CALICE/EUDET developments in electronics C. de La Taille IN2P3/LAL Orsay

19 nov 2007C. de La Taille CALICE VFE Developments SOCLE Clermont 2 Overview 1st generation front-end electronics in beam : physics prototypes Validate Imaging calorimetry ECAL, AHCAL, coming up (US) DHCAL Running since nd generation VFE : EUDET R&D : technological modules Show feasibility for large dimensions Embedded electronics Ultra low power in pulsed mode On chip zero-suppress Industrializable EUDET : ECAL, AHCAL for 2009 ANR : DHCAL 3rd generation VFE All features validated Critical issues : ADC, power pulsing TCMT beam ECAL 90 cm 120 cm Complete Tower of 4 wafers = 18×18 cm 2 Long detector slab (1) Short detector slabs (14) 3×15 cells

19 nov 2007 C. de La Taille CALICE VFE Developments SOCLE Clermont 3 Common DAQSlice FE FPGA PHY VFE ASIC Dat a Clock+Config+Control VFE ASIC VFE ASIC VFE ASIC Conf/ Clock - Timing is the same for all detectors - Number of channels involves embedded electronic for all detectors -Outputting of data is done the same way for all detectors  Back-end of very-front-end shall be common for all detectors VFE Asic Detector Interface (DIF) Detector FE of VFE BE of VFE Concentrator (LDA) DIF Very high integration No external components  system on chip No active cooling  power pulsing for ultra low consumption

19 nov 2007 C. de La Taille CALICE VFE Developments SOCLE Clermont 4 Read out : token ring Acquisition A/D conv.DAQIDLE MODE Chip 0 Chip 1 Acquisition A/D conv.DAQIDLE MODEIDLE Chip 2 Acquisition A/D conv.IDLE MODEIDLE Chip 3 Acquisition A/D conv.IDLE MODEIDLE Chip 4 Acquisition A/D conv.IDLE MODEIDLEDAQ Chip 0Chip 1Chip 2Chip 3Chip 4 5 events3 events 0 event 1 event 0 event Data bus

EUDET ROC ASICs [J. Fleury et al.] HaRDROCSKIROCSPIROC

19 nov 2007 C. de La Taille CALICE VFE Developments SOCLE Clermont 6 The front-end ASICs : the ROC chips SPIROC Analog HCAL (SiPM) 36 ch. 32mm² June 07 HARDROC Digital HCAL (RPC, µmegas or GEMs) 64 ch. 16mm² Sept 06 SKIROC ECAL (Si PIN diode) 36 ch. 20mm² Nov 06

19 nov 2007 C. de La Taille CALICE VFE Developments SOCLE Clermont 7 Block scheme of a ROC chip Ch. 0 Ch. 1 Analog channel Analog mem. 36-channel Wilkinson ADC Analog channel Analog mem. Ch. 35 Analog channel Analog mem. Bunch crossing 24 bit counter Time digital mem. Event builder Memory pointer Trigger control Main Memory SRAM Com module xCAL SLAB Only in analog read-out chip (SKIROC, SPIROC)

19 nov 2007 C. de La Taille CALICE VFE Developments SOCLE Clermont 8 HaRDROC chip for DHCAL [LAL,IPNL]  Hadronic Rpc Detector Read Out Chip (Sept 06)  64 inputs, preamp + shaper+ 2 discris + memory + Full power pulsing  Compatible with 1st and 2nd generation DAQ : only 1 digital data output 64 Analog Channels Digital memory Control signals and power supplies Dual DAC Bandgap Discris JRA3 Milestone

19 nov 2007 C. de La Taille CALICE VFE Developments SOCLE Clermont 9 Scurves of the 64 channels 30 fC 10 fC Piedestal After Gain correction Dac unit

