INTRODUCTION

CONTENTS 1.COMPANY INTRODUCTION 1) CEO greeting 2) History 3) Organization chart 4) Capacity 5) R&D introduction 6) QA 3.PRODUCT INTRODUCTION 1) PSA (pressure sensitive adhesive) 2) DDA (Digital display adhesive, Protective film) 3) Ultra-Violet PSA 4) Binder 5) Nano & Medical PSA 2. BUSINESS CLIENTS

1.COMPANY INTRODUCTION 1) CEO greeting

1.COMPANY INTRODUCTION 2) History

1.COMPANY INTRODUCTION 3) Organization chart Overseas Department

1.COMPANY INTRODUCTION 4) Capacity Name of Company Korean 티티티케미칼 주식회사 Address278-11, Daehwa-ri, Sungnam- myeon, Cheonan-si, Chungchongnam-do, Korea EnglishTTT chemicals. Co Type of Business ManufacturingItem of Business Acrylic polymer Area of factory Land 12,954 ㎡ Date of business registration Building 4,049 ㎡ The number of persons 45Web Sitewww.tttchemicals.com Seoul Office Tel Cheonan Factory Tel Fax Fax Reactor2 Ton1Main Product Items Adhesive -Industrial Acrylic P.S.A -Display Protective Acrylic P.S.A -Ultra-Violet P.S.A -Electronic material P.S.A Binder -Near Infrared Ray Shielding (NIR) Binder -Light Diffusion Film Binder -Toner Binder -PDP Silver/Black Glass Binder 2.5 Ton1 4.5 Ton2 6 Ton7

1.COMPANY INTRODUCTION 5) R&D introduction

1.COMPANY INTRODUCTION 6) Quality Assurance Team

2. BUSINESS CLIENTS

3. PRODUCT INTRODUCTION 1) Pressure Sensitive Adhesive GradeCross linking agent Solid (%) Viscosity (cps) 25 ℃ Thick ness ( ㎛ ) substrateBall tack Peel adhesion (G.f/inch) Features GM- 707 One-part type 29±2500±50020PET 259~10SUS 1600±300 High adhesion power for PE, sticker GM- 707H One-part type 40±21800±50060PET 2512~13SUS 1100±200 label, sticker GM One-part type 40±23000±80060PET 259~10SUS 1200±200 For film. High cohesion, cutting GM One-part type 29±2550±50060PET 2511~12SUS 1200±200 For film GM One-part type 38±23000±80060PET 2513~14SUS 1600±100 For double sided tape GM One-part type 30±2550±50030PET 2514~15SUS 1000±200 For film GM- 6388R GT p 59±24500 ± PET 2510~15SUS 3200±200 High solid, High ball tack, for form tape and High adhesion power double sided tape(non woven fabric) SEN GT p 59±25000 ± PET 254~5SUS 3100±200 High solid, Low ball tack, for form tape and High adhesion power double sided tape(non woven fabric) GM- 840 GT p 39±23000±80060PET 2513~17SUS 1800±200 for double sided tape GM- 880 GT p 40±23000±80060PET 255~7SUS 2000±200 for double sided tape GM- 880M GT p 35±22500±80020PET 254~5SUS 1200±200 label, film GM- 153K GT ~7.0p 40±24500 ± PET 2513~17SUS 1500±200 For medical band and sports band GM- 220R GE p 62±25000±50060PET 2514~15SUS 1500±200 PE, non woven fabric, for a nail buffer form TT GE ±23000±80060PET 254SUS 2000±200 for double sided tape TT GE ±50060PET 255SUS 2500±200 High solid, Low ball tack, for form tape and High adhesion power double sided tape(non woven fabric) TT GE ±80060PET 2513SUS 2500±500 High solid, High ball tack, for form tape and High adhesion power double sided tape(non woven fabric)

GradeCross linking agent Solid (%) Viscosity (cps) 25 ℃ Thick ness ( ㎛ ) substrateBall tack Peel adhesion (G.f/inch) Features SEN GB p 45±22500±80060PET 2530~32SUS 2500±300 High ball tack, Aluminum tape for ship welding. Good initial adhesion. SEN GE ~1.2P 30±214000± PET 25, PI 25 4 Under SUS 1100±100 Heat resistance (200 ℃ ) SEN GE ~1.2P 30±213000± PET 254 Under SUS 1100±100 Heat resistance (200 ℃ x 1kg x 6hr) SEN GE P 30±26000± Under SUS 1500±200 Heat resistance (150 ℃ x 1kg x 30min) GM GB p 45±23300±50060PET 254 Under SUS 900±100 For Solar Film SEN GE P, AC P 40±25100±80060PET 254~5SUS 1900 ±200, PE 1300 ±100 High adhesion power for PE, High transparency SEN GE p 38±23800±80060PET 2510~13SUS 2000±100 Heat resistance(150 ℃ ), High adhesion power, for FILM or non woven fabric for double sided tape SEN GE p 38±23200±80060PET 258~9SUS 2200±100 Heat resistance (150 ℃ ), High adhesion power, High ball tack, for FILM or non woven fabric for double sided tape SEN- 2020i GT ±22500±80060PET 2510~15SUS 1900 ~2500 SEN-2020 isocyanate type product, Heat resistance (150 ℃ ), High adhesion power, for FILM or non woven fabric SEN GE p 38±24400±80060PET 254~5SUS 2500±200 Heat resistance(150 ℃ ), High adhesion power,for FILM or non woven fabric for double sided tape SEN- 2024i GT ±260PET 254 Under SUS 2200±200 SEN-2024 isocyanate type product, Heat resistance(150 ℃ ), High adhesion power, for FILM or non woven fabric SEN GE p 38±25400±80060PET 254 Under SUS 2600±200 Heat resistance(150 ℃ ), moisture resistance,High adhesion power,for FILM or non woven fabric for double sided SEN- 2026i GT p 38±260PET 254 Under SUS 1900±100 SEN-2026 isocyanate type product, Heat resistance(150 도 ), High adhesion power, for FILM or non woven fabric

GradeCross linking agent Solid (%) Viscosity (cps) 25 ℃ Thick ness ( ㎛ ) substrateBall tack Peel adhesion (G.f/inch) Features SEN GE p 38±24400±80060PET 254~5SUS 1900 ~2500 Heat resistance(150 ℃ ), moisture resistance High adhesion power,for FILM or non woven fabric for double sided tape SEN- 2028i GT p 38±24000±80060PET 255 Under SUS 2100 ~3000 SEN-2028 isocyanate type product, Heat resistance(150 ℃ ), High adhesion power, for FILM or non woven fabric TT GT p 47±22500±80060PET 254 Under SUS 3000±200, PE 1200±100 High adhesion power for PE, double sided tape and FILM, Heat resistance (150 ℃ ) TT HC GT ~0.9P 35±24500 ± PET 254 Under SUS 3200±200, PE 1200±100 High adhesion power for PE, double sided tape and FILM, Heat resistance (150 ℃ ) TT HC GT P 35±24500 ± PET 254 Under SUS 3000±200, PE 1200±100 High adhesion power for PE, double sided tape and FILM, Heat resistance (150 ℃ ) SEN GT p 47±22250±80060PET 254 Under SUS29200 ±200, PE 1200±100 High adhesion power for PE, double sided tape and FILM, Cutting SEN GT p 52±23500±80060PET 2515~20SUS 1800±200 High ball tack SEN GT p 45±24000±80060PET 2519~20SUS 1800±200 High ball tack, Heat resistance (120 ℃ ) GM-88GT p 40±25000 ±1000 Acid type,,for expanding foam tape GM-90GT p 30±23500±800Acid free type,,for expanding foam tape GM-99GT p 30±28500 ±1000 Acid free type,,for expanding foam tape

3. PRODUCT INTRODUCTION 2) Digital Display Adhesive (Removable Protective Film) GradeCross linking agent Solid (%) Viscosity (cps) 25 ℃ Thick ness ( ㎛ ) substrateBall tack Peel adhesion (G.f/inch) Features SEN GK p 39±24000±80010PET 50, PI 25 4 Under SUS 10~20 For hard type Carrier Film. High transparency, Removability, Heat resistance(180 ℃ x 40kg x 1hr) SEN GK p 39±22000±8002~3PET 38, PE 50 4 Under SUS 3~5 self-wetting, Heat resistance(120 ℃ ), low adhesion power,Removability, High transparency appropriate for optical uses SEN- 4026S GK p 39±22000±8002~3PET 38, PE 50 4 Under SUS 3~5 fastest self-wetting, Heat resistance(120 ℃ ), High transparency appropriate for optical uses SEN GK ~2.0p 40±22000±8002~3PET 38, PE 50 8SUS 5~10 self-wetting, Heat resistance(120 ℃ x 24hr),low adhesion power, Removability, High transparency appropriate for optical uses SEN GK p 40±24000±8002~3PET 38, PE 50 4 Under SUS 5~10 self-wetting,low adhesion power, Removability, High transparency appropriate for optical uses, low adhesion power SEN GK p 40±22000±8002~3PET 38, PE 50 4 Under SUS 10~20self-wetting,low adhesion power, Removability, High transparency appropriate for optical uses, low adhesion power TT One part type 40±245002~3PE 504 Under SUS 5~10 Removability, self-wetting, High transparency, Heat resistance(130 ℃ ), One-part type TT GK p 35±25500±8002~3PE 504 Under SUS 200~300 Removability, High transparency, For PE film SEN GK p 30±22900±8001~2CPP 504 Under SUS 8~12 PP FILM, Heat resistance(120 ℃ x 24hr), Removability, High transparency SEN- 3433S GK p 40±23000±80020PET 3813SUS 20~200 Removability, High transparency, Middle adhesion power

GradeCross linking agent Solid (%) Viscosity (cps) 25 ℃ Thick ness ( ㎛ ) substrateBall tack Peel adhesion (G.f/inch) Features SEN GK p 40±25600±8002~3PE 502~3SUS 50~100 Removability, High transparency, for PE film SEN GK p 35±22600±8002~3PE 502~3SUS 100~200 Removability, High transparency, for PE film SEN GK p 35±23700±8002~3PE 502~3SUS 200~300 Removability, High transparency, for PE film SEN GK p 40±22000±8002~3PE 504 Under SUS 10~20 Removability, High transparency, for PE film, Heat resistance(12 0 ℃ ) SEN GK p 35±22000±8002~3PE 504 Under SUS 3~5 Removability, High transparency, Heat resistance(120 ℃ ), For C arrier Film SEN GK ~1.0p 35±28000 ± PET 2516SUS 50~150 Removability, High transparency, Low adhesion power,solar film and 25 ㎛ PET SEN GK ~2.0p 34±23000±80020PET 257~11SUS 200~350 Removability, High transparency, Middle adhesion power,,solar f ilm and 25 ㎛ PET SEN GK ~1.0p 35±24800±80020PET 2511SUS 400~450 Removability, High transparency, Middle adhesion power,,solar f ilm and 25 ㎛ PET SEN GK ~1.0p 35±25500±80020PET 259~11SUS 350~800 Removability, High transparency, Middle adhesion power,,solar f ilm and 25 ㎛ PET SEN GK p 35±22000±80025PET 1004 Under SUS 900~1000 Removability, Middle adhesion power, High transparency appropriate for optical uses, SEN GB p 35±25000±80020PI 254Glass 2300~2600 Removability, High transparency, For PE film TT GK ~1.0p 35± PET 1004 Under SUS,Glass 2700~2900 for shatter-proof safety tape, Hi gh transparency, High adhesion power TT One part type ±8006~7, 20 PET 25, PET 100 6~7PET 25: 600~700 PET: ~1000 For NIR solar film. Acid- free type GM GB p 45±23300±50060PET 254 Under SUS 900±100 For Solar Film SEN GB p 40±25000±80010PI 254Glass 1900~2300 For solar film and shatter-proof safety tape. High adhesion power, Heat resistance SEN GK ~2.0p 35±24500±80010, 40 PET 38, PET 50 4 Under SUS 100~300, SUS 400~1000 Removability, High transparency, Heat resistance(150 ℃ x 3hr)

GradeCross linking agent Solid (%) Viscosity (cps) 25 ℃ Thick ness ( ㎛ ) substrateBall tack Peel adhesion (G.f/inch) Features SEN GK ~2.0p 30±22000± Under SUS 350~650 Removability, High transparency, Heat resistance(150 ℃ x 1hr) SEN GK p 30±36000±80020PI 254 Under SUS 160For hard type Carrier Film. High transparency, Removability, He at resistance(270 ℃ x 10min),(3 00 ℃ x5min) SEN GK p 30±33000±80020PI 254 Under SUS 108For hard type Carrier Film. High transparency, Removability, He at resistance(270 ℃ x 10min),(3 00 ℃ x5min) SEN GK p 30±32500±80020PI 254 Under SUS 80For hard type Carrier Film. High transparency, Removability, He at resistance(270 ℃ x 10min),(3 00 ℃ x5min) SEN GK p 30±32500±80020PI 254 Under SUS 58For hard type Carrier Film. High transparency, Removability, He at resistance(270 ℃ x 10min),(3 00 ℃ x5min) SEN GT p 37±22000±80030PET 2524SUS 600~770 Lens tape, made by acryl mono mer. When use a lens tape, no adhesive deposit, No haze SEN One part type 30±22000±80030PET 3817SUS 660~860 Lens tape, made by urethane m onomer. When use a lens tape, no adhesive deposit, No haze SEN- T GK ~0.8p 35±25000 ±1000 2~3PE 50SUS 350~650 Removability, High transparency, Middle adhesion power For PE film. Heat resistance SEN- T GE ~2.0p 30±25000 ±1000 2~3PE 50SUS 80~200, Prism Sheet 5~7 Removability, High transparency, For prism sheet SEN- T GK p 35±22000±80010PET 50, PI 25 4 Under SUS 10~25 Removability, High transparency,softy type for carrier film. Heat r esistance(180 ℃ ) SEN- T GB p 39±23500±80020PET 504 Under SUS 1500~1900 Removability, High transparency, High adhesion power, Heat resistance SEN- T GK p 35±21500±80020PET 504 Under SUS 1000~1550 Removability, High transparency, High adhesion power, Heat resistance SEN- T GK p 34±21500±8002~3PE 50 (Embo) 4 Under SUS 30~55, PMMA 140~220 Removability, High transparency, for PE embor film.

3. PRODUCT INTRODUCTION 3) Ultra-Violet PSA GradeCross linking agent Solid (%) Viscosity (cps) 25 ℃ Thick ness ( ㎛ ) substrateBall tack Peel adhesion (G.f/inch) Features SEN GE p, CP-4 3.0p 32±12500±80020PO 805~6Before UV irradiation SUS 300~500/ After UV irradiation SUS 10~15 For Wafer dicing. Good wetting in Wafer. After UV irradiation,no adhesive deposit on wafer. SEN- 6100M GE p, GB p 31±12000±80020PO 804 Under Before UV irradiation SUS 300~400/ After UV irradiation SUS 12~14 Modified by SEN Improved Viscosity, storage stability. SEN GE p, CP-4 3.0p 27±12000±50020PO 804 Under Before UV irradiation glass 1200~1500, After UV irradiation glass 15~20 For glass sawing and PKG. After UV irradiation,no adhesive deposit. SEN- 6350M GE p, CP-4 3.0p 24±12000±80020PET 258Before UV irradiation glass 350~450, After UV irradiation glass 5~10 For glass sawing and PKG, back grinding. Low adhesion power. UV irradiation,no adhesive deposit. SEN GE p, GB p 41±15000 ± Under Before UV irradiationgl ass 1300, After UV irradiation glass 20 For 25um PET glass reinforced plastic manufacturing process. SEN GC p, GB p 42±11200±50020PO 1504 Under Before UV irradiation glass 1500~2000, After UV irradiation glass 8~12 For LED dicing. After UV irradiation,no adhesive deposit

