HE FEE Boards production status 26 th May 2016 Mandakini Patil 1.

Slides:



Advertisements
Similar presentations
CMS Week March presented by John Coughlan RAL FED Hardware Status Pre-Series Manufacture Final Production Plans.
Advertisements

José C. Da Silva OFF DETECTOR WORSHOP, April 7, 2005, Lisboa SLB and DCC commissioning for 904.
Status of the LAV electronics G. Corradi, C. Paglia, D. Tagnani F. Gonnella, M. Raggi INFN LNF F. Gonnella, M. Raggi INFN LNF Photon Veto WG CERN 13/12/2011.
University of Kansas EPS of KUTEsat Pathfinder Leon S. Searl April 5, 2006 AE256 Satellite Electrical Power Systems.
Endcap Muon meeting: UC Davis, Feb , 2005 J. Hauser UCLA 1 TMB and RAT Status Report Outline: Current status of TMB and RAT boards Noise measurements.
Slide 1UCSB CMS Weekly Status MeetingCMS 4-Hybrid Test System Sam Burke EE UCSB 4-Hybrid Thermal Test System Status 30 June Sam Burke UCSB HEP Group.
Slide 1UCSB CMS Weekly Status MeetingCMS 4-Hybrid Test System Sam Burke EE UCSB 4-Hybrid Thermal Test System Status 13 October 2003 Sam Burke Lance Simms.
Slide 1 Control Software for the CMS Pixel Readout 28 April 2004 R.Stone, Rutgers (J.Doroshenko, DW.Kim, U.Joshi, L.Perera, J.C. Yun, et al) CMS Pixel.
Timed Traffic Light PCB Josh Angell June 1, 2011 IME 458.
Slide 1 Anthony Affolder US Silicon Meeting, March 9, 2004 Equipment Status ARCS equipment status à Single module and 4 hybrid DAQ equipment status à Vienna.
Upgrade developments in Clermont-Ferrand Romeo Bonnefoy and François Vazeille Tilecal upgrade meeting (CERN, 13 June 2014) ● Handling tools ● Deported.
PP2 Status F. Bellina. Problem solved.. Problem with inhibit and reading temperature and many crazy behavior Solved with a new FPGA firmware: the hardware.
AHCAL Electronics. Status EUDET Prototype Mathias Reinecke for the DESY AHCAL developers EUDET Electronics/DAQ meeting London, June 9th, 2009.
TE-MPE-EP, VF, 11-Oct-2012 Update on the DQLPU type A design and general progress. TE-MPE Technical Meeting.
Status Brussels GANTRY Ê Assembly of R3 modules (36 modules) 4 precision of the modules 4 problems with DataBase (not adapted for single sensor modules)
TMDB delay and production plan Augusto. TMDB Prototype Status The prototype boards almost fully assembled should be delivered this week ( May 5 th ) First.
1 Sasha Milov DC meeting Jan 11, 2006 HBD upgrade status. Sasha Milov Jan 11, 2006.
Main Board Status MB2 v1 for FATALIC & QIE 10/06/2015Roméo BONNEFOY - LPC Clermont1 Roméo BONNEFOY François Vazeille LPC Clermont-Ferrand.
Saverio Minutoli INFN Genova 1 1 T1 Electronic status Electronics Cards involved: Anode Front End Card Cathode Front End Card Read-Out Control card VFAT.
EC front unit status. Outline Conclusions from mechanical prototype and actions taken Status of electrical prototype KIT’s work for TA Dev plan (tests)
S.Veneziano – INFN Roma July 2003 TDAQ week CMA LVL1 Barrel status ATLAS TDAQ week July 2003.
1 MICE Tracking Detectors Malcolm Ellis NFMCC Meeting 12 th March 2006.
1 HO Upgrade: QC and Production Preparation in India Shashi Dugad India-CMS Meeting, BARC 30 July 2010.
3 rd Work Meeting of CBS-MPD STS, Karelia, 2009 Towards CBM STS Volker Kleipa, GSI Darmstadt.
Status and planning of the CMX Wojtek Fedorko for the MSU group TDAQ Week, CERN April , 2012.
Status report on the development of a readout system based on the SALTRO-16 chip Leif Jönsson Lund University LCTPC Collaboration Meeting
CSC ME1/1 Upgrade Status of Electronics Design Mikhail Matveev Rice University March 28, 2012.
CHANTI update F. Ambrosino, T. Capussela, D. Di Filippo, P. Massarotti, M. Mirra, M. Napolitano, L. Roscilli, G. Saracino.
HB LED Pulser Boards By Michael Miller The University of Iowa.
1 ME1/1 ODMB Production Readiness Review: Schedule and Budget Darien Wood Northeastern University For the ME1/1 Electronics Project.
ROBOX with Multi Anode PMT’s Status and plans A.Mestvirishvili, I. Schmidt, S. Sen, F. Ozok University of Iowa.
TEL62 status and plans Elena Pedreschi INFN-Pisa Thursday 08 September 2011 TDAQ WG Meeting at Mainz University.
