Doc.:IEEE 802.11-13/0318r0 March 2013 A. Asterjadhi, Qualcomm Inc. Short MAC Header Design Date: 2013-03-15 Authors:

Slides:



Advertisements
Similar presentations
Doc.: IEEE /0509r0 SubmissionSlide 1 Short Management and Short A-MSDU Frame Date: Authors: Liwen Chu, ST May 2013.
Advertisements

Protocol for SU and MU Sounding Feedback
Doc.:IEEE /0859r0 July 2012 Simone Merlin, Qualcomm Inc Short Block Ack Date: Authors:
Doc.: IEEE /1106r0 Submission September 2012 Osama Aboul-Magd, Huawei TechnologiesSlide 1 A Short-Header Frame Format Date: Authors:
ZTE corporation doc.: IEEE /1086r2 September 2012 Submission TIM Compression for No Buffered Unicast Traffic Date: Slide 1 Authors:
Slide 1 doc.: IEEE /1092r0 Submission Simone Merlin, Qualcomm Incorporated September 2010 Slide 1 ACK Protocol and Backoff Procedure for MU-MIMO.
Short MAC Header Date: Authors: John Doe, Some Company
Doc.:IEEE /0365r1 March 2012 Z. Quan, Qualcomm Inc MAC Header Compression Slide 1 Authors:
MAC Header Compression
Doc.:IEEE /861r0 July 2012 EDCA Parameters Date: Authors: Slide 1.
Doc.: IEEE /1323r0 November 2012 Submission Relays for ah Date: Authors: Slide 1.
Doc.:IEEE /1079r0 Submission Sept. 13, 2010 Yong Liu, MarvellSlide 1 Max Frame Sizes Date: Authors:
Doc.: IEEE /1434r0 Submission November 2013 Slide 1 CID 1376: NDP BlockAck Bitmap Protection Date: Authors: Alfred Asterjadhi, et.
Submission doc.: IEEE 11-13/0288r0 TXOP Sharing Operation for Relay Date: Slide 1Eric Wong, Broadcom Authors: March 2013.
Doc.:IEEE /0129r3 May 2012 Santosh Abraham, Qualcomm Inc. Short Beacon Slide 1 Authors:
Doc.: IEEE /0324r2 Submission March 2012 Short Ack Date: Authors: Slide 1Yong Liu, Marvell, et. al.
Doc.: IEEE /0110r8 SubmissionLiwen Chu Etc.Slide 1 Frame Header Compression Date: Authors: Date: May, 2012.
Doc.: IEEE /1120r0 Submission Buffer Status Report Slide 1 Date: Authors: Alfred Asterjadhi, et. al. September 2015.
Doc.: IEEE /0840r1 Submission AP Assisted Medium Synchronization Date: Authors: September 2012 Minyoung Park, Intel Corp.Slide 1.
Doc.:IEEE /01122r0 September 2012 Simone Merlin Short MAC Header Signaling Slide 1 Authors:
Doc.: IEEE /1378r0 Submission November 2008 Darwin Engwer, Nortel NetworksSlide 1 Improving Multicast Reliability Date: Authors:
Doc.:IEEE /0114r0 January 2012 Low Power Medium Access Date: Slide 1 Authors:
Doc.: IEEE /1324r0 November 2012 Very Low Energy Paging Date: Authors: Slide 1 S. Merlin et al.
Doc.: IEEE /0110r3 SubmissionLiwen Chu Etc.Slide 1 Frame Header Compression Date: Authors: Date: Jan, 2012.
Doc.: IEEE /0110r6 SubmissionLiwen Chu Etc.Slide 1 Frame Header Compression Date: Authors: Date: March, 2012.
Doc.: IEEE /0110r7 SubmissionLiwen Chu Etc.Slide 1 Frame Header Compression Date: Authors: Date: April, 2012.
Doc.:IEEE /1503r1 November 2011 Short Beacon Slide 1 Authors:
Doc.: IEEE /0263r1 SubmissionJae Seung Lee, ETRI Spec Framework Proposal: Selection of the AP for Scanning Date: Slide 1 March 2012.
Doc.: IEEE /0126r1 Submission January mc HEMM Date: Authors: Graham Smith, DSP GroupSlide 1.
Doc.: IEEE /0896r0 SubmissionJae Seung Lee, ETRISlide 1 Probe Request Filtering Criteria Date: July 2012.
Doc.: IEEE /0110r1 SubmissionLiwen Chu Etc.Slide 1 Frame Header Compression Date: Authors: Date: Jan, 2012.
Doc.: IEEE /1121r0 Submission HE A-Control field Slide 1 Date: Authors: Alfred Asterjadhi, et. al. September 2015.
Doc.:IEEE /0129r1 January 2012 S.Abraham, Qualcomm Inc Short Beacon Slide 1 Authors:
Submission doc.: IEEE 11-15/1060r0 September 2015 Eric Wong (Apple)Slide 1 Receive Operating Mode Indication for Power Save Date: Authors:
ACK Indication and EIFS
Relay Flow Control Date: Authors: May 2013 Month Year
How to collect STAs’ Tx demands for UL MU
Authors: Alfred Asterjadhi, George Cherian
WUR frame format follow-up
WUR frame format follow-up
Requirements and Implementations for Intra-flow/Intra-AC DiffServ
Requirements and Implementations for Intra-flow/Intra-AC DiffServ
WUR frame format – Follow up
Issue of Buffer Status reporting
WUR frame format – Follow up
Considerations on VL WUR frames
May 2018 Project: IEEE P Working Group for Wireless Personal Area Networks (WPANs) Submission Title: [Considerations on general MAC frame] Date Submitted:
Further considerations on WUR frame format
Length/Misc. field in WUR frame
MAC Capabilities Info. in HE Capabilities IE
Secure WUR frames Date: Authors: January 2018
WUR frame format – Follow up
Further considerations on WUR frame format
MAC Clarifications Date: Authors: September 2016
Length/Misc. field in WUR frame
WUR frame format follow-up
TIM Compression for No Buffered Unicast Traffic
WUR frame format follow-up
Authors: Alfred Asterjadhi, George Cherian
Further considerations on WUR frame format
WUR frame format – Follow up
WUR frame format follow-up
Considerations on VL WUR frames
May 2018 Project: IEEE P Working Group for Wireless Personal Area Networks (WPANs) Submission Title: [Considerations on general MAC frame] Date Submitted:
Requirements and Implementations for Intra-flow/Intra-AC DiffServ
Considerations on VL WUR frames
Authors: Alfred Asterjadhi, George Cherian
Requirements and Implementations for Intra-flow/Intra-AC DiffServ
Considerations on VL WUR frames
Considerations on WUR frame format
Presentation transcript:

