H.-G. Moser Max-Planck-Institut für Physik PXD EVO 21/10/ Barcelona Summary Thanks to our hosts for UB for a great meeting!

H.-G. Moser Max-Planck-Institut für Physik PXD EVO 21/10/ Software/Simulation Conclusions  Optimization using tracks intimately connected to tracking Tracking Task Force initiated to develop new C++ code (pattern recognition and track fitting). But: code will come too late for the optimization studies  Initial studies use single tracks, chain within ILC frame working Pattern recognition being studied to minimize tracking bias  Preparation of optimization for physics: „real“ test with vertices  Alignment software (Millipede) successfully tested with Belle MC  PXD Data Reduction using SVD (rz projection) promising New initiative: Tracking Task Force Single Track Optimization Preparation of Optimization for Physics Alignment Data Reduction Christian Kiesling

H.-G. Moser Max-Planck-Institut für Physik PXD EVO 21/10/ DEPFET

H.-G. Moser Max-Planck-Institut für Physik PXD EVO 21/10/ Electronics and System DCD various improvements (single sampling, transimpedance) Switcher 4: use HV-CMOS (0.35 µm): up to 50V DHP: ¼ test chip designed (Bonn) Slow control part: Barcelona Submission: Feb 2010 Online clustering: Some date reduction Really needed? DHH: first ideas -> find space Record 4x1024 rows of raw data(4 frames). plus 1x pedestal? Trigger ID –8bit(may be obsolete), Frame ID -8bit Latency for upto 1024 rows before trigger Configuration through JTAG protocol standard(IEEE) Boundary scan test included through JTAG Temperature measurement Single bit error protected memories + triple redundant registers High speed CML output using Aurora protocol 5 operating modes – DO NOTHING/TEST/STORE DATA TO MEM/NORMAL AQUISITION / SEND MEM Peter Fischer

H.-G. Moser Max-Planck-Institut für Physik PXD EVO 21/10/ Test beam Marcel Vos

H.-G. Moser Max-Planck-Institut für Physik PXD EVO 21/10/ Interface to Belle II IR status (Masako Iwasaki) -nano beam -1cm beam pipe -Rotation angle ? -Beam gas background (100x)? -Toucheck -Schedule: early installation? -Grounding: work started -Service routing: collect information and request space at KEK

H.-G. Moser Max-Planck-Institut für Physik PXD EVO 21/10/ Thermal and mechanical design Deformation monitor (Ivan Vila) Mechanics (Frank Simon) Study of water cooling as alternative Cooling studies in Barcelona, Karlsruhe and MPI Check if results are consistent Diamond up or down? Use of TPG disfavoured Thermal Mock-ups needed! H.-J. Simons

H.-G. Moser Max-Planck-Institut für Physik PXD EVO 21/10/ Interconnection/Module L. Andricek

H.-G. Moser Max-Planck-Institut für Physik PXD EVO 21/10/ Interconnection/Module

H.-G. Moser Max-Planck-Institut für Physik PXD EVO 21/10/ Test systems/Testing of PXD6 Good preparation essential How long can we keep ‘test beam mode’? Mini Matrix setup (P. Kodys, Prague) Characterisation system (M. Koch, Bonn) PXD6 test preparation (J. Nonkovich, MPP) 1.Setups have to be ready on time! 2.Many things have to happened in parallel ! 3.High level of synchronization is necessary to achieve results in the required time ! 4.We have to work in the Test beam mode for 6-7 months!!! Wafers finished Jun 2010  Next production (FINAL!) starts Jan 2011 We have only 4-5 months for the testing !!! J. Ninkovic

H.-G. Moser Max-Planck-Institut für Physik PXD EVO 21/10/ Jelena Ninkovic, MPI für Physik, HLL 11 Hardware we need till March Wafer level testing – Munich task – J. Ninkovic - Automatic Z contact adjustment ? 2.Dynamical measurements »128 channel : oHybrid : 1DCD and 1 Switcher (2 channels) – Munich task C. Koffmane oPitch adapter Bump-bonding ↔wire bonding for DCD and Switchers – Heidelberg task C. Kreidl oNew adapter chip for the existing FPGA? - Heidelberg task C. Kreidl oNew power supply (upgrade) - Bonn task J. Schneider oDAQ software – Bonn task - S.&J. Furletov(a) oFPGA board – Bonn task – M. Koch »Start testing the new read out using PXD5 chips and have S3B system as backup for PXD6 testing

H.-G. Moser Max-Planck-Institut für Physik PXD EVO 21/10/ Jelena Ninkovic, MPI für Physik, HLL 12 Bonded structures : Dynamic measurements »All Si Module: oDHP or some alternative for testing of the modules »Mini matrices: o4 structures on 5x5 mm 2 chip different channel length same other geometry onew hybrid with LCC carrier with window and socket with possibility to change any of the 4 – Munich task C. Koffmane osystem almost ready »Single pixel setup o exists fully – requires transfer of knowledge only

H.-G. Moser Max-Planck-Institut für Physik PXD EVO 21/10/ Action List September 8 Proposed Actions  Determine length of the straight section of the beam pipe: Masako-san  Follow up on beam gas background (x100 is far too much):Masako-san  Outer Radius of the beam pipe: Masako-san (done 1cm)  Need data on non-ionising radiation background to estimate SEU tolerance needed. Check available data from SVD2 (but they may not be relevant for us) -> not seen at Belle Contact Tsuboyma-san (Hans-Günther)  Reliability of gold-solder bumps: Christian Kreidl to contact PACTEC -> see Barcelona  DCD size and footprint, consequences for DHP: -> done  EOS Geometry: Forward information to mechanics and IR groups (Hans Krüger, Frank Simon, Hans-Günther Moser). Done, feedback from IP design needed.  Current ratings in Hans-Krüger’s list: check and update (Hans Krüger, Ivan Peric, Rainer Richter). DHP data will be added soon. Make sure that Ivan’s update is in the list (on Wiki) ?  Parameter List for cooling studies: Carlos Marinas. - done  Organize parameter documents on Wiki. Are they consistent? How to organize updates? ->done  Organize an EVO meeting of the cooling WG to discuss cooling option, and organize the work (Christian Kiesling) -> done (needs regular follow up meetings?)  Task list for (physics) simulations (different geometries). From mechanics/cooling WG In work?  Contact Inna Grigorieva because of TPG: Hans-Jürgen Simonis, Stefan Heindl, Hans-Günther Moser. -> done  Single sampling option: implementation in DHP  Improve simulation of digitizer (tune to test beam data  Design and produce metal dummies for PXD6 and final module (interconnection tests)  Alternative to Hirose connector/design kapton flex  Low mass jount for 2nd layer  Service routing: requirements (x-sction, length, location)  Preparations for PXD6 testing (Jelena‘s list)