EE588 : Semiconductor Manufacturing Equipment and Systems Course Introduction Dr. Stephen Daniels Dublin City University
Course Objectives 1.The student will learn how to design and implement statistical and advanced process control schemes 2.Understanding of the of the design and control of the primary families of equipment used in 3.Specify the appropriate metrology 4.Explore fundamental facilities issues including vacuum technology, gas handling, and water and waste management. 5.Analyse and optimize process flow through the factory and the needs of the specific tool sets.
Course Information Primary resource will be Moodle page Moodle page updated at least weekly, usually on Wednesdays Accompanying website with useful information Each week I will be posting some questions for you to consider Assignment (50%) A mixture of: – Presentation slides – Audio ‘lectures’ – Recorded guest lectures – Recommended reading Case Studies Independent research and learning ‘Textbook: Fundamentals of Semiconductor Manufacturing and Process Control' by Gary S. May and Costas J. Spanos. Published by John Wiley & Sons 2006
Motivation Informed by ITRS Roadmap, Competitive and Technological Capability Requirements of Industrial Partners Drift and Perturbations in process condition can lead to functional and parametric yield loss Several contributors to chemical instabilities including recombination rates at surfaces, out-gassing events, interactions with substrate being processed Robustness of models and control systems requires detailed understanding of sources of error and drift Need to measure important parameters and characterise process
Course Structure : 5 Themes
Theme 1: Data Variance Probability Principal Components Statistical Process Control Advanced Process Control Yield
Theme 2: Design & Reliability Architecture Design for Reliability Tool Lifecycle Vacuum Technology Control Systems Axiomatic Design
Theme 3: Metrology In-Line Metrology Offline Metrology Sensors Information Integration Virtual Metrology
Theme 4: Environmental Footprint Water Fab Facilities Sensors Energy Chemicals Waste Optimisation
Theme 5: Integration Thermal Budget Tool Integration Matching Process Flow Run-to-Run Control
Semiconductor Equipment Categories Wafer Manufacturing/Wafer Processing Fab Facilities Equipment Mask/Reticle Equipment Surface Conditioning/Clean and Dry Resist processing Equipment Expose and Write Etch Equipment Ion Implant Equipment Sputter Equipment Thermal Processing Equipment Chemical Mechanical Planarization (CMP) Chemical Vapor Deposition (CVP) Inspection Measurement Assembly and Packaging Equipment SOC & Logic Test Equipment Memory Test Equipment Handlers Probe Equipment
Top 10 semiconductor capital equipment companies Gartner Report 2010
Semiconductor Processing Tool Requirements Reliability Throughput Resource Usage Capability Defect Density Safety Yield Footprint Cost of Consumables Repeatability Reproducability Maintainability