doc.:IEEE /0318r0 March 2013 A. Asterjadhi, Qualcomm Inc. Short MAC Header Design Date: Authors:

doc.:IEEE /0318r0 March 2013 A. Asterjadhi, Qualcomm Inc.

doc.:IEEE /0318r0 March 2013 A. Asterjadhi, Qualcomm Inc.

doc.:IEEE /0318r0 March 2013 A. Asterjadhi, Qualcomm Inc. Introduction The MAC header is a significant overhead for short MPDUs [1, 2] –30-36 octets in 11n, without security –This is inefficient for short-packet applications E.g., the FR-EM document includes traffic specifications for sensors (256Bytes), and industrial process automation (64Bytes) [3]. Other applications with very short packets can be envisioned Shortening the MAC header has advantages for 11ah Prolonged battery lifetime Reduced medium occupancy Motions that define the structure of the Short MAC header have passed [5] –See next slide for details on the structure This presentation follows up on other design details for the Short MAC header Slide 4

doc.:IEEE /0318r0 March 2013 A. Asterjadhi, Qualcomm Inc. Short MAC Header Format – current status Frame Control (2 Bytes) –There are 3 available bits Short ID (2 Bytes) –Contains the Association ID (13 bits) of the RX/TX STA depending on From DS value –There are 3 available bits A3 is optionally present based on A3 Present indication bit Slide 5 Octets: 22/66/226variable4 Frame Control A1A2 Sequence Control A3 Frame Body FCS bits Protocol Version TypeFrom DS More Fragments Power Management More Data Protected Frame EOSPA3 Present TBD 133 Association ID (AID)Reserved Short ID (SID) Frame Control

