RIKEN/CERN pixel electronics/bus R&D plans Johann M. Heuser RIKEN - Radiation Laboratory PHENIX Silicon Upgrades Meeting 10 April 2003.

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Presentation transcript:

RIKEN/CERN pixel electronics/bus R&D plans Johann M. Heuser RIKEN - Radiation Laboratory PHENIX Silicon Upgrades Meeting 10 April 2003

J.M. Heuser Brief overview of the ALICE Pixel detector bus/MCM concept pilot MCM r/o direction - ladder à 5 pixel chips half staves à 2 ladders MCMs pixel chips, 10 M pixels total, arranged in 2 barrels r/o direction

glue aluminium Kapton J.M. Heuser ALICE Pixel bus bus detector chip ladder READOUT CHIP PIXELS DETECTOR 150 to 200µm 290µm 150 to 200µm carbon fiber support cooling passive components

J.M. Heuser ALICE Pilot MCM

J.M. Heuser ALICE PