Nouvelles Récentes

2 WWS WorldWide Study on Physics and Detectors for Future Linear Colliders  Recognize and coordinate studies on whole detector concepts, and work toward interregional detector TDRs.  Interface with GDI (Global Design Initiative), especially on MDI (Machine Detector Interface) issues.  Keep a register of R&Ds relevant to LC experimental programs, identify those that are vital or missing, and ensure peer review of R&D proposals.  Organize interregional meetings and workshops.  Report to ILCSC and ICFA on the matters above. ILC Workshop, 07 DESY

3 Collider Progress  Reference Design with cost released in Beijing in February  Two 11km SC linacs operating at 31.5 MV/m for 500 GeV  Centralized injector Circular damping rings for electrons and positrons Undulator-based positron source  Single IR with 14 mrad crossing angle  Dual tunnel configuration for safety and availability Single IR with Push-Pull Detectors  Large cost saving compared with 2 IR  ~200 M$ compared with 2 IR with crossing angles 14/14 mrad ILC Workshop, 07 DESY

4 The Concepts TrackingECalInnerRadiusSolenoidEMCalHadronCalOther SiDsilicon 1.27 m 5 Tesla Si/WDigital(RPC..) Had cal inside coil LCDTPCgaseous 1.68 m 4 Tesla Si/WDigitalorAnalog Had cal inside coil GLDTPCgaseous 2.1 m 3 Tesla W/Scin.Pb/Scin. Had cal inside coil 4thTPCgaseous 1.4 m 3.5/1.5crystal Multi- fiber readout DoubleSolenoid (open mu) ILC Workshop, 07 DESY

5 DRC and EDR  DRC : Detector Concept Report  Editors Physics: A. Djouadi, J. Lykken, K. Moenig, Y. Okada, M. Oreglia, S. Yamashita, J. Lykken Detectors: J. Jaros A. Miyamoto T. Behnke, C. Damerell  Drafts ILC Wiki id=dcrdet:dcrdet_home send comments to editors now under the 4 th part of the Reference design report:  LOI : Letter of Intent  Summer ILCSC announces call for Letters of Intent for detector designs for the two engineering designs, due Summer LOI? : SiD LDC+GLD 4th  Summer Detector design teams submit Letters of Intent (backed by design reports) proposing candidates for the two detector designs.  End of Two detector designs recognized for development to the engineering design phase.  EDR : Engineering Design Report  GDE plans an Engineering Design Report in 2010 (start 2009)  Search committee for research director ILC Workshop, 07 DESY

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7 Future Meetings ALCPG - Fermilab - October next LCWS - North America - late summer/fall 2008 ILC Workshop, 07 DESY

8 CALICE  CALICE collaboration meeting (Sept 2007) (voir Agenda pour les présentations) Julie Prast: DIF working group and DIF for DHCAL Catherine Adloff Micromegas development for the European DHCAL  Autres DHCAL:  30 x 30cm 2 3M GEM foils  9 chambers (20 x 20 cm 2 ) with 4 chips each CALICE meeting, 07 Prague

9 The European DHCAL status The European DHCAL status CIEMAT,IPNL,LAL, LAPP,LLR, PROTVINO, SACLAY CIEMAT,IPNL,LAL, LAPP,LLR, PROTVINO, SACLAY Detectors study: GRPC,µMEGAS Detectors study: GRPC,µMEGAS Electronics development : Semi-digital Electronics development : Semi-digital 4-chip board 4-chip board Beam test & prototype Beam test & prototype Funding Funding Imad LAKTINEH Imad LAKTINEH

10 GRPC : IHEP+IPNL (see Vladimir talk) 8X8 pads ok, 8X32 pads ok Activities : Efficiency vs multiplicity Gas mixture (Isobutene->CO2) important issue important issue Conceiving, building and testing Conceiving, building and testing large area GRPC large area GRPC GRPC development & characterization HV Signal Graphite Resistive plates Gas Pick-up pads

11 µMEGAS : LAPP+IPNL (see Catherine talk) 8X8 pads (mesh ) ok, 6X16 pads (bulk) ok, 8X32 pads (soon) (collaboration with Saclay and CERN)) Activities: Activities: Efficiency, X-talk, homogeneity Efficiency, X-talk, homogeneity more efforts for large µMEGAS (largest mesh size 50X50 cm2) more efforts for large µMEGAS (largest mesh size 50X50 cm2) µMEGAS development & characterization mesh signal scint. trigger

12 4-Chip board 4-Chip board Aims: Validate electronics for DHCAL Validate electronics for DHCAL Study the different detectors behavior. Study the different detectors behavior. 8X32 pads detector (GRPC and µMEGAS)8X32 pads detector (GRPC and µMEGAS) 8-layer PCB8-layer PCB 4 HARDROC4 HARDROC Readout USB + FPGAReadout USB + FPGA (see Clément talk) (see Clément talk) Acquisition : digital and analogueAcquisition : digital and analogue (collaboration with U.K groups) (collaboration with U.K groups)

13 Towards beam test at DESY To do List: Acquisition: to be completed soon (1-2 weeks) Acquisition: to be completed soon (1-2 weeks) Detectors: GRPC is ready, MICROMEGAS to be built soon using the same mesh structure to be used by T2K Setup: Almost done with the possibility to host few detectors (slice test)

14 Towards the prototype Milestones: The aim is to build a prototype as close as possible to the final one (technological prototype) The first step after the DESY beam test is to build a large area detectors (>1m2) with an extensible scheme Compare different detectors before to make a detector choice Then Build a prototype of 40 planes of 70X70 cm2 each Detectors (IHEP,IPNL,LAPP,….) Mechanical structure (CIEMAT, IPNL, LAPP,…) Readout Electronics (LAL,LLR,IPNL,LAPP,…) DAQ (collaboration with UK groups)