350 MJ Target Thermal Response and Ion Implantation in 1 mm thick silicon carbide armor for 10.5 m HAPL Chamber T.A. Heltemes and G.A. Moses Fusion Technology.

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Presentation transcript:

350 MJ Target Thermal Response and Ion Implantation in 1 mm thick silicon carbide armor for 10.5 m HAPL Chamber T.A. Heltemes and G.A. Moses Fusion Technology Institute High Average Power Laser Program Workshop March 21– , ORNL

2 Progress is continuing on the BUCKY chamber simulation campaign Integrated target–chamber simulation Tungsten ArmorSilicon Carbide ArmorCarbon ArmorVacuum Chamber (~8 µtorr)Low pressure buffer gas (~8 mtorr)Unirradiated SiCIrradiated SiCAmorphousExotic (Nanotube carpets, etc.)Graphite Simulations will be added as required (porous tungsten, irradiated carbon, etc.) Ultimate goal is to produce a streamlined process to perform integrated end-to- end 1-D simulations for chamber thermomechanical performance Past Present Future

3 BUCKY simulations were performed using the HAPL baseline 350 MJ target and 10.5 m chamber HAPL baseline chamber geometry was used with a near- vacuum gas condition The high-Z (Pd/Au) coated target ion and x-ray spectra were used as inputs to the BUCKY simulation Initial armor temperature was set to 727˚C (1000K) for the simulations

4 Perkins’ 350 MJ target ion spectra were used as inputs for the BUCKY simulations.

5 Perkins’ x-ray spectrum was converted to a time-dependent Gaussian pulse Perkins’ x-ray spectrum is time-integrated, which must be corrected for in the BUCKY simulation A Gaussian function was chosen to generate time-dependence based on results of BUCKY simulations of other direct-drive targets The time-integrated x-ray spectrum was multiplied by a Gaussian function with a FWHM of 170 ps

6 Simulation uses a constant thermal conductivity of 15 J/kg-˚C for irradiated SiC Simulation uses a SiC sublimation temperature of 2760˚C (from CVD SiC spec sheet produced by Rohm and Haas, NIST data were used to generate thermal conductivity and specific heat profiles for SiC

7 SiC has different thermal conductivity for the unirradiated and irradiated states S.J. Zinkle & L.L. Snead (1998)

8 BUCKY simulations were run for both unirradiated and irradiated SiC and the results were compared to the previously conducted tungsten simulation Irradiation has a negligible effect on the temperature rise due to the x-ray pulse (~2˚C difference) Ion heating in the unirradiated SiC causes a greater peak temperature rise (∆T max =1904˚C) at 10.5 m than that of tungsten (∆T max =1584˚C) Every shot fired in an irradiated SiC armored chamber ablates due to the impinging ions to a depth of 0.5 µm at 125 µs Summary of Results: –Irradiated SiC is unsuitable as an armor material without diversion or buffer gas –Unirradiated SiC does not ablate, but will exceed engineering limits of 1500– 1700˚C Sublimes X-rays Only X-rays and Ions

9 The temperature by depth into the silicon carbide armor was plotted for both unirradiated and irradiated SiC Both unirradiated and irradiated SiC show peak ion heating from the kinetic ions between 7–9 µm from the surface Largest temperature gradients are caused by the debris ions Unirradiated Irradiated

10 4 He ion implantation data were obtained for comparison with the BUCKY simulation of ion implantation in tungsten Debris ions deposit 0–2 µm into the SiC Kinetic ions deposit 4–200 µm into the SiC, with peak deposition from 4–20 µm Range of Debris Ion Deposition Range of Kinetic Ion Deposition

11 Preliminary conclusions resulting from the simulations Irradiated SiC is unsuitable for use as an armor material for the 10.5 m HAPL chamber without diversion of the ions or introduction of a buffer gas into the chamber Although unirradiated SiC does not reach its ablation temperature, the temperature rise from a target explosion does exceed the engineering limit of 1500–1700˚C If magnetic diversion of ions is used for the HAPL chamber, silicon carbide is preferable to tungsten for mitigating the temperature rise due to the x-rays impinging on the armor

12 Future BUCKY simulation improvements and modifications Revise T sub to 3008˚C, which is the sublimation temperature listed in the NIST ceramics database More high-temperature thermal conductivity and specific heat data (T > 1727˚C) for unirradiated SiC are required Broader data set for irradiated SiC properties are required Need to more accurately model the behavior of silicon carbide near the sublimation temperature

13 Questions?