3 차원 구조의 고집적 charge trap 플래시 메모리 개발 1/12 2015 년 xx 월 xx 일 School of EE, Seoul National University 대표 학생김승현 과제 책임자박병국 교수님.

Slides:



Advertisements
Similar presentations
18 July 2001 Work In Progress – Not for Publication 2001 ITRS Front End Process July 18, 2001 San Francisco, CA.
Advertisements

DRAFT - NOT FOR PUBLICATION 14 July 2004 – ITRS Summer Conference ITRS FEP Challenges Continued scaling will require the introduction of new materials.
Savas Kaya and Ahmad Al-Ahmadi School of EE&CS Russ College of Eng & Tech Search for Optimum and Scalable COSMOS.
Embedded Systems Design: A Unified Hardware/Software Introduction 1 Chapter 10: IC Technology.
Floating Gate Devices Kyle Craig.
COEN 180 Flash Memory.
Circuit Modeling of Non-volatile Memory Devices
6.1 Transistor Operation 6.2 The Junction FET
Options investigated in GOSSAMER
Metal Oxide Semiconductor Field Effect Transistors
Sistemi Elettronici Programmabili1 Progettazione di circuiti e sistemi VLSI Anno Accademico Lezione Memorie (vedi anche i file pcs1_memorie.pdf.
Derek Wright Monday, March 7th, 2005
Digital Integrated Circuits A Design Perspective
GRAPHENE TRANSISTORS AND MEMORY. MOORE’S LAW THE PROBLEM 1. Reduction in saturation mode drain current. 2. Variation in Carrier velocity. 3. Modification.
Introduction to CMOS VLSI Design Lecture 3: CMOS Transistor Theory David Harris Harvey Mudd College Spring 2004.
Introduction to CMOS VLSI Design Lecture 5 CMOS Transistor Theory
VLSI Design CMOS Transistor Theory. EE 447 VLSI Design 3: CMOS Transistor Theory2 Outline Introduction MOS Capacitor nMOS I-V Characteristics pMOS I-V.
Introduction to CMOS VLSI Design Lecture 18: Design for Low Power David Harris Harvey Mudd College Spring 2004.
S. Reda EN160 SP’07 Design and Implementation of VLSI Systems (EN0160) Lecture 32: Array Subsystems (DRAM/ROM) Prof. Sherief Reda Division of Engineering,
Introduction to CMOS VLSI Design Lecture 0: Introduction
Introduction to CMOS VLSI Design Lecture 3: CMOS Transistor Theory
EE4800 CMOS Digital IC Design & Analysis
Chap. 5 Field-effect transistors (FET) Importance for LSI/VLSI –Low fabrication cost –Small size –Low power consumption Applications –Microprocessors –Memories.
Lecture 7: Power.
Lecture 0: Introduction. CMOS VLSI Design 4th Ed. 0: Introduction2 Introduction  Integrated circuits: many transistors on one chip.  Very Large Scale.
Introduction Integrated circuits: many transistors on one chip.
Lecture 19 OUTLINE The MOSFET: Structure and operation
Z. Feng VLSI Design 1.1 VLSI Design MOSFET Zhuo Feng.
Chapter 07 Electronic Analysis of CMOS Logic Gates
Performance Challenges of Future DRAM´s SINANO WS, Munich, Sept. 14th, 2007 M. Goldbach / J. Faul.
1 Review Of “A 125 MHz Burst-Mode Flexible Read While Write 256Mbit 2b/c 1.8V NOR Flash Memory” Adopted From: “ISSCC 2005 / SESSION 2 / NON-VOLATILE MEMORY.
Class 02 DICCD Transistors: Silicon Transistors are built out of silicon, a semiconductor Pure silicon is a poor conductor (no free charges) Doped.
PROJECT GUIDE GROUP MEMBERS Dr.B.GOPI,B.E.M.E.Ph.D P.MENAKA G.NIVEDHA M.PAVITHRA M.POORNIMA G.PRIYA 1.
Washington State University
Design of Advanced Erase Mechanism for NOR Flash EEPROM Amit Berman, June 2006 Intel Corporation.
11-1 Integrated Microsystems Lab. EE372 VLSI SYSTEM DESIGNE. Yoon Latch-up & Power Consumption Latch-up Problem Latch-up condition  1   2 >1 GND Vdd.
Dynamic Memory Cell Wordline
COEN 180 Flash Memory. Floating Gate Fundamentals Floating Gate between control gate and channel in MOSFET. Not directly connected to an outside line.
CMOS VLSI Fabrication.
EE 466/586 VLSI Design Partha Pande School of EECS Washington State University
Data Retention in MLC NAND FLASH Memory: Characterization, Optimization, and Recovery. 서동화
Z. Feng MTU EE4800 CMOS Digital IC Design & Analysis 6.1 EE4800 CMOS Digital IC Design & Analysis Lecture 6 Power Zhuo Feng.
Source-gated Transistor Seokmin Hong. Why do we need it? * Short Channel Effects Source/Drain Charge Sharing Drain-Induced Barrier Lowering Subsurface.
Introduction to CMOS Transistor and Transistor Fundamental
Memory (Contd..) Memory Timing: Definitions ETEG 431 SG.
Introduction to CMOS VLSI Design CMOS Transistor Theory
반도체 메모리 구조의 이해 Koo, Bon-Jae Dec. 5, 2007.
EE586 VLSI Design Partha Pande School of EECS Washington State University
Introduction to MOS Transistors
Introduction to CMOS VLSI Design Lecture 0: Introduction.
Microelectronic Circuit Design McGraw-Hill Chapter 4 Field-Effect Transistors Microelectronic Circuit Design Richard C. Jaeger Travis N. Blalock.
EE314 IBM/Motorola Power PC620 IBM Power PC 601 Motorola MC68020 Field Effect Transistors.
UNIT II : BASIC ELECTRICAL PROPERTIES
MOS Field-Effect Transistors (MOSFETs)
Subject Name: Fundamentals Of CMOS VLSI Subject Code: 10EC56
20-NM CMOS DESIGN.
Chapter 1 & Chapter 3.
6.3.3 Short Channel Effects When the channel length is small (less than 1m), high field effect must be considered. For Si, a better approximation of field-dependent.
Information Storage and Spintronics 09
Lecture 19 OUTLINE The MOSFET: Structure and operation
Chapter 10: IC Technology
VLSI Lay-out Design.
Introduction to 3D NAND Dec 1st, 2011 Semiconductor.
V.Navaneethakrishnan Dept. of ECE, CCET
Chapter 10: IC Technology
Chapter 10: IC Technology
Beyond Si MOSFETs Part 1.
Information Storage and Spintronics 08
Presentation transcript:

