Hans-Günther Moser, PXD PXD Summary 1 PXD Sessions: Highlights 1)Sensor production 2) EMCM (& bump bonding) 3)System Simulations 4)Power Supplies and Services.

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Presentation transcript:

Hans-Günther Moser, PXD PXD Summary 1 PXD Sessions: Highlights 1)Sensor production 2) EMCM (& bump bonding) 3)System Simulations 4)Power Supplies and Services 5)Results Hybrid 5 6)Background: Synchrotron Radiation 7)AOB

Hans-Günther Moser, PXD PXD9 2 1 st batch 13 wafers In production 2 nd batch 18 wafers Not yet started

Hans-Günther Moser, PXD PXD9 Processing 3

Hans-Günther Moser, PXD Next Steps 4

Hans-Günther Moser, PXD Changes since PXD6 5 Even-odd effect due to shadowing of an implantation Changed order of processing sequence Still there, but does not change with irradiation unirradiated irradiated evenodd

Hans-Günther Moser, PXD Extra Pads for Testing 6 Could be simplified to speed up testing, however loss of information

Hans-Günther Moser, PXD New Operation Range 7

Hans-Günther Moser, PXD SOI qualification for 2 nd batch 8 Test diodes produced with Shin Etsu wafers: ok, qualified for production Batch 2 can be started as soon as possible (train staff)

Hans-Günther Moser, PXD EMCM 9 ~ 70 mm SUSS Probe station PA200 equipped with 2 flying probes ● SUSS Semi-automatic probe PH600 ● Cascade Semi-automatic probe PH510 (max range 25 mm) First wafer will be tested by a company in a few days: then populate with ASICs and test!

Hans-Günther Moser, PXD EMCM assembly and test jig 10 Ready 2 nd week of March

Hans-Günther Moser, PXD Bump Bonding at CNM 11 Nice progress But still some problems to solve….. => controlled dispensing of tacky flux => exercise.. Enough components for training available Need hot ASICs for first real EMCMs by end of February (e.g. 20 Switcher)

Hans-Günther Moser, PXD DHP testing with probe-card 12 DHP availability: few, ~ 15 could buy more chips (for 16k€) wait for DHP 1. T (too late?) rework old chips -

Hans-Günther Moser, PXD Simulations 13 Propose working group meeting on simulations before end of February

Hans-Günther Moser, PXD Power Supplies cm Kapton for EMCM ordered

Hans-Günther Moser, PXD Hybrid 5 15 Test of complete ASIC chain! 160MHz

Hans-Günther Moser, PXD Background 16

Hans-Günther Moser, PXD Radiation 17 Occupancy and radiation dose not negligible but tolerable Bur: synchrotron radiation still missing! By the way: could we calculate radiation dose / luminosity and plot the total dose as function of the integrated luminosity (takes into account ramping up – but not initial effects due to beam tuning!) 1 Belle-year = 1.6 sny => 0.25 Mrad/(ab)-1 => /ab All but synchrotron radiation)

Hans-Günther Moser, PXD Synchrotron Radiation LER 18 Or 1.2 % since normalised to full ladder?

Hans-Günther Moser, PXD Synchrotron Radiation 19 LER: 0.6 % (essentially in one module) HEL: 0.5 % (more or less uniform) Max occupancy: 0.9% + 0.6% + 0.5% = 2% For me this is too close to the limit. We need more safety margin! Radiation damage: only 1/1000 of the photons convert in the oxide (90nm/75µm x ratio absorption coefficients) However, all the gamma energy is deposited 1% occupancy => 0.5 Mrad/year (back on the envelop, Norbert and myself) Again: not neglicable! assumption: gammas are at 5keV, silicon oxide transparent at higher energies However; HER background seem to be at higher energies…. Need spectrum! Is this it? What about misalignment, halo….. Can we fight it at the source (last way out: gold)

Hans-Günther Moser, PXD Omissions 20 Cooling: MARCO progressing next: transfer lines, cooling mockup Software: tracking, alignment……. DAQ (ATCA and DHH) Fibre aligments sensors Installation and remote vacuum seal Test beam analysis ASIC: DHP in 65nm And and and

Hans-Günther Moser, PXD Questions 21 Temperature diode on switcher, balcony or DEPFET ? DHP 65nm design review meeting early March -> can we have such meetings also for the other ASICs Switcher: bumping by AMS or elsewhere? Test of Hybrid 5 and DHH (important for test beam in May) Noise of DHP at 320 MHz, problems with few ADC channels High priority: EMCM pre-testing, assembly (flip chip) and testing  Important in order to start metal layers on PXD9  Finalize design of metal layers! Missed milestone: was September 2012 Assemble & test PXD6 module for combined test beam Missed milestone: was December 2012

Hans-Günther Moser, PXD 22 Thanks to the Giessen team for hosting this great workshop!