GradeCross linking agent Solid (%) Viscosity (cps) 25 ℃ Thick ness ( ㎛ ) substrateBall tack Peel adhesion (G.f/inch) Features SEN GC p, GE p, GP-4 2.0p 32±12000±80020PO 1504 Under Before UV i rradiation gl ass 1500~1 550, After UV irradiati on glass 10 ~15 For glass sawing and PKG. Afte r UV irradiation, No adhesive de posit PO Dicing GE p, GB p 40±120PO 1504 Under Before UV i rradiation gl ass 2000, After UV irr adiation gla ss 15~20 High adhesion power for PO film PET Dicing GE p, GB p 40±120PET 1004 Under Before UV i rradiation gl ass 1500~2 000, After UV irradiati on glass 1 5~20 High adhesion power for PET fil m DAF Dicing (50gf/ Inch) GK ~3.0p, GB p 35±12000±80020PO 804 Under Before UV i rradiation gl ass 50~60, After UV irr adiation gla ss 10 For DAF Film dicing. Good initial adhesion for 50gf/inch DAF Dicing (100gf/ Inch) GK ~3.0p, GB p 35±12000±80030PO 804 Under Before UV i rradiation gl ass 100~15 0, After UV irradiation g lass 10~15 For DAF Film dicing. Good initial adhesion for 100gf/inch PET Hard- coatin g 505~103~4PET 188good leveling. Under 2H(hardness)

3. PRODUCT INTRODUCTION 4) Binder GradeAcid Value (mg KOH) Solid (%) Viscosity (cps) 25 ℃ Molecular Weight (Mw) Features SEN ±245±12000± ±5000For LCD BLU diffusion sheet (main). LCD monitor (polydispersed bead). Stable with brightness, hz, bead SEN ±235± ± ±10000For LCD BLU diffusion sheet (back).Stable with brightness, hz, bead dispersibility, uniformity, the strength of the paint film SEN- 1250M 17±230±11500± ±15000For LCD BLU diffusion sheet (back). Improved the strength of the paint film and Heat resistance from SEN Stable with brightness, hz, bead dispersibility, uniformity SEN-13003±150±11000± ±5000For LCD BLU diffusion sheet (main). LCD monitor binder.Stable with brightness, hz, bead dispersibility, uniformity. SEN-13508±250±13500± ±7000For LCD BLU diffusion sheet (main). LCD monitor binder. Stable with brightness, hz, bead dispersibility, uniformity. SEN ±11200±500DEMANDFor PET Primer. High transparency. No yellowing. Stable with the strength of the paint film. SEN-20377±230± ± ±70000PDP rib and an upper dielectric layer green sheet burn out binder. After burn out, no ash. Good the strength of the paint film, ball tack. SEN ±16500± ±40000LCTT burn out binder. For module and chip. After burn,no ash. Good sheet lamination. Improved the strength of the paint film from SEN-2600 SEN ±14500± ±40000LCTT burn out binder. For module and chip. After burn,no ash. Good sheet lamination. Improved the strength of the paint film from SEN-2600 SEN ±317± ± ±70000Mobile battery metal powder dispersion binder. Good dispersion, sheet tack SEN ±318±113000± ±70000Metal powder dispersion binder. Improved adhesion from SEN Good dispersion, sheet tack SEN ±340±118000±2000DEMANDbake hardening products for binder. For electronic material. Stable with organic powder inorganic powder UV Curing Binder DEMAND Solvent type UV curing binder. Available to change the strength of the paint film(binder sheet) by user demand