its has some.
The Cooling System.
Heat Transfer Equations For “thin walled” tubes, A i = A o.
Pressure A measure of the amount of force exerted on a surface area A measure of the amount of force exerted on a surface area.
Computer Hardware Components. Cases There are desktop cases and tower cases.
Cooling System Get the engine up to optimum operating Temperature as quickly as possible and maintains it at that temperature. Controls the heat produced.
HEAT TRANSFER Problems with FEM solution
Air conditioning is a combination of activities such as conditioning the air i.e., heating or cooling, ensuring air.
Heatsink Technologies. Overview  As board-mounted chips grow in speed, the demand for shielding the chip has become increasingly more desirable to meet.
Types of Door Closers. A door closer is a device that is fixed onto a door, to automatically close the door when it is opened.
AFE BABALOLA UNIVERSITY
AAVID’S NEW ONLINE THERMAL DESIGN TOOL
Thermally managing high power devices using heat pipe assemblies
Date of download: 10/3/2017 Copyright © ASME. All rights reserved.
Ultra Quiet CPU Cooler CNPS80F Sales Guide
TEMPERATURE DISTRIBUTION ACROSS THE EXTENDED SURFACE
INTRODUCTION : Convection: Heat transfer between a solid surface and a moving fluid is governed by the Newton’s cooling law: q = hA(Ts-Tɷ), where Ts is.
Challenges of vacuum chambers with adjustable gap for SC undulators
Thermal energy transfer: Cooling
P08441:Thermoelectric Auto Exhaust Power Generation
ECE Engineering Design Thermal Considerations
Written by Tim Keyser Georgia CTAE Resource Network 2010
Effect of Using 2 TE units on Same Heat Sink
Dr John Fletcher Thermal Management Dr John Fletcher
CAPRI Cables Private Limited
Hydraulic & Pneumatic Systems
THERMODYNAMIC IN ELECTRONICS
Heat transfer Chapter 7.
Power Trench® Dual CoolTM
Written by Tim Keyser Georgia CTAE Resource Network 2010
How to design the size of heatsink
Presentation transcript:

Genesis Technology USA, Inc. Heatsink Technologies November 2,

2 As board mounted chips grow in speed, the need for shielding the chip has become an increasing need to meet global regulatory guidelines. When chips need to be shielded as well as requiring a heatsink, this presents a problem that is not ideal for shielding or heat transfer. A popular way to remove heat from a shielded area is to add a heatsink on top of the shield cover. This is a very inefficient way to remove heat from the chip. The shield is typically made with cold rolled steel and steel is not a very efficient conductor of heat. The most effective way to remove heat from a chip is direct contact between the heatsink and the chip. Genesis has come up with a unique way to remove heat from chips that need cooling as well as shielding. Overview

Typical Heatsink Application November 2, Heainks need to be mounted directly to the heat producing chip for the most tsefficient removal of heat from the device. Heatsinks are mounted on a chip in various ways. - Thermal Adhesive -Solder Pins -Push Pins with springs -External clips For heatsinks to function at their most effective level there needs to be constant pressure applied to interface between the heatsink and chip. Therefore the most efficient cooling is accomplished by using an external clip or push pins with springs.

Heatsink Styles November 2, Heatsink with push pin attachment

Heatsink Styles, continued November 2, Heatsink solder pin attachment Heatsink with thermal adhesive attachment

Heatsink Styles, continued November 2, Heatsink with external clip

Heatsink Styles, continued November 2, In addition to different mounting styles for heatsinks, heatsinks can come with different styles of fins. The style of fin affects the performance as well as price. Heatsinks have fins and the fins are the method by which the heatsink removes heat from a device. The fins have different shapes depending on the manufacturing method. Basic fin styles are: -Straight fins -Straight fins with cross cut -Straight fins with cross cuts to form pin fins -Pin Fins -Elliptical shaped fins -Heatsink with attached fan -Heatsink with embedded copper slug or heat pipe

Heatsink Styles, continued November 2, Each type of fin has it advantages. -Straight fins: The least expensive type of fin to produce. Its limits are limited surface area to dissipate heat. -Straight fins with cross-cut: This type of fin adds cost but has the advantage of additional surface area to help with heat dissipation. -Straight fins with cross-cuts to form pin fins: This type of fin has even more surface area but comes with additional cost. -Pin fins: This type of fin had a lot of surface area and one additional advantage of being not dependent on fin orientation. This type will have higher tooling costs and would be more suited to high volume assemblies. -Elliptical fins: This type of fin also has a lot of surface area but relies on the fin shape and airflow to help dissipate heat. Tooling costs are high for this type. -Heatsink with embedded copper: This type of heatsink is used to help with higher power devices and can be applied to all the fin types listed above. -Heatsink with attached fan: This type of assembly is used for high power devices.

Heatsink Styles, continued November 2, Heatsink with Straight fins and Cross cut Heatsink with Straight fins

Heatsink Styles, continued November 2, Heatsink with Straight Style Fins and cross cut to form pin fins Heatsink with Pin Style Fins

Heatsink Styles, continued November 2, Heatsink with fanHeatsink with elliptical fins

Heatsink Styles, continued November 2, Heatsink with embedded copper Heat pipe or heat slug

Genesis Heatsink/Shield solution November 2, Here is an example of Genesis heatsink design that solves the heat transfer problem from high speed chips that are shielded. This method has a two piece shield over the chip and a cutout in the shield cover that allows the heatsink to touch the chip directly. This is a much more efficient method to remove heat from the chip as compared to mounting a heatsink on top of a shield. DDR3 memory is also inside the shield. See example below.

Genesis Heatsink/Shield solution November 2, These two examples show direct contact bosses for the heatsink to touch the chip directly. The example on the left is for steel cased chips and the one on the right is for glass topped chips. The construction of the boss is designed to prevent any damage to the glass during assembly.

Genesis Heatsink/shield Solution, continued November 2, Another style heatsink that utilizes the sink as a shield cover and thermal gap filler material to contact the chip directly. EMI gasket material is applied on the perimeter.

General Heatsink Comments November 2, Most heatsinks are custom designed for each customer/application -Quick turnaround for design and production parts -Low-cost tooling