3 차원 구조의 고집적 charge trap 플래시 메모리 개발 1/ 년 xx 월 xx 일 School of EE, Seoul National University 대표 학생김승현 과제 책임자박병국 교수님

연구 성과 요약 (’10.07~’15. 06) 1. 참여 기간 : ~ 현재 2. 전략산학 장학생 현황 : 정성헌, 김장현, 박의환, 김승현, 김성준 ( 총 5 명 ) 3. 대표 연구 주제 : - Gated Twin-Bit (GTB) SONOS 제안 및 구현 - Gated Multi-Bit (GMB) SONOS 제안 - Retention characteristics caused by charge loss in Charge trap memory 분석 5 년간 전략산학 연구 성과 결산 2/12

3/12 대표 논문 Review 논문 제목 : - Stacked Gated Twin-Bit (SGTB) SONOS Memory Device for High-Density Flash Memory 논문 내용 : -3 차원 구조의 고집적 charge trap 플래시 메모리인 gated twin-bit SONOS memory 제안. 하나의 cut-off gate 와 각 wordline 마다 두개의 memory node 를 가지 는 특징을 지니고 있다. 집적도를 더욱 높이기 위해 ver tical 방향으로 poly silicon gate 를 집적할 수 있다. 저널 정보 : - 저널명 : IEEE TRANSACTIONS ON NANOTECHNOLOGY