19 nov 2007 C. de La Taille CALICE VFE Developments SOCLE Clermont 10 HARDROC : first results on Power pulsing PWR ON Trigger 2 µs  PWR ON: ILC like (1ms,199ms)  All decoupling capacitors removed  PP of the analog part:  Input signal synchronised on PWR ON  Injection of 100fC, Threshold= 30fC  => Awake time= 2 µs  Power pulsing of the DAC:  25 µs (slew rate limited) DAC output (Vth) Trigger ZOOM 25 µs

19 nov 2007 C. de La Taille CALICE VFE Developments SOCLE Clermont 11 First Daisy chain measurement  First measurement of four chips on the DHCAL prototype PCB (IPNL, LLR, LAL)

19 nov 2007 C. de La Taille CALICE VFE Developments SOCLE Clermont 12 SKIROC for W-Si ECAL  Silicon Kalorimeter Integrated Read Out Chip (Nov 06)  36 channels with 16 bits Preamp + bi-gain shaper + autotrigger + analog memory + Wilkinson ADC  Digital part outside in a FPGA for lack of time and increased flexibility  Technology SiGe 0.35µm AMS. Chip received may 07, tests starting 1 MIP in SKIROC

19 nov 2007 C. de La Taille CALICE VFE Developments SOCLE Clermont 13 SPIROC overview  Silicon Photomultiplier Integrated Read Out Chip  A-HCAL read out  Silicon PM detector  G = 3 E5 to 1 E6  Same biasing scheme as TB  36 channels  Charge measurement (15bits)  Time measurement (< 1ns)  Compatible with old & new DAQ  Complex chip,, but many SKIROC, HARDROC, and MAROC features re-used  Submitted june 11 th  Expected september JRA3 Milestone

19 nov 2007 C. de La Taille CALICE VFE Developments SOCLE Clermont 14 DAQ ASIC Chip ID register 8 bits gain Trigger discri Output Wilkinson ADC Discri output gain Trigger discri Output Wilkinson ADC Discri output..… OR36 EndRamp (Discri ADC Wilkinson) 36 TM (Discri trigger) ValGain (low gain or high Gain) ExtSigmaTM (OR36) Channel 1 Channel 0 ValDimGray 12 bits … Acquisition readout Conversion ADC + Ecriture RAM RAM FlagTDC ValDimGray 12 8 ChipID Hit channel register 16 x 36 x 1 bits TDC ramp StartRampTDC BCID 16 x 8 bits ADC ramp Startrampb (wilkinson ramp) 16 ValidHoldAnalogb RazRangN 16 ReadMesureb Rstb Clk40MHz SlowClock StartAcqt StartConvDAQb StartReadOut NoTrig RamFull TransmitOn OutSerie EndReadOut Chipsat

19 nov 2007 C. de La Taille CALICE VFE Developments SOCLE Clermont 15 Conclusion The three calorimeters have a FE ASIC –HARDROC for the DHCAL –SPIROC for the AHCAL –SKIROC for the ECAL Some crucial points have been validated –Digital daisy-chain –Power Pulsing –Stand-alone capability (ne external component) The production is foreseen mid’08 –Very agressive schedule –Still in the EUDET milestones

19 nov 2007 C. de La Taille CALICE VFE Developments SOCLE Clermont 16 A 35mW 12 bits 25 MS/s pipelined analog to digital converter 1.High speed => more than 25Mhz 2.High dynamique: 2V over a 3.3V power supply 3.Full differential CMOS design 4.Low power consumption:1.4mW/MSPs 5.Fast power pulsing

19 nov 2007 C. de La Taille CALICE VFE Developments SOCLE Clermont 17 Slow versus fast digitizer for CALICE Which one will optimize better: Power / Clock noise / cross talk preamp Shaper_1 Shaper_10 Memor y preamp Shaper_1 Shaper_10 Memor y 12 bits Slow ADC preamp Shaper_1 Shaper_10 Memor y 12 bits Slow ADC preamp Shaper_1 Shaper_10 Memor y 12 bits Slow ADC preamp Shaper_1 Shaper_10 Memor y 12 bits Slow ADC preamp Shaper_1 Shaper_10 Memor y 12 bits Slow ADC preamp Shaper_1 Shaper_10 Memor y preamp Shaper_1 Shaper_10 Memor y preamp Shaper_1 Shaper_10 Memor y preamp Shaper_1 Shaper_10 Memor y 12 bits Fast ADC 12 bits Fast ADC