HF Front-end status Tullio Grassi 11 Dec Overview The HF FEE will change entirely, including the backplane. Only the cable plant (fiber, copper)
Monday December DESY1 GDCC news Franck GASTALDI.
PSD upgrade: concept and plans - Why the PSD upgrade is necessary? - Concept and status of the PSD temperature control - Concept of the PSD analog part.
L. Greiner1IPHC-LBNL Phone Conference 05/2012 STAR IPHC-LBNL Phone Conference News and updated ladder testing.
Status of the PSD upgrade - Problems with PSD in Be runs - Modification of cooling system - New temperature control - Upgrade of HV control system - MAPD.
AIDA FEE64 production report January 2011 Manufacturing Power Supply FEE64 revision A “3 hour test” 19th January
FEE Electronics progress PCB layout 18th March 2009.
March 25, FVTX Monthly/Quarterly Report June, 2009 Technical Status, Cost & Schedule Melynda Brooks, LANL.
9/12/2003Ivan Hruska1 First box prototype –Box design in July ‘03 –Box produced during August ’03 Tested last week in few fingers Small changes necessary.
Plans and Progress on the FPGA+ADC Card Pack Chris Tully Princeton University Upgrade Workshop, Fermilab October 28, 2009.
D. Piccolo Barrel RPC Cable procurement, installation Davide Piccolo INFN Napoli.
L. Greiner1IPHC-LBNL Phone Conference 07/10/2012 STAR IPHC-LBNL Phone Conference News and updated ladder testing.
Status of the PSD upgrade - Status of the PSD cooling and temperature stabilization system - MAPD gain monitoring system - PSD readout upgrade F.Guber,
PSD upgrade: concept and plans - Why the PSD upgrade is necessary? - Concept of the PSD temperature stabilization and control - Upgrade of HV control system.
Julie Prast, Calice Electronics Meeting at LAL, June 2008 Status of the DHCAL DIF Detector InterFace Board Sébastien Cap, Julie Prast, Guillaume Vouters.
Tile HCAL status Felix Sefkow CALICE Technical Board Review April 19, 2007.
AHCAL Electronics. Status and Outlook Mathias Reinecke for the AHCAL developers CALICE Days DESY Hamburg, March 31st, 2009.
Tracker Readout Progress Terry Hart, MICE Tracker Meeting, July 29, 2008 Cosmic Ray Readout with 1 st Tracker at RAL 2 nd Tracker Preparation at FNAL Firmware.
Preparations to Install the HBD for Run 6 Craig Woody BNL PHENIX Weekly Meeting January 26, 2006.
TDC/TEL62 update M. Sozzi NA62 TDAQ WG meeting Bruxelles – 9/9/2010.
FEE Electronics progress PCB layout progress VHDL progress in TBU Prototype fixture for software 9th June 2009.
Evelyn Thomson Ohio State University Page 1 XFT Status CDF Trigger Workshop, 17 August 2000 l XFT Hardware status l XFT Integration tests at B0, including:
Status of LAV electronics commissioning Mauro Raggi, Francesco Gonnella Laboratori Nazionali di Frascati 1 Mauro Raggi - Laboratori Nazionali di Frascati4.
T HE PDM INTEGRATION P. Barrillon (LAL) & G. Prévôt (APC) On behalf of the PDM crew (Simon, Lech, Philippe, Sylvie B) EUSO-SPB/MiniEUSO progress meeting,
1 Timing of the calorimeter monitoring signals 1.Introduction 2.LED trigger signal timing * propagation delay of the broadcast calibration command * calibration.
DAQ ELECTRONICS 18 March 2015MEG Collaboration Meeting, Tokyo Stefan Ritt.
AHCAL Electronics. Status of Integration Mathias Reinecke for the DESY AHCAL developers AHCAL main and analysis meeting Hamburg, July 16th and 17th, 2009.
The 96 Chann FED Tester: Greg Iles2 September Channel FED Tester Status –Prototype now fully populated with AOHs. –Forced to borrow seven 2-channel.
Week 22: Schematic Week 23-Week 27: Routing Gerber files have been available since 9th July 1st prototype: – PCB manufacturer: supervised by KIT – Cabling:
News about the WA104 Programme C. Montanari – INFN and CERN technical working group meeting, September 16,
- LHCb calorimeter upgrade April 15th, News and ideas on DAQ architecture Frédéric Machefert LAL, Orsay.
HE FEE Boards and testing
Baby MIND Collaboration Meeting #2
HF Test station at P5 A.Mestvirishvili.
Mini-drawers, FE-ASIC , Integrator
TDCB status Jacopo Pinzino, Stefano Venditti
Front-end electronic system for large area photomultipliers readout
Testing of the EMCO Prototype Boards
Presentation transcript:

HE FEE Boards production status 26 th May 2016 Mandakini Patil 1

Production of the boards Pulser Boards (ver3.1) Fabrication : 4 completely assembled boards were ready at Peninsula, Bangalore on 21 st May BV converter PCBs :90 boards ready and delivered to TIFR on 24 th May SiPM control boards : PCB work initiated –PCBs ready by 26 th May and assembly after that, to be delivered by May end Test stand work in progress : Test boards for SiPM control boards will get ready by next week Pin diode boards PCBs: 300 PCBs at TIFR (made by Yashna circuits Mumbai) in house assembly for 5 boards will be done by Pathare QIE Adapter boards : 50 completely done, will be available by Month end 26 th may 2016 Mandakini Patil2

Test stand setup at TIFR, Mumbai Test setup for the SiPM Boards testing and the Pulser boards testing is getting ready and we are testing 3 old SiPM boards Tested an old SiPM control board and are having some issues reading ADC1 correctly but will sort it soon, tested I2C communication to ADC2,DAC1 and DAC2 and even probed the voltages on the scope and they are all ok. The Load Resistance board to test SiPM control board will be ready tomorrow 3 Pulser boards (ver3.1) tested, using the Backplane and ngCCM control emulator and clock Emulator The first step of board checking for any inherent shirts was done at Bangalore itself after assembly at all the FEASTMP_CLP dcdc voltage outputs and all OK 26 th May 2016Mandakini Patil3

Testing of the 3 Pulser Boards After plugging in the boards,the firmware for ver3.1 HE_Pulser_ASIC.pdb was updated using FlashPro11.6 tool (in the FlashPro Programmer settings Vpump-3.3V must be ticked) After the successful firmware updating,using Raspberry pi,the I2c commands were given to make the LED ON Adjusted the amplitude with the I2C data transaction and LED responded accordingly Could not shine the LED light to the pindiode, as we don’t have the QIE Adapter and QIE boards anyway. Waiting for the full fledged test of the 4 th Pulser board ver3.1 to Fnal, to give a Go Ahead for production of pulser boards 26 th May 2016Mandakini Patil4

Aluminium Boxes status 5 Al Boxes dispatched last week and arrived at CERN ( Tina Vernon acknowledged) Another set of 5 Boxes parts all ready and some hole tapping work is on For these 5 boxes, the modifications will have to be made after returning from CERN in July and later incorporated here as well for the remaining boxes too Hopefully the updated design will be available soon too for the production boxes The next batch of 5 ore more boxes will be therefore sent after July..Is it OK..? 26 th May 2016Mandakini Patil5

3 Pulser Boards ver 3.1 tested fro all dcdc outputs and LED lighting and even regulated the LED light with the I2C commands and they are functional as expected SiPM control boards calibration test board underway QIE Adapter boards, Pin diode boards, SiPM control boards, BV converter boards production are all under way Inter connecting hirose cables (2 HiRose Coaxial connector H.FL75-2LP-084H-A-500 H.FL75-2LP-084H-A both ends female) procurement being done, but delivery may be after july only Will carry with us the fully tested 10 SiPM control boards, 10 BV converter boards and 3 Pulser boards with us to CERN by June 15 th th May Conclusions and Plans Mandakini Patil

Extra Slides 28 th April 2016Mandakini Patil7

TIFR Pulse Stand using backplane 28 th April 2016Mandakini Patil8

TIFR Pulse Stand using backplane 28 th April 2016Mandakini Patil9

28 th April 2016Mandakini Patil10 TIFR Pulse Stand using backplane