LG Semicon Co.,Ltd 표준번호 (STD. NO.) 개정 (Rev.) 면매수 (Page) / LG 반도 체 LGS(40)-A- 2501 LGS(40)- 품 119 Rev.3 0 3.1 ASSEMBLY NOTIFICATION ITEM DESCRIPTIONCONTENTS.

Slides:

Advertisements

Similar presentations

The 8051 MicroController In this module, we will be discussing the MCS-51 family of microcontroller, in particular the 8051, which is the generic IC representative.

Advertisements

Chapter 4 I/O Port Programming

Interconnect Terminal Naming Walter Katz Signal Integrity Software, Inc. IBIS ATM January 9, 2015.

ASE Flip-Chip Build-up Substrate Design Rules

به نام خدا.

Out2 silk screen assembly H. Wieman revised Jan 30, 2009 for aluminum silkscreen frame with 5 mm dowel pins.

Hong Xiao, Ph. D.www2.austin.cc.tx.us/HongXiao/Boo k.htm 1 Chapter 2 Introduction of IC Fabrication Hong Xiao, Ph. D.

1 CCD RAIN (PHOTONS) BUCKETS (PIXELS) VERTICAL CONVEYOR BELTS (CCD COLUMNS) HORIZONTAL CONVEYOR BELT ( SERIAL REGISTER ) MEASURING CYLINDER (OUTPUT AMPLIFIER)

CSE241 VLSI Digital Circuits Winter 2003 Lecture 15: Packaging

Chapter Hardware Connection and Intel Hex File

Interconnection in IC Assembly

Microcontroller 8051.

The 8051 Microcontroller Architecture, Programming and Applications

The Role of Packaging in Microelectronics

The 8051 Microcontroller architecture

Diode Packages Strip line & Micro strip line mounting HMICs mounting

PIC microcontrollers. PIC microcontrollers come in a wide range of packages from small chips with only 8 pins and 512 words of memory all the way up to.

Lab 3 page 1 ENT-DIGI-210 Lab 3 Notes ©Paul Godin Updated September 2007.

Moon – jun young. Index  Introduce product  Semiconductor product manufacturing process Wafer backgrinding Wafer saw Die attach Mold Mark.

On/Off Temp Holiday Select Fan Air clean Operation Auto SwingRoom Temp Week Select SET/CLR Hour MIN Timer Program Set Fan Speed Jet Cool Cancel RESET E_Heater.

Company Profile of Well-Hand Electronics Co., Ltd.

General Semiconductor Packaging Process Flow

Copper CMP Planarization Length - MRS April 19 th, 2001 – Paul Lefevre – Page 1 DIRECT MEASUREMENT OF PLANARIZATION LENGTH FOR COPPER CHEMICAL MECHANICAL.

MCS-51 Hardware Interfacing

The 8051 Microcontroller and Embedded Systems

MOBILE OPERATING ROBOT ON EMBEDDED SYSTEM

An Introduction to Microcontroller (Hardware Specification) Lec note 4

LBNL CCD Packaging “Yale Mount” Mechanical Analysis Dan Cheng LBNL.

Basic Digital Logic 2 Combinational Logic

CHAPTER HARDWARE CONNECTION. Pin Description 8051 family members ◦ e.g., 8751, 89C51, 89C52, DS89C4x0) ◦ Have 40 pins dedicated for various functions.

Dummy and Pad Chips Needed for various activities (interconnection tests, mass tests, assembly,…) Production of masks, processing, thinning and dicing.

Fabrication Technology(1)

Foundry Characteristics

Norhayati Soin 05 KEEE 4426 WEEK 12/1 3/13/2005 KEEE 4426 WEEK 12 CMOS FABRICATION PROCESS.

Low Mass Rui de Oliveira (CERN) July

The 8051 Microcontroller Prepared By, R-THANDAIAH PRABU M.E.,

CIT 673 Created by Suriyong1 Micro controller hardware architechture.

Presented by Sadhish Prabhu

Terra-Pixel APS for CALICE Progress meeting 10 th Nov 2005 Jamie Crooks, Microelectronics/RAL.

Chapter Microcontroller

Regulatory overview for PV systems. Plot Plan Example (Accepted by utility rejected by zoning board)

1ICC Proprietary MEMS DEVICE WAFER LEVEL PACKAGING TECHNICAL PRESENTATION Customer Device Wafer.

Microcontroller based Traffic signal Umer Butt Amna Rashid Izza Rabbani Rozab Naveed Ramesha Akram.

2 March 2012Mauro Citterio - SVT Phone meeting1 Peripheral Electronics Some updates Mauro Citterio INFN Milano.

WATER LEVEL INDICATOR AND AUTOMATIC MOTOR SWITCHING SYSTEM

Wire Pull Test The wire pull test is performed using a Pull Tester (BT-14, DAGE 2400 PC, DAGE 4000) and a Pull Hook (performed by placing the hook 90°

塑封产品流程工艺简介 - TO220 - SOD/SOT Date: Prepared By: Pinky Zhang.

Sensors Pixel dimension 300 x 300 μm2 Standard p-in-n sensors

The 8051 Microcontroller architecture

8051 Pin - out PORT 0 PORT 1 PORT 2 PORT 3.

Available detectors in Liverpool

Bonding study of wrapping part of PA1/2

Basic Digital Logic.

Sensor Wafer: Final Layout

The 8051 Microcontroller.

8051 MICROCONTROLLER MODULE IV

(Electrical Engg 6th Semester)

بسم الله الرحمن الرحيم الموضوع:الوضوء صفته وفرائضه وسننه

The 8051 Microcontroller (8 bit )

Microcontroller 8051 Made By: Arun Branch. 4th Sem. I&C Engg.

The 8051 Microcontroller and Embedded Systems

8051 Microcontroller.

First Design Key board R L S.

UNIT-VIII 8051 Microcontroller Architecture Register set of 8051

Silicon pixel detectors and electronics for hybrid photon detectors

The 8051 Microcontroller (8 bit )

CHAPTER HARDWARE CONNECTION.

UCSB Dicing, Wire-Bonding and Board Assembly

PROCESSORS & CONTROLLERS

Presentation transcript:

LG Semicon Co.,Ltd 표준번호 (STD. NO.) 개정 (Rev.) 면매수 (Page) / LG 반도 체 LGS(40)-A LGS(40)- 품 119 Rev ASSEMBLY NOTIFICATION ITEM DESCRIPTIONCONTENTS DEVICE DEVICE NAMEGMS90C58/56/54,GMS90L58/56/54 FUNCTION8BIT MICRO COMPUTER UNIT APPLICATIONCOMMERCIAL MAX. CURRENTTBD MAX. POWER DISSIPATION WAFER CHIP PATTERN NAME PASSIVATIONYES WAFER THICKNESS (B/G 후 ) 400um BACKSIDE METALNO CHIP CHIP SIZE( without S/L)2710um * 3520um SCRIBE LANE WIDTHX:170um, Y: 170um MIN. PAD SIZE90um * 90um PACKAGE PACKAGE TYPE40PDIP, 44MQFP, 44PLCC PRE MOLD BAKENOT REQUIRED PADDLE SIZE 40PDIP WIRE Ag PLATINGLEAD FRAME TYPE 44MQFP 44PLCC 200 * 200 MIL 217 * 217 MIL 230 * 230 MIL DIE ATTACHEPOXY 40PDIP/44PLCC 44MQFP GOLD 1.0 MIL ** ) FLAT ZONE 을 기준으로 한 1 번 PAD 의 위치 1 GMS90C58/56/54,GMS90L58/56/54 TBD

LG Semicon Co.,Ltd 표준번호 (STD. NO.) 개정 (Rev.) 면매수 (Page) / LG 반도 체 LGS(40)-A LGS(40)- 품 119 Rev PIN CONFIGURATION PDIP GMS90C52B GMS90C58/L58 GMS90C56/L56 GMS90C54/L VCC P0.0/AD0 P0.1/AD1 P0.2/AD2 P0.3/AD3 P0.4/AD4 P0.5/AD5 P0.6/AD6 P0.7/AD7 EA ALE PSEN P2.7/A15 P2.6/A14 P2.5/A13 P2.4/A12 P2.3/A11 P2.2/A10 P2.1/A9 P2.0/A T2/P1.0 T2EX/P1.1 P1.2 P1.3 P1.4 P1.5 P1.6 P1.7 RESET RXD/P3.0 TXD/P3.1 INT0/P3.2 INT1/P3.3 T0/P3.4 T1/P3.5 WR/P3.6 RD/P3.7 XTAL2 XTAL1 VSS ( P-DIP-40)

LG Semicon Co.,Ltd 표준번호 (STD. NO.) 개정 (Rev.) 면매수 (Page) / LG 반도 체 LGS(40)-A LGS(40)- 품 119 Rev MQFP GMS90C58/L58 GMS90C56/L56 GMS90C54/L P1.5 P1.6 P1.7 RESET RXD/P3.0 N.C. TXD/P3.1 INT0/P3.2 INT1/P3.3 T0/P3.4 T1/P3.5 WR/P3.6 RD/P3.7 XTAL2 XTAL1 VSS N.C. P2.0/AD8 P2.1/AD9 P2.2/AD10 P2.3/AD11P2.4/AD12 P2.5/AD13 P2.6/AD14 P2.7/AD15 PSEN ALE N.C. EA P0.7/AD7 P0.6/AD6 P0.5/AD5 P0.4/AD4 P0.2/AD2P0.1/AD1P0.0/AD0VCCN.C.P1.0/T2P1.1/T2EXP1.2P1.3P1.4P0.3/AD3 (P-MQFP-44)

LG Semicon Co.,Ltd 표준번호 (STD. NO.) 개정 (Rev.) 면매수 (Page) / LG 반도 체 LGS(40)-A LGS(40)- 품 119 Rev PLCC GMS90C58/L58 GMS90C56/L56 GMS90C54/L P1.5 P1.6 P1.7 RESET RXD/P3.0 N.C. TXD/P3.1 INT0/P3.2 INT1/P3.3 T0/P3.4 T1/P3.5 WR/P3.6 RD/P3.7 XTAL2 XTAL1 VSS N.C. P2.0/AD8 P2.1/AD9 P2.2/AD10 P2.3/AD11P2.4/AD12 P2.5/AD13 P2.6/AD14 P2.7/AD15 PSEN ALE N.C. EA P0.7/AD7 P0.6/AD6 P0.5/AD5 P0.4/AD4 P0.2/AD2 P0.1/AD1 P0.0/AD0VCCN.C.P1.0/T2P1.1/T2EXP1.2 P1.3 P1.4P0.3/AD3 (P-LCC-44)

LG Semicon Co.,Ltd 표준번호 (STD. NO.) 개정 (Rev.) 면매수 (Page) / LG 반도 체 LGS(40)-A LGS(40)- 품 119 Rev (0,0) 3.3. BONDING PAD 좌표 (40pdip 기준 ) * Remarks) PAD 좌표는 PAD 의 center 지점임. * 좌표 기준점

LG Semicon Co.,Ltd 표준번호 (STD. NO.) 개정 (Rev.) 면매수 (Page) / LG 반도 체 LGS(40)-A LGS(40)- 품 119 Rev LAYOUT PLOTTING 1 1

LG Semicon Co.,Ltd 표준번호 (STD. NO.) 개정 (Rev.) 면매수 (Page) / LG 반도 체 LGS(40)-A LGS(40)- 품 119 Rev BONDING DIAGRAM PDIP GMS90C um *3520um GMS90C

LG Semicon Co.,Ltd 표준번호 (STD. NO.) 개정 (Rev.) 면매수 (Page) / LG 반도 체 LGS(40)-A LGS(40)- 품 119 Rev MQFP GMS90C58 1

LG Semicon Co.,Ltd 표준번호 (STD. NO.) 개정 (Rev.) 면매수 (Page) / LG 반도 체 LGS(40)-A LGS(40)- 품 119 Rev PLCC GMS90C58 1