News from the 1m 2 GRPC SDHCAL collection of slides from : Ch.Combaret, I.L, H.Mathez, J.Prast, N.Seguin, W.Tromeur, G.Vouters and many others.

Slides:



Advertisements
Similar presentations
Julie Prast, DHCAL Meeting, 24 janvier 2008 La carte DIF pour DHCAL (proto au m 2 et au m 3 ) Sebastien Cap, Julie Prast ( LAPP) Christophe Combaret (IPNL)
Advertisements

Vincent Boudry Franck Gastaldi Antoine Matthieu David Decotigny CALICE meeting 19 feb Kyungpook Nat'l U., Daegu, Korea Status of the Data Concentrator.
PXL RDO System Requirements And meeting goals 11/12/2009BNL_CD-1_SENSOR_RDO - LG1.
Micromegas for a DHCAL LAPP, Annecy Catherine Adloff Jan Blaha Sébastien Cap Maximilien Chefdeville Alexandre Dalmaz Cyril Drancourt Ambroise Espagilière.
CALICE – 12/07/07 – Rémi CORNAT (LPC) 1 ASU and standalone test setup for ECAL MAIA BEE project Overview DAQ dedicated Sensor test In situ debug and maintenance.
CALICE meeting Prague 2007, Hervé MATHEZ 1 DHCAL PCB STUDY for RPC and MicroMegas (Electronics recent developments for the European DHCAL) William TROMEUR,
CALICE ECAL/AHCAL Electronics 5-6 July DESY L.Caponetto, H.Mathez 1 Developments and Planning towards 1 m 3 Technological DHCAL Prototype Didier.
Normal text - click to edit RCU – DCS system in ALICE RCU design, prototyping and test results (TPC & PHOS) Johan Alme.
Tuesday September Cambridge1 GDCC “next replacement of the LDA” Franck GASTALDI.
Main Board Status MB2 v1 for FATALIC & QIE 10/06/2015Roméo BONNEFOY - LPC Clermont1 Roméo BONNEFOY François Vazeille LPC Clermont-Ferrand.
C. Combaret TILC april m2 GRPC Acquisition System C. Combaret, IPN Lyon For the EU DHCAL collaboration
14 Sep 2005DAQ - Paul Dauncey1 Tech Board: DAQ/Online Status Paul Dauncey Imperial College London.
C. CombaretCalice week at UT Arlington, march 2010 SDHCAL status in lyon - Power pulsing, DAQ and m3 C. Combaret, for the IPNL team.
C. Combaret 14 jan 2010 SDHCAL DAQ status in lyon C. Combaret, for the IPNL team.
AHCAL – DIF Interface EUDET annual meeting – Paris Oct M. Reinecke.
AHCAL electronics. Status and Outlook Peter Göttlicher for the AHCAL developers CALICE meeting UT Arlington, March 11th, 2010.
08/10/2007Julie Prast, LAPP, Annecy1 The DHCAL DIF and the DIF Task Force Julie Prast, LAPP, Annecy.
Catherine Adloff16 June 2009 CALICE Technical Board 1 DHCAL-MICROMEGAS Yannis KARYOTAKIS For the LAPP group.
C. Combaret DIF_GDIF_MDIF_D ASU 6x 24 HR2 ASU USB Hub RPi USB2 DCC SDCC RPi USB 1 hub+Rpi for 4 cassettes 1 DCC for 8 cassettes (1 spare) Trigger.
C. Combaret 11/10/ 2008 Status of the DHCAL m2 software C. Combaret IPNL.
J. Prast, G. Vouters, Arlington, March 2010 DHCAL DIF Status Julie Prast, Guillaume Vouters 1. Future CCC Use in DHCAL Setup 2. Calice DAQ Firmware Implementation.
Detector Interface (DIF) Status CALICE meeting – DESYDec Mathias Reinecke.
R&D for single gap -Use the HARDROC ASICs, SiGe technology (well tested and available) HARDROC : 64-channel, 2-bin readout (3 comparators, 3 thresholds),
Monday December DESY1 GDCC news Franck GASTALDI.
Mathias Reinecke CALICE week Manchester DIF development – Status and Common Approach Mathias Reinecke for the CALICE DAQ and Front-End developers.
Maurice Goodrick, Bart Hommels EUDET Annual Meeting, Ecole Polytechnique, Paris EUDET DAQ and DIF DAQ overview DIF requirements and functionality.
