3/02/2004 ab,az,ts Proto Front End Thermal Test Results 1 EFNI H K PACKAGED FRONT END COOLING TEST The Front Ends of the Outer Tracker are closely packed,

Slides:

Advertisements

Similar presentations

Investigating the Heating and Cooling Rates of Soil and Water Lab

Advertisements

Thermal Tests Analysis of transient response Elena Daskalaki Alex Vamvakas Athanasios Zelios.

Manchester 09/sept/2008A.Falou & P.Cornebise {LAL-Orsay}1 CALICE Meeting/ Manchester Sept 2008 SLAB Integration & Thermal Measurements.

A vertical-flexure CCD module Bruce C. Bigelow University of Michigan Department of Physics 10/7/04.

Michael Hoch / EP-AIT1 TPC Resistor Rod. Michael Hoch / EP-AIT2 Resistor Chain: Design Constrains  current per resistor chain: 241  A = 25W (total =

Solenoid Pressure Regulator Check Valve Hand-turn Valve Pipe Clamp L-Bracket Mounting Block Plastic Tubing AN Fitting AN T-Fitting Pressure Sensor Base.

Conduction, Convection, & Radiation

FE electronic box Construction of end piece OT module Electronic components Mechanics Cooling.

1/8/04Lance Simms Thermal Testing of TOB/TEC Hybrids at UCSB.

Measure the thermal conductivity Measure the thermal conductivity of silicon off-set with the stable state law School of Electronics & Applied Physics,

Cooling of Chips in Circuit Boards. Problem One way to cool chips mounted on circuit boards is to encapsulate the boards in metal frames that provide.

One-Dimensional Conduction Analysis of Thermal Barrier Coated Turbine Vanes Walter VanCleave.

RBX Cooling Dan Karmgard for the HCAL RBX Group. 1 Mar 01 2RBX Production Readiness Review - D. Karmgard, University of Notre Dame Outline Introduction.

CHE/ME 109 Heat Transfer in Electronics

Good questions for studying Density and Graphing.

Module mounting Ian Wilmut (RAL). Martin Gibson Martin has been developing the module mounting system at RAL for the last two years – everything we have.

LSU 06/04/2007Electronics 81 CAD Tools for Circuit Design Electronics Unit – Lecture 8 Schematic Diagram Drawing Etched Circuit Board Layout Circuit Simulation.

 Install new air cooled high efficiency screw chiller (variable speed)  Install new fan coils with ECM motors and low temperature heating coils and proper.

MICE Spectrometer Solenoid Review Some inputs for the in person meeting to be discussed at the November 13, 2009 phone meeting P.Fabbricatore on behalf.

Summary of thermal conduction gas tests for ANITA Goal: To measure the heat transport of different gases in a force-convection condition.

14 th CBM Collaboration Meeting Split 2009 Status of Front End Electronics N-XYTER PCB & Power Supply Volker Kleipa, GSI Darmstadt.

Experiment 7. Thermal Expansivity by Dilatometry and Pycnometry The dilatometer and pycnometer used in this experiment are illustrated here. The dila-

On/Off Temp Holiday Select Fan Air clean Operation Auto SwingRoom Temp Week Select SET/CLR Hour MIN Timer Program Set Fan Speed Jet Cool Cancel RESET E_Heater.

RO400FC Forced convection hot air reflow oven. In a flexible production, what do you need for soldering of  Complex PCB’s  Soldering of fine pitch on.

ATLAS Radiation Monitor integrating monitor integrating monitor Igor Mandić, Vladimir Cindro, Andrej Gorišek, Gregor Kramberger, Marko Mikuž, Marko Zavrtanik.

You’ve seen convection cell pictures in your book. You know they cause wind. You know they come from the SUN! You know they are caused by uneven heating.

Power Control System for a Concrete Durability Test Cabinet – Phase 2 Jacob Jameson Madhav Kothapalli Thomas Persinger Andrew Versluys.

Temperature, Heat, and Thermal Energy. How do particles move as they get warmer? Cooler?

Heat and Temperature 9+.

Solar energy lab Name Date Class. Questions What are solar panels made out of? What color are they and why? What makes solar power an efficient mode of.

1 Daniel Dobos University Dortmund Pixel Testbeam July 2003 Daniel Dobos University Dortmund – E4 ATLAS-/Si-Meeting Pixel Testbeam July.

The LHCb Outer Tracker Front End, what does it look like and what is the status Talk for the LHCb Electronics Working Group /TS A Collaboration.

CLIC Prototype Test Module 0 Super Accelerating Structure Thermal Simulation Introduction Theoretical background on water and air cooling FEA Model Conclusions.

Summary of thermal conduction gas tests for ANITA Goal: To measure the heat transport of different gases in a force-convection environment. John Clem,

At the HERA collider in Hamburg an experiment (ZEUS) has been built to study electron-proton collisions. For the near future an upgrade of this experiment.

Power Up of the First VELO Module at IP8 Eddy & Olaf on behalf of the VELO group.

SEPTEMBER 2002 Pixel Support Tube A. Smith LBNL 1 ATLAS Pixel Detector Heater Panel Testing Alexis Smith September 17, 2002.

FSS Review 28 th August Overview of what I’ve worked on… Stabilising voltage supply 0-200V with a Peltier Cooler Shield rubidium vapour cell from.