doc.:IEEE /0318r0 March 2013 A. Asterjadhi, Qualcomm Inc. A3 Present Propose to move A3 present bit from Frame Control to Short ID field –One additional free bit is available in FC for other features –A3 is not necessary for the Short MAC header with 2 full MAC addresses That would have similar overhead to normal MAC header, with only 2 Bytes less due to Duration field removal Slide 6 bits Protocol Version TypeFrom DS More Fragments Power Management More Data Protected Frame EOSPA3 Present TBD 133 Association ID (AID)Reserved Short ID (SID) Frame Control

doc.:IEEE /0318r0 March 2013 A. Asterjadhi, Qualcomm Inc. A4 Present and A-MSDU The 11ah spec framework requires the following –A Relay shall use 4-address frames or A-MSDU to forward packets [6] We propose to indicate presence of A4 and A-MSDU in short MAC header –Use reserved bits in SID field to indicate presence of A4 and A-MSDU Allows to use short MAC header for relay operation From an overhead perspective –22 Bytes for a short MAC header with A4 (when A3 is stored at the Relay) –40 Bytes for a normal MAC header with 4 addresses Slide Association ID (AID)A3 PresentA4 PresentA-MSDU Short ID (SID)

doc.:IEEE /0318r0 March 2013 A. Asterjadhi, Qualcomm Inc. Traffic Identifier (TID) TID identifies the TC/TS to which the MSDU or A-MSDU belongs –It also identifies the TC or TS of traffic for which a TXOP is being requested Through the setting of TXOP duration requested or queue size Including the TID in the short MAC header has already been accepted [7] –Sufficient for correct operation with EDCA (0—7) –We propose to send the 3 LSBs of the TID in the Frame Control First MSB of TID can be stored at the receiver if HCCA or HEMM is used Fits perfectly in the available bits in the Frame Control –One additional bit is still available Slide 8 bits Protocol Version TypeFrom DS More Fragments Power Management More Data Protected Frame EOSPReserv ed TID Access policyUsageAllowed values in TID subfield (4 bits) EDCAUP for either TC or TS, regardless of whether admission control is required 0–7 HCCATSID8–15 HEMMTSID, regardless of the access mechanism used8–15

doc.:IEEE /0318r0 March 2013 A. Asterjadhi, Qualcomm Inc. Conclusions Following up on the design of short MAC header [5], we propose –Move A3 Present bit from Frame Control to SID field –Include A4 Present and A-MSDU indication bits in the SID field –Include 3 LSBs of the TID in FC to enable correct operation of EDCA Slide 9

doc.:IEEE /0318r0 March 2013 A. Asterjadhi, Qualcomm Inc. References [1] ah-mac-header-compression [2] ah-frame-header-compression [3] ah-tgah-functional-requirements-and-evaluation-methodology [4] ah-short-ack [5] ah-short-mac-header-design [6] ah-group-addressed-mpdu-transfer-in-relay [7] ah-duplicate-detection-of-short-mac-frame Slide 10

doc.:IEEE /0318r0 March 2013 A. Asterjadhi, Qualcomm Inc. Straw Poll 1 Do you support to update in the spec framework, in section 4.5, the Frame Control field of the short MAC Header with the following: –Move the A3 Present subfield to the SID field –Include the 3 LSB bits of the TID Slide 11 bits Protocol Version TypeFrom DS More Fragments Power Management More Data Protected Frame EOSPReservedTID

doc.:IEEE /0318r0 March 2013 A. Asterjadhi, Qualcomm Inc. Straw Poll 2 Do you support to specify in the spec framework, in section 4.5, that the 2 Byte address field is called Short ID field and that it includes the following subfields: Association ID (AID), A3 Present, A4 Present, A-MSDU Slide Association ID (AID)A3 PresentA4 PresentA-MSDU