4/12 Gated Twin-Bit (GTB) SONOS Introduction BL1 BL2 BL3 WL1WL2WL3 2F BL1 BL2 BL3 WL1WL2WL3 2F BL1 BL2 BL3 WL1 WL2 2F WL3 WL4 WL5 WL6 2F Conventional NAND array : 1 bit per 4F 2 Folded NAND array : 2 bit per 4F 2 Disadvantage : large feature size F  2 WL and isolation space is required. Gated Twin-Bit (GTB) NAND array : 2 bit per 4F 2

Program Operation of Gated Twin-Bit Array 5/12 Program operation … SSL CUT- OFF1 WL1 DSL BL CUT- OFF64 WL64 BL’ BL BL’ BL BL’ … SSL CUT-OFF1 WL1 DSL BL’ CUT-OFF 64 WL64 BL ON V DD ON0 V V DD 0 V boosted CUT-OFF n WL n … OFF PGM Inhibit WL1WL2WL3 CUT1CUT2CUT3 DSLSSL 0 V 3 V AA’ Vpgm Vpass

Read Operation of Gated Twin-Bit Array 6/12 Read operation CONTROL LINE READ (WL2) WL1(unselected)HIGH WL2(selected)0 V WL3(unselected)HIGH Cufoff-G1HIGH Cufoff-G2HIGH Cufoff-G3HIGH SSLHIGH L side of BL1(selected)GNDV DD R side of BL1(selected)V DD GND L side BL2(unselected)GND R side BL2(unselected)GND SubstrateGND V DD GND READ reverse reading FORWARD, REVERSE READ SCHEME : similar to NROM (NOR Flash) … SSL CUT-OFF1 WL1 DSL BL’ CUT-OFF 64 WL64 BL ON V DD 0 V CUT-OFF n WL n … ON READ V PASS 0 VV PASS … SSL CUT-OFF1 WL1 DSL BL’ CUT-OFF 64 WL64 BL ON 0 V V DD CUT-OFF n WL n … ON READ V PASS 0 VV PASS

Read Operation of Gated Twin-Bit Array 7/12 Read operation (Node L read condition : V BL = 2V, V control = 0 V) 11 state 00 state Node L Node R 01 state Node LNode R 10 state Node L Node R L node = 40 nm CUT-OFF n WL n 0 V 2 V 0 V 2 V 00PP 01PE 10EP 11EE 10 state : drain induced barrier lowering  Effect of node R decrease.

Measurement of fabricated device 8/12 Cut-off gate characteristics  Current flow is absolutely blocked when 0 V is applied to the Cut-off gate The channel is cut successfully between the left and right side of the control gate. Separate programming is possible.

Measurement of fabricated device 9/12 Control gate characteristics with drain voltage  V T difference increases as the V D increases  imply the barrier lowering # Simulation data If same amount of charge is injected with fabricated device, L node (nm)3040Fabricated device V T,F -V T,R (V)  L node of fabricated device is estimated at 4x nm. (V D =2 V)

Measurement of fabricated device 10/12 Control gate characteristics: 2 bit expresssion ERS PGM  V T of 11,10 state and 01,00 state is clearly distinguished. : Twin-bit operation is verified.

Gated Multi-Bit (GMB) SONOS Array 11/12 Gated Multi-Bit (GMB) Gated Twin-Bit (GTB) 1. Minimum silicon trench width = 2 × (ONO thickness) + polysilicon gate thickness 2. Thin silicon pillar thickness  leakage current  Limit to extreme scaling down of feature size (F) bit 1 bit 2 bit 3 bit 4 bit 5 bit 6 bit 7 bit 8  2×n bit / 4F 2 (n = the number of the stacked layers)  Single crystalline channel with stacked gates Transactions on Nanotechnology, March, 2012

향후 계획 5 년간 주요 연구 성과 - Gated Twin-Bit (GTB) SONOS 제안 및 구현 - Gated Multi-Bit (GMB) SONOS 제안 - Retention characteristics caused by charge loss in Charge trap memory 분석 12/12