19 nov 2007 C. de La Taille CALICE VFE Developments SOCLE Clermont 18 Die photographe of the prototype Oct.07 Power pulsing Error Correction S&H stage A 1.5 bits stage

19 nov 2007 C. de La Taille CALICE VFE Developments SOCLE Clermont 19 Linearity results DNL good but=> will be improved by capacitors DEM The Clock noise in S&H (layout problem) leads to this high INL; it is fixed and better results expected for December

19 nov 2007 C. de La Taille CALICE VFE Developments SOCLE Clermont 20 Code-Edge Noise Input Noise Probability Density Noise-Free Transfer Curve Probable Output Transfer Curve Code Edge Locations DC input Average output code Let’s say : .8 LSB .8 LSB for SH+ADC Means.8/√2 for ADC alone

19 nov 2007 C. de La Taille CALICE VFE Developments SOCLE Clermont 21 Bias pulsing: Data output point of view =>16 to 20µs

19 nov 2007 C. de La Taille CALICE VFE Developments SOCLE Clermont 22 Spectral response to an input sinus:1Mhz, 2V pp 2V Dynamic range >80db Many harmonics=> layout problem from the switch's Vdd in the S&H  Output reconstructed signal Output codes histogram; no missing code

19 nov 2007 C. de La Taille CALICE VFE Developments SOCLE Clermont 23 Comments on results from this 12 bits ADC The DC power consumption is exactly fitting with our simulations: 35mW for S&H (simplified memory) + ADC No Obvious missing codes ; σ=0.8LSB for SH+ADC We cover a good dynamic range: 2V supply The sampling speed more than 25MS/s. but then missing codes found due to duty cycle problem in the LVS clock translator=> we fixed it. The very fast power pulsing, actual delay=>16µs, with a standby efficiency better than 1/1000. Harmonics & INL => layout point identified and fixed. A new proto sent to fab. in Oct, and should solve the INL point.

Status Report on ADC LPC Samuel MANEN, Laurent ROYER

7/7/2016 C. de La Taille CALICE VFE Developments SOCLE Calice meeting Prague Ecal VFE ADC : requirements Ultra-low POWER is the KEY issue (C. de la Taille) Requirements for ADC –Precision 10 – 12 bits –Ultra low power, 25µW per channel –Compactness, electronics embedded in detector Three main LPC –Wilkinson ADC 12 bits easy to implement in SKIROC but too slow for ILC –Pipeline ADC 10 bits tested and measured –New design : cyclic and pipelined ADC 12 bits Building blocks for 3V power supply

7/7/2016 C. de La Taille CALICE VFE Developments SOCLE Calice meeting Prague bits Wilkinson 3.5V ADC in SKIROC  Characteristics:  Techno: BiCMOS SiGe 0.35µm  Power supply: 3.5V  Conversion time :  Differential architecture  Open loop ramp generator  Gray counter  Die area: 0.12 mm 2 /channel  Power dissipation : 3 mW  => Pd = 3 mW*5*80µs/200ms = 6.2 µW/ch Wilkinson ADC architecture Designed by Gérard Bohner

7/7/2016 C. de La Taille CALICE VFE Developments SOCLE Calice meeting Prague bits Pipeline 5V ADC  Characteristics:  Technology: Austriamicrosystems CMOS 0.35µm  Power supply: 5V (digital: 2.5V)  Clock (sampling) frequency: 4 MHz (MS/s)  10 bits  10 stages  1.5bit/stage and differential architecture  Die area: 1.2 mm 2  Power dissipation : 35mW  =>PD=35mW*5*10*250ns/200ms=2.2µW/ch 150 µm 590 µm Layout of 1 stage 1500 µm 800 µm

