Digital HCAL Electronics Status of Electronics Production CALOR 2010 Conference IHEP Beijing, People’s Republic of China May 10-14, 2010 José Repond for.

Slides:



Advertisements
Similar presentations
20/Oct./2000 CF IEEE NSS 2000 at Lyon,France 1 An MWPC Readout Chip for High Rate Environment Introduction ASIC Structure & Fabrication ASIC Evaluation.
Advertisements

JLab High Resolution TDC Hall D Electronics Review (7/03) - Ed Jastrzembski.
1 m 3 Prototype Digital Hadron Calorimeter Collaborators Argonne National Laboratory Boston University University of Chicago Fermilab University of Texas.
Bulk Micromegas Our Micromegas detectors are fabricated using the Bulk technology The fabrication consists in the lamination of a steel woven mesh and.
The LAr ROD Project and Online Activities Arno Straessner and Alain, Daniel, Annie, Manuel, Imma, Eric, Jean-Pierre,... Journée de réflexion du DPNC Centre.
Digital Hadron Calorimetry using Gas Electron Multipliers Andy White University of Texas at Arlington.
RPC Update José Repond Argonne National Laboratory American Working Group On Linear Collider Calorimetry 24 November 2003 What’s new since September…
28 August 2002Paul Dauncey1 Readout electronics for the CALICE ECAL and tile HCAL Paul Dauncey Imperial College, University of London, UK For the CALICE-UK.
July 10, 2008 PHENIX RPC review C.Y. Chi 1 RPC Front End Electronics On chamber discriminator  The strips  The CMS discriminator chips  The discriminator.
Directional Detectors and Digital Calorimeters Ed Norbeck and Yasar Onel University of Iowa For the 25 th Winter Workshop on Nuclear Dynamics Big Sky,
RPC Update José Repond Argonne National Laboratory American Working Group On Linear Collider Calorimetry 16 September 2003 What’s new since Cornell…
Mauro Raggi Status report on the new charged hodoscope for P326 Mauro Raggi for the HODO working group Perugia – Firenze 07/09/2005.
Andy White U.Texas at Arlington (for J.Yu, C.Han, J.Li, D.Jenkins, J.Smith, K.Parmer, A.Nozawa, V.Kaushik) 10/18/04 IEEE/NSS Digital Hadron Calorimetry.
Overview of the RPC DHCAL Project José Repond Argonne National Laboratory SiD Meeting International Linear Collider Workshop 2010 Institute of High Energy.
Overview of the RPC DHCAL Project José Repond Argonne National Laboratory CALICE Collaboration Meeting University of Texas at Arlington March 10 – 12,
06/15/2009CALICE TB review RPC DHCAL 1m 3 test software: daq, event building, event display, analysis and simulation Lei Xia.
Sept. 24, Status of GEM DHCAL Jae Yu For GEM-TGEM/DHCAL Group Sept. 24, 2010 CALICE Collaboration Meeting Univ. Hassan II, Casablanca Introduction.
DHCAL Construction Status Lei Xia Argonne National Laboratory ALCPG2009, Albuquerque.
MR (7/7/05) T2K electronics Beam structure ~ 8 (9?) bunches / spill bunch width ~ 60 nsec bunch separation ~ 600 nsec spill duration ~ 5  sec Time between.
1 Status of GEM DHCAL Andy White For GEM-TGEM/DHCAL Group March 21, 2011 ALCPG11 Workshop Univ. of Oregon Introduction 30cmx30cm 2D readout with KPiX chip.
Towards an RPC-based HCAL Design Stephen R. Magill Argonne National Laboratory Digital HCAL for an E-Flow Calorimeter Use of RPCs for DHCAL RPC Design.
Development of a DHCAL with Resistive Plate Chambers ECFA/DESY Workshop at NIKHEF, Amsterdam, Netherlands April 1 - 4, 2003 José Repond Argonne National.
Andy White University of Texas at Arlington For GEM DHCAL Group ESTB Workshop SLAC 2012 Introduction KPiX Readout FTBF Beam Test Setup Beam Test Analysis.
September 8-14, th Workshop on Electronics for LHC1 Channel Control ASIC for the CMS Hadron Calorimeter Front End Readout Module Ray Yarema, Alan.
José Repond Argonne National Laboratory Status of the DHCAL Project SiD Collaboration Week January 12 – 14, 2015 SLAC.
Digital Hadron Calorimeter (DHCAL) José Repond Argonne National Laboratory CLIC Workshop 2013 January 28 – February 1, 2013 CERN, Geneva, Switzerland.
Hadron Calorimeter Summary Andy White SiD Workshop, SLAC October 2006.
P. Shanahan June 13, Near Detector Electronics Status Status Production Issues Peter Shanahan FNAL MINOS Collaboration Meeting June 13, 2003.
Recent DHCAL Developments José Repond and Lei Xia Argonne National Laboratory Linear Collider Workshop 2013 University of Tokyo November 11 – 15, 2013.
NUMI Off Axis NUMI Off Axis Workshop Workshop Argonne Meeting Electronics for RPCs Gary Drake, Charlie Nelson Apr. 25, 2003 p. 1.
The DHCAL Data Analysis José Repond CALICE Meeting, Prague, September 10 – 12, 2007.
BILCW07, Feb 2007, H.WeertsSlide 1 RPC-DHCAL Progress & Status H.Weerts BILCW07, Beijing, February 4 – 7, 2007 Research done as part of program of CALICE.
Calibration of a Digital Hadron Calorimeter with Muons Burak Bilki d, John Butler b, Tim Cundiff a, Gary Drake a, William Haberichter a, Eric Hazen b,
Construction and Operation of DHCAL Fermilab Test Beam Facility Lei Xia ANL_HEP.
Towards a 1m 3 Glass RPC HCAL prototype with multi-threshold readout M. Vander Donckt for the CALICE - SDHCAL group.
RPC-DHCAL Progress Report José Repond Argonne National Laboratory SiD Workshop, FNAL, April 9 – 11, 2007.
Peter Shanahan – Fermilab - Near Detector Electronics Status MINOS Collaboration Meeting University of Sussex Sep Near Detector Electronics.
May 31, 2007CALICE DHCAL J. Yu 1 Gas DHCAL R&D May 31, 2007 WWS CAL R&D Review, DESY Jae Yu University of Texas at Arlington For CALICE DHCAL Groups Introduction.
Noise and Cosmics in the DHCAL José Repond Argonne National Laboratory CALICE Collaboration Meeting University Hassan II Casablanca, Morocco September.
A Hadron Calorimeter with Resistive Plate Chambers José Repond Argonne National Laboratory Presented by Andy White University of Texas at Arlington LCWS.
DCal A Custom Integrated Circuit for Calorimetry at the International Linear Collider.
Application of Large Scale GEM for Digital Hadron Calorimetry Jae Yu For GEM DHCAL Group June 11, 2011 TIPP 2011 The Goals 30cmx30cm 2D readout with KPiX.
B.Satyanarayana Department of High Energy Physics Tata Institute of Fundamental Research Homi Bhabha Road, Colaba, Mumbai,
A Hadron Calorimeter with Resistive Plate Chambers José Repond Argonne National Laboratory CALOR 2006, Chicago, June 5 – 9, 2006.
11 October 2002Paul Dauncey - CDR Introduction1 CDR Introduction and Overview Paul Dauncey Imperial College London.
TPC electronics Status, Plans, Needs Marcus Larwill April
US DHCAL Status Lei Xia Argonne National Laboratory.
DHCAL Construction Status Lei Xia Argonne National Laboratory CALICE Meeting, September 16 – 18, 2009 Université Claude Bernard Lyon I, France.
Status of GEM DHCAL Jae Yu For GEM DHCAL Group April 25, 2012 KILC Workshop, KNU Introduction KPiX V9 and DCAL Integration FTBF Beam Test Setup Beam Test.
DHCAL Jan Blaha R&D is in framework of the CALICE collaboration CLIC08 Workshop CERN, 14 – 17 October 2008.
Future DHCAL Activities José Repond Argonne National Laboratory CALICE Meeting, CERN, May 19 – 21, 2011.
1 Construction of a Digital Hadron Calorimeter with Resistive Plate Chambers Lei Xia Argonne National Laboratory CALOR 2010 Institute of High Energy Physics.
Andy White University of Texas at Arlington For GEM DHCAL Group CALOR 2012 Introduction KPiX V9 and DCAL Integration FTBF Beam Test Setup Beam Test Analysis.
G. Drake Electronics for DHCAL R&D Oct. 13, 2005 p. 1.
DHCAL Progress Report José Repond Argonne National Laboratory SiD Meeting, SLAC, October 26, 2006.
DHCAL TECH PROTO READOUT PROPOSAL
A Digital Hadron Calorimeter Resistive Plate Chambers
Digital Calorimetry for FCC Detectors
Construction and Testing of a Digital Hadron Calorimeter Prototype
Lei Xia Argonne National Laboratory
(My personal) CALICE Report
The DHCAL: an overview José Repond Argonne National Laboratory
Status of GEM DHCAL Andy White RD51 Collaboration Meeting CERN
Development of a Digital Hadron Calorimeter (DHCAL)
Felix Sefkow CALICE/EUDET electronics meeting CERN, July 12, 2007
GEM-based Digital Hadron Calorimetry for SiD
GEM-based Digital Hadron Calorimetry for SiD
RPC Front End Electronics
RPC FEE The discriminator boards TDC boards Cost schedule.
PID meeting Mechanical implementation Electronics architecture
Presentation transcript:

Digital HCAL Electronics Status of Electronics Production CALOR 2010 Conference IHEP Beijing, People’s Republic of China May 10-14, 2010 José Repond for Gary Drake Argonne National Laboratory

DHCAL Electronics – Status & Plans G. Drake – May 10-14, 2010 – CALOR 2010 Conference – Beijing 2 The DHCAL with Resistive Plate Chamber Project Development of a hadron calorimeter optimized for Particel Flow Algorithms –Resistive Plate Chambers (RPCs) as active elements –Very fine readout segmentation with 1 x 1 cm 2 pads Assembled small prototype calorimeter (→ J.Repond) –Many results with cosmic rays and beam particles Now assembling large size prototype calorimeter (→ L.Xia) –40 layers interspersed with steel absorber plates –~400,000 readout channels –1-bit resolution/pad (binary or digital readout) This talk is about the electronic readout system of the prototype caloriometer

DHCAL Electronics – Status & Plans G. Drake – May 10-14, 2010 – CALOR 2010 Conference – Beijing 3 Argonne National Laboratory Carol Adams Mike Anthony Tim Cundiff Eddie Davis Pat De Lurgio Gary Drake Kurt Francis Robert Furst Vic Guarino Bill Haberichter Andrew Kreps Zeljko Matijas José Repond Jim Schlereth Frank Skrzecz (Jacob Smith) (Daniel Trojand) Dave Underwood Ken Wood Lei Xia Allen Zhao RPC DHCAL Collaboration:  36 People, 7 Institutions RED = Electronics Contributions GREEN = Mechanical Contributions BLUE = Students BLACK = Physicists Boston University John Butler Eric Hazen Shouxiang Wu Fermilab Alan Baumbaugh Lou Dal Monte Jim Hoff Scott Holm Ray Yarema IHEP Beijing Qingmin Zhang University of Iowa Burak Bilki Ed Norbeck David Northacker Yasar Onel McGill University François Corriveau Daniel Trojand UTA Jacob Smith Jaehoon Yu

DHCAL Electronics – Status & Plans G. Drake – May 10-14, 2010 – CALOR 2010 Conference – Beijing 4 Brief Overview of System

DHCAL Electronics – Status & Plans G. Drake – May 10-14, 2010 – CALOR 2010 Conference – Beijing 5 General Electronics System Specifications Front-end instrumentation to use 64-channel custom ASIC –1 cm 2 pads, 1 meter 2 planes, 40 planes,  400,000 channels Front-end channel consists of amplifier/shaper/discriminator Single programmable threshold  1 bit dynamic range –Threshold DAC has 8-bit range –Common threshold for all 64 channels per ASIC 2 gain ranges –High gain for GEMs (10 fC - ~200 fC signals) –Low gain for RPCs (100 fC - ~10 pC signals) 100 nSec time resolution Timestamp each hit –1 second dynamic range  nSec –Synchronize timestamps over system Data from FE consists of hit pattern in ASIC + timestamp –24 bit timestamp + 64 hit bits = 88 bits (+ address, error bits, etc.) –Readout format: 16 bytes per ASIC

DHCAL Electronics – Status & Plans G. Drake – May 10-14, 2010 – CALOR 2010 Conference – Beijing 6 General Electronics System Specifications (Continued) Capability for Self Triggering  Noise, Cosmic rays, Data errors Capability for External Triggering  Primary method for test beam –20-stage pipeline  2  Sec 100 nSec [Capability of FE to source prompt Trigger Bit (simple OR of all disc.)] Capability to store up to 7 triggers in ASIC output buffer (FIFO) Design for 100 Hz (Ext. Trig) nominal rate Deadtimeless Readout (within rate limitations) Zero-suppression implemented in front-end On-board charge injection with programmable DAC Design for 10% occupancy Concatenate data in front-ends Use serial communication protocols Slow controls separate from data output stream Compatibility with CALICE DAQ

DHCAL Electronics – Status & Plans G. Drake – May 10-14, 2010 – CALOR 2010 Conference – Beijing 7 Resistive paint Mylar 1.2mm gas gap Mylar Aluminum foil 0.85 mm glass 1.15 mm glass Signal pads HV Detector Configuration ASIC Front-End PCB Pad Board Conductive Epoxy Glue Communication Link 8.6 mm Chamber Construction: Fishing line spacers Grounding is important… (Not to Scale)

DHCAL Electronics – Status & Plans G. Drake – May 10-14, 2010 – CALOR 2010 Conference – Beijing 8 System Block Diagram  Both on Same PCB 24

DHCAL Electronics – Status & Plans G. Drake – May 10-14, 2010 – CALOR 2010 Conference – Beijing 9 System Physical Implementation Plane Construction –A plane consists of 3 independent chambers –  See Lei Xia’s talk Friday Chambers – 3 per plane Square Meter Plane (3) 32 cm X 96 cm chambers HV Gas Inlet Gas Outlet

DHCAL Electronics – Status & Plans G. Drake – May 10-14, 2010 – CALOR 2010 Conference – Beijing 10 System Physical Implementation (Cont.) Data Concentrator Front End Board with DCAL Chips & Integrated DCON Serial Communication Link - 1 per Front-End Bd Chambers – 3 per plane Square Meter Plane (2) 32 cm X 48 cm Front End Boards per Chamber Power Front End Board –(24) 64-Ch Chips / Bd –1536 Channels / Bd

DHCAL Electronics – Status & Plans G. Drake – May 10-14, 2010 – CALOR 2010 Conference – Beijing 11 System Physical Implementation (Cont.) Pad Boards –Glued to Front End Board using Conductive Epoxy –Gluing done after FEB assembly and check out –More in Lei Xia’s Talk on Friday

DHCAL Electronics – Status & Plans G. Drake – May 10-14, 2010 – CALOR 2010 Conference – Beijing 12 System Physical Implementation (Cont.) Data Concentrator Front End Board with DCAL Chips & Integrated DCON Serial Communication Link - 1 per Front-End Bd Chambers – 3 per plane Square Meter Plane VME Interface Data Collectors – Need 10 Timing Module -Double Width Outputs Ext. Trig In Optional GPS IN 6U VME Crate To PC VME Interface Data Collectors – Need 10 6U VME Crate To PC MASTER TTM SLAVE TTM

DHCAL Electronics – Status & Plans G. Drake – May 10-14, 2010 – CALOR 2010 Conference – Beijing 13 System Physical Implementation (Cont.) Square meter plane mounted on cassette using prototype Front End Boards

DHCAL Electronics – Status & Plans G. Drake – May 10-14, 2010 – CALOR 2010 Conference – Beijing 14 Some Numbers Planes –38 planes in m 3 Detector Granularity –1 cm 2 pads –10,000 pads/plane –380,000 ch total Front End Boards –6 per plane –228 total (+ spares) Chips –64 ch/chip –24 chips/FEB –5472 chips total Data Collectors –12 FEB/Data Coll. –20 Data Coll. total VME Crates –2 crates total (1 per side) Chip Rates 1 TS/trig) –1 bit/100 nSec out of chips –121 bits/TSlice 64 hit bits  8 bytes 24 bits timestamp  3 bytes 3 ctrl bit/byte –12.1 uSec/TS/Chip –24 chips operate in parallel –  82.6 KHz max average event rate –Use Zero Suppression… DCON Output Rates –16 bytes/TSlice/chip –100 nSec/bit –  12.8 uSec/TSlice/chip –78 K Tslices/sec max rate –Zero Suppression helps –Example: 4 chips hit/event avg Max event rate: 19KHz –WC: 78 K / 24 = 3.2 KHz

DHCAL Electronics – Status & Plans G. Drake – May 10-14, 2010 – CALOR 2010 Conference – Beijing 15 Power Distribution System Cubic meter detector power requirements: –3A / 5V –40 planes * 6 FEBs/plane * 3.0 amps/FEB = 720 amps at 5V Solution: –5 Wiener PL508 chassis –Each PL508 has six independent 5V at 30 amp supplies –5 PL508 * 6 PS/PL508 * 30 amps/PS = 900 amps total ampacity –Operate at ~80% of capacity –1 Wiener supply powers 8 Front End Boards Power Numbers – V –3.9 mW/ch 5V (ASICs run at 2.5V) –15W/FEB –90W/plane –3.6 KW/cubic meter

DHCAL Electronics – Status & Plans G. Drake – May 10-14, 2010 – CALOR 2010 Conference – Beijing 16 Power Distribution System (Cont.) Need Power Dist. Box to distribute voltages to Front End Boards Rack Configuration –Power supplies will fit into one rack Power Distribution –Custom distribution boxes, with fuses, safe wiring, etc. Wiener PL508 Distribution Box To 1 Front-End Bd 3A Nominal 30A

DHCAL Electronics – Status & Plans G. Drake – May 10-14, 2010 – CALOR 2010 Conference – Beijing 17 Production Quantities ItemNeeded for Detector Needed for Tail Catcher SparesTeststandsTotal DCAL Chips *8644 Front End Bds *280 Data Collectors VME Crates20114 VME Processors20114 Timing Module30216 Wiener Power Supplies Power Dist. Boxes 52108

DHCAL Electronics – Status & Plans G. Drake – May 10-14, 2010 – CALOR 2010 Conference – Beijing 18 Status of System Components to Date

DHCAL Electronics – Status & Plans G. Drake – May 10-14, 2010 – CALOR 2010 Conference – Beijing 19 Status of DCAL3 Production Chip Fabrication: –11 wafers, 10,300 chips, fabricated, packaged, in- hand Chip Testing –All chips tested –Results 8644 good parts  84% yield  Average DCAL3 Layout Robotic Chip Tester Chip Storage (~1/2 total)  Complete