C. Combaret 27 jan 2010 SDHCAL Power pulsing tests status in lyon C. Combaret, for the IPNL team.
17-19/03/2008 Frédéric DULUCQ Improvements of ROC chips VFE - ROC.
STAR Pixel Detector readout prototyping status. LBNL-IPHC-06/ LG22 Talk Outline Quick review of requirements and system design Status at last meeting.
CALICE meeting LYON 2009, Hervé MATHEZ Yannick ZOCCARATO 1 PCB DEVELOPMENTS AT IPNL (PCB and ASIC) PCB for 1m2 of RPC with HR2 William TROMEUR, Hervé MATHEZ,
ASU boards for RPC detectors Production status. Presentation outline Active Sensor Unit electronic board for GRPC detectors – quick reminder – board functional.
European DHCAL development European DHCAL development CIEMAT,IPNL,LAL, LAPP,LLR, PROTVINO, SACLAY CIEMAT,IPNL,LAL, LAPP,LLR, PROTVINO, SACLAY Status :
Julie Prast, Calice Electronics Meeting at LAL, June 2008 Status of the DHCAL DIF Detector InterFace Board Sébastien Cap, Julie Prast, Guillaume Vouters.
Maurice Goodrick, Bart Hommels CALICE-UK Meeting, Cambridge CALICE DAQ Developments DAQ overview DIF functionality and implementation EUDET.
14th january 2010 Actual Micromegas USB DAQ ASU and DIF
Catherine Adloff28 Jan 2008 SiD Collaboration Meeting 1 DHCAL and MICROMEGAS at LAPP Catherine Adloff Franck Cadoux Sébastien Cap Cyril Drancourt Ambroise.
DHCAL Jan Blaha R&D is in framework of the CALICE collaboration CLIC08 Workshop CERN, 14 – 17 October 2008.
HaRDROC performance IN2P3/LAL+IPNL+LLR R. GAGLIONE, I. LAKTINEH, H. MATHEZ IN2P3/IPNL LYON M. BOUCHEL, J. FLEURY, C. de LA TAILLE, G. MARTIN-CHASSARD,
12/09/2007Julie Prast, LAPP, Annecy1 The DIF Task Force and a focus on the DHCAL DIF Remi Cornat, Bart Hommels, Mathias Reinecke, Julie Prast.
AHCAL Electronics. Status of Integration Mathias Reinecke for the DESY AHCAL developers AHCAL main and analysis meeting Hamburg, July 16th and 17th, 2009.
CALICE/EUDET FEE status C. de LA TAILLE. 31 aug 2009 EUDET SC meeting Status of JRA3 Front End Electronics 2 ILC front-end ASICs : the ROC chips SPIROC.
CALICE/EUDET FEE status C. de LA TAILLE. 16 jun 2009 TB meeting FNAL ASICs for CALICE/EUDET 2 First generation ASICs Readout of physics prototypes (ECAL,
SKIROC status Calice meeting – Kobe – 10/05/2007.
Proto micromegas au LAPP 14 november 2008The DHCAL Board for the m2 and m3 prototype1 ASU DIF Inter DIF terminaison FPC USB Test Vendredi dernier….
DHCAL Acquisition with HaRDROC VFE Vincent Boudry LLR – École polytechnique.
CALICE DAQ Task Force Launch meeting
DIF – LDA Command Interface
Status of the DHCAL 1m2 GRPC Acquisition
EUDET Elec/DAQ meeting
CALICE DAQ Developments
The European DHCAL status
ASU board: PCB production and testings
Digital Interface inside ASICs & Improvements for ROC Chips
CEPC 数字强子量能器读出电子学预研进展
HR3 status.
CALICE meeting 2007 – Prague
Status of the DHCAL DIF Detector InterFace Board
DHCAL PCB STUDY For RPC 1 m2 PCB SOLUTION
Tao Hu, Jianbei Liu, Haijun Yang, Boxiang Yu For the CEPC-Calo Group
Status of the Data Concentrator Card and the rest of the DAQ
CALICE/EUDET Electronics in 2007
The DHCAL DIF Board For the M2 Prototype
HARDROC STATUS 6-Dec-18.
HaRDROC status: (Hadronic RPC Detector Read Out Chip for DHCAL)
CALICE meeting 2007 – Prague
HaRDROC status: (Hadronic RPC Detector Read Out Chip for DHCAL)
Status of the EUDET Prototype
State of developments on Readout interface of European DHCAL
The DHCAL for the m2 and m3 prototype
AIDA KICK OFF MEETING WP9
Presentation transcript:

News from the 1m 2 GRPC SDHCAL collection of slides from : Ch.Combaret, I.L, H.Mathez, J.Prast, N.Seguin, W.Tromeur, G.Vouters and many others

The DHCAL DIF Board Based on a Cyclone 3 Altera FPGA (EP3C6F484). Separated from the slab for more flexibility. –Can handle slab what ever the nb of HardRoc on it. –DIF task force interface compliant. –MicroMegas and RPC detector compatible. –HardRoc, Lyon’s asics and also Spiroc and Skyroc compatible. On the DAQ side, interface with : –The LDA (final DAQ). –PC through USB for standalone tests and debugs. –DIF neighbors. –Interface with the analog DAQ removed.

13 June 2008 The DHCAL DIF Board 3 Architecture of the DIF Board DIF SLABSLAB FPGA ASIC Config ASIC read DAQ interface Slow control Power Supplies + 6V LDA (HDMI) USB JTAG HR analog Monitoring LDO ADC +5V 3.3V 2.5V 1.2V Mezzanine

SLAB Interface Samtec FSH/ SFMH 90 pin connector So the DHCAL DIF can also be used for ECAL or AHCAL ! The connector has been designed for DHCAL but also ECAL or AHCAL

The DIF Board

1 m 2 PCB MAIN SPECIFICATIONS ASU PCB Design 24 x 64 1 sq cm pads 24 Hardrocs Asics chained 1 m2 PCB board : 6 ASUs 144 Hardroc Asics DIF boards : 1 DIF for 1 ASU : 6 DIFs 1 DIF for 2 ASU : 3 DIFs Buffered Signals (Long Lines 1 m for Clock on 1 ASU): Slow Control Power_on Control for Analog Readout Digital Readout Analog Readout : All OUT_Q are connected together EN_OTAQ switch on or off using DIF board and decoder

ASU PCB DESIGN 50 cm 36 cm DIF connector ASU to ASU connector ASU to ASU connector Power and Gnd Connector ASU to ASU on X axis GND Connector ASU to ASU on Y axis Y X HR1 HR24 GND Connector ASU to ASU on Y axis Buffers (Other signals) Buffers (Clocks) Buried and Blind Vias (Same as the last PCB with 4 HR)

1 m 2 PCB DESIGN 1 DIF for 2 ASUs ASU 1 ASU 2 Pad Solder ASU to ASU Connection DIF Board 9216 pads on Bottom Layer

1 m 2 PCB DESIGN 1 DIF for 1 ASUs

1 m 2 PCB DESIGN (Layers) oLayer 1 (TOP) : interconnect oLayer 2 : interconnect oLayer 3 : 3.3V Digital oLayer 4 : GND oLayer 5 : 3.5V Analog oLayer 6 : PADs to Hardroc oLayer 7 : GND oLayer 8 (BOTTOM) : PADs Pads to Hardroc interconnects are the same for the entire PCB (hierarchical design)

IPNL clock Slow control DIF command and register access use XDAQ software DIF is fully functionnal The tested slab is fully functionnal with following modifications : 1. Use of buffers on the SLC clock line is mandatory (max nb of hardrocs chained without buffer could not exceed 12) 2. Use of buffers on the Open drains readout lines (transmit_on, dout and ramfull) should be forseen for next slabs Slow control (tested in all hardrocs) is stable and reliable Data readout is Present Status

What was tested : - Numerical readout has been tested in the following modes : 1.Manual Start Acquisition/Manual Start Readout (Manual Trigger 2.Manual Start Acquisition/ Automatic Start Readout (Internal Trigger) 3.Automatic startAcquisition/ Automatic Start Readout (« Beam test mode -Both DIF firmware and XDAQ software stable and reliable -Both DIF Firmware and XDAQ software have been tested with trigger rate >1kHz and 128 events per trigger (DAQ levels < noise level) -DIF temperature and current consumption monitoring on all DIFs Present Status

We have started tests with cosmics using one slab and step by step we will equip the 1M 2 GRP with the 6 slabs (all now equipped with tested HR1) We hope the fully equipped 1M 2 GRPC will be running very soon