Front-end thermal design methods 1

SOLAR COOKER REPORT.

A ROOM AND 2 COKE CANS (A SCIENCE EXPERIMENT) Kelsie Neumann.

FE electronic box Construction of end piece OT module Electronic components Mechanics Cooling.

Cell Assembly Wafer connected to reinforcing aluminum plate Joined with metal epoxy and silicone thermal grease to ensure good thermal contact A small.

Pixel upgrade test structure: CO 2 cooling test results and simulations Nick Lumb IPN-Lyon MEC Meeting, 10/02/2010.

Cooling of GEM detector CFD _GEM 2012/03/06 E. Da RivaCFD _GEM1.

27/01/2004 az Proto Outer Tracker Front-End Tests 1 EFNI H K Test results of the Prototype Outer Tracker Front-End Box Ad Berkien Tom Sluijk Albert Zwart.

Date of download: 9/17/2016 Copyright © ASME. All rights reserved. From: A Stepped-Bar Apparatus for Thermal Resistance Measurements J. Electron. Packag.

Dr. Drizzle Convection Lab. I can investigate the process of convection. (5.P.3.1) I will recognize that thermal energy moves between liquids and gases.

Thermal Analysis of Outer Tracker Modules and Rod Susanne Kyre UCSB 2/8/20101Susanne Kyre UCSB.

Power consumption (Watts) LBB27 ROS18 TSC50 TIM8 1 SC crate416 Alignment20 TOTAL per rack906~1 kW X2J22X2J02 With a water flow of 10 l/min, it should.

Electrical Circuits j Explain the design and use of circuits to explore variation of resistance – including for lamps, diodes ntc thermistors and.

Cosmic Microwave Technology, Inc.

Status CO2 Cooling IBBelle: Reconnection after Belle II Roll in

Thermal Physics Experiments.

Purpose What does ice do to hot boiling salt water and why does it do it?

Nikhef/Bonn LepCol meeting

Tracker cooling loop “check out” draft for discussion

Conduction, Convection, & Radiation

TEMPERATURE SENSOR LOCATIONS

T-6B On-Board Oxygen Generation System (OBOGS)

Thermal Expansivity by Dilatometry and Pycnometry

A New Design for a Tunable External Cavity Diode Laser

High-temperature Properties of Schottky Diodes Made of Silicon Carbide

Thermal aspects Unité mixte de recherche CNRS-IN2P3

Tests on a dummy facet of PIX upgrade using CO2 cooling

Engineering Design Unit

THERMODYNAMIC IN ELECTRONICS

T-6B On-Board Oxygen Generation System (OBOGS)

Presentation transcript:

3/02/2004 ab,az,ts Proto Front End Thermal Test Results 1 EFNI H K PACKAGED FRONT END COOLING TEST The Front Ends of the Outer Tracker are closely packed, heat must be extracted with cooling water along the Aluminium cooling extension plate. For the test we use a cooling block with forced air Several sensors monitor heatup of components.

3/02/2004 ab,az,ts Proto Front End Thermal Test Results 2 EFNI H K Good heat transport possible

3/02/2004 ab,az,ts Proto Front End Thermal Test Results 3 EFNI H K Frame sideview

3/02/2004 ab,az,ts Proto Front End Thermal Test Results 4 EFNI H K ASDBLR COOLING CONSTRUCTION

3/02/2004 ab,az,ts Proto Front End Thermal Test Results 5 EFNI H K ASDBLR AS TEMPERATURE SENSOR ~750mV ~1.8mV/C We use a dummy input diode as temperature sensor (Not callibrated yet)

3/02/2004 ab,az,ts Proto Front End Thermal Test Results 6 EFNI H K NTC 5K on Copper Surface Close to ASDBLR Each oard has a sensor Connection point

3/02/2004 ab,az,ts Proto Front End Thermal Test Results 7 EFNI H K OTIS NTC NTC UNDER OTIS ON OPOSITE SIDE

3/02/2004 ab,az,ts Proto Front End Thermal Test Results 8 EFNI H K NTC GRAPH

3/02/2004 ab,az,ts Proto Front End Thermal Test Results 9 EFNI H K Proto Outer Tracker Front-End Tests 9 EFNI H K 35 C Otis 52 C ASDBLR NTC on copper 42C ASDBLR Input Diode 43C RESULTS AFTER SETTLING

3/02/2004 ab,az,ts Proto Front End Thermal Test Results 10 EFNI H K Hours COOLING BASE 6321 RED ASDBLR NTC ON Copper Board SURFACE 42C BASEPLATE THERMOMETER 35C t=0 >power on REMARKS: 1.forced air cooling base with regulators, shifts 10C 2.ASDBLR steps up 5C in 2 minutes, then settles to 7C above plate 3. OTIS settles 17C above cooling flap part of baseplate OTIS Copper NTC 52C BLUE ASDBLR DIODE ~43C ASDBLR 17C 8C FIRST IMPRESSION FROM PAPER RECORDERS AFTER POWER SWITCH ON

3/02/2004 ab,az,ts Proto Front End Thermal Test Results 11 EFNI H K FIRST CONCLUSIONS The ASDBLR has low temperature rise thanks to strong thermal coupling trough PCB Delta T=7 degrees C The maximum delta T is 17 degrees C for the Otis chip The regulators are mounted directly on the cooling plate, no internal sensor available, but adequate cooling is ok.