DHCAL Electronics – Status & Plans G. Drake – May 10-14, 2010 – CALOR 2010 Conference – Beijing 20 Status of Front End Board Production 8-layer FE-board (3 layers shown) Found 3 problems with prototype FEB - LVDS outputs of DCON FPGA not true LVDS  had common mode component -We had a single-ended clock line between receiver & FPGA, ~10 cm -We found a stability problem with the PLL in the FPGA  Caused relatively rare errors in data collection - ~1E-8  Required additional iterations in design of prototype to find & fix

DHCAL Electronics – Status & Plans G. Drake – May 10-14, 2010 – CALOR 2010 Conference – Beijing 21 Status of Front End Board Production (Cont.) Status today –All problems in layout fixed –All problems in firmware fixed –System has been run in Cosmic Ray Teststand for long periods with no errors –System has been run in “Torture Mode” with no errors  Production assembly of PCBs now in progress

DHCAL Electronics – Status & Plans G. Drake – May 10-14, 2010 – CALOR 2010 Conference – Beijing 22 Status of Front End Board Production (Cont.) A Few Results Low Gain: ~1.9 fC / THR_DAC_CNT  480 fC Range  Operate ~ 190 fC for RPC High Gain: ~0.3 fC / THR_DAC_CNT  75 fC Range Channel Uniformity for Threshold Scans Entries: 1536 Average: 6.19 RMS: 2.97 Entries: 1536 Average: 2.04 RMS: 2.41 Measurements of Noise Floor Single channel measurements, Ext. Trig,, No Pad Bd, No Chamber, No HV Entire Front End Board, 1536 Channels Factor of 6.4 High gain Low gain

DHCAL Electronics – Status & Plans G. Drake – May 10-14, 2010 – CALOR 2010 Conference – Beijing 23 Status of Data Collector Production Courtesy Eric Hazen, BU Production –30 boards fabricated & assembled –Testing complete –All delivered to Argonne  Complete

DHCAL Electronics – Status & Plans G. Drake – May 10-14, 2010 – CALOR 2010 Conference – Beijing 24 Status of Timing & Trigger Module (TTM) Production Trigger Inputs GPS Receiver Input Status –Redesign completed Add outputs: 8  16 Makes double-width Add capability to use as MASTER or SLAVE – Set a bit to select –Production Need 3 for detector Fabrication done 1 st assembled (in house)  Almost complete

DHCAL Electronics – Status & Plans G. Drake – May 10-14, 2010 – CALOR 2010 Conference – Beijing 25 Schedule & Plans

DHCAL Electronics – Status & Plans G. Drake – May 10-14, 2010 – CALOR 2010 Conference – Beijing 26 Schedule & Plans Projected Production Schedule –~Produce 1 plane per day, all phases of production ComponentMarAprMayJunJulyAugSeptOctNovDec DCAL Chips Front End Bd Data Collector Crates Timing Module Power Supplies Power Dist. Box System FNAL PCB Fab PCB Assembly Checkout Assmbly Checkout Gluing Checkout Assembly Checkout Tests in CRTS Install Data Taking

DHCAL Electronics – Status & Plans G. Drake – May 10-14, 2010 – CALOR 2010 Conference – Beijing 27 Summary We have completed an extensive development program for the electronics of a Digital Hadron Calorimeter (with Resistive Plate Chambers) –The design of the Front End Board was by far the most difficult aspect of the project –The prototype system has been thoroughly tested Good electronics noise performance  Careful layout & circuit design Good measurement of cosmic rays Data error rate < 1E-12  through extensive testing Production in progress –DCAL ASIC Checkout complete 8600 chips in hand  84% yield –Front-end Board & Pad Board PCB fabrication complete PCB production assembly in progress (1 st 10 boards this week, >30 boards/week) Checkout hardware and software in place –Data Collector, Timing Module, Power Dist. Box  Production of all in progress  Begin tests in Cosmic Ray Teststand in May  Installation & commissioning at FNAL testbeam in September  1 st test beam run to start on October 8 th  1 st beam tests of CALICE technical prototype