7/7/2016 C. de La Taille CALICE VFE Developments SOCLE Calice meeting Prague Measurement setup for ADC Test Bench:  Generic board for ADC tests  Analogue signal generator: DAC 16 bits (DAC8830)  PC/LabView Slow Control through USB interface  Data processing with Scilab package Chip under test USB link Static measurements :  Input ADC signal: ramp from 0 to 2V  2048 steps measurements / step Designed by Roméo Bonnefoy

7/7/2016 C. de La Taille CALICE VFE Developments SOCLE Calice meeting Prague Performance measured for Pipeline ADC  Performance measured:  Resolution: 10 bits  Consumption: 35 mW  Conversion time: 0.25 µs 4MHz)  Noise 0.5 LSB NonLinearity (measured): Integral NL LSB Differential NL LSB

7/7/2016 C. de La Taille CALICE VFE Developments SOCLE Calice meeting Prague bits – 3V buildings blocks developments Objectives : –Design a 12 bits pipeline or cyclic ADC –Gain 2 accuracy multiply by 4 10 bits ADC accuracy is 1/ bits ADC accuracy is 1/4000 Two chips designed to characterize two main elements –Comparator –Gain 2 amplifier

7/7/2016 C. de La Taille CALICE VFE Developments SOCLE Calice meeting Prague Comparator test results for 12 bits ADC Characteristics:Characteristics: –Technology: CMOS 0.35µm –Power supply: 3V –Clock frequency: 10 MHz –Differential architecture –Consumption 68uA –7 chips tested Average Sensitivity: 1.6 mV Average Offset : 4.2 mV Fullfit 12 bits precision requirements

7/7/2016 C. de La Taille CALICE VFE Developments SOCLE Calice meeting Prague Gain 2 amplifier for 12 bits ADC Characteristics: –Technology: CMOS 0.35µm AMS –Power supply: 3V –Differential architecture –Die area 11mm2 –84 pins Calice_07_07 in july 2007 july 2007 –3V Gain 2 amplifiers with different layout structures capable to reach 12 bits –One ADC stage 12 bits 3V –Integrated shaper with analog memory

7/7/2016 C. de La Taille CALICE VFE Developments SOCLE Calice meeting Prague Summary  12 bits Wilkinson ADC  Under test  Compactness, 128 wilkinson ADC per chip, die area of (128*0.12)mm2 for 128 ch.  Consumption, 6.2µW/ch,  30% total power of one channel  10 bits pipeline ADC  Precision, INL: -0.70/+0.85 LSB, DNL: -0.46/+0.56 LSB, Noise: <0.5 LSB  Compactness, one pipeline ADC per chip, die area of 1.2mm 2 for 128 ch.  Consumption, 0.22µW/ch,  1% total power of one channel  Under study (the best candidate): 12 bits cyclic ADC  Compactness, one ADC per chip around 0.2mm 2 for 128ch  Consumption, 0.22µW/ch,  1% total power of one channel  Possibility to have 1 ADC per channel

19 nov 2007 C. de La Taille CALICE VFE Developments SOCLE Clermont 34 Detector slab Connection between 2 A.S.U. 7 A.S.U. “end” PCB Short sample Long slab is made by several short PCBs : A.S.U. : Active Sensors Unit  Design of one interconnection (glue ?)  Development easier : study, integration and tests of short PCB (with chips and wafers) before assembly  The length of each long slab will be obtained by the size of one “end PCB” (tools) Chip embedded

19 nov 2007 C. de La Taille CALICE VFE Developments SOCLE Clermont 35 Conclusion  Global design of CALICE/EUDET electronics is well going on:  2 nd generation ASICS coming up with on chip ADC, power pulsing and daisy chain DAQ  Many features to be validated : power pulsing, coherent noise, thermic  System aspects to be addressed : module design, interaction with mechanics, DAQ  Developments on ADCs coming to maturity, but still need to be validated  2 options : Wilkinson and pipeline  EUDET modules in 2009 is challenging, but very exciting !  Production of all elements mid 2008 !  Organization coming in place  EUDET2 and 3rd generation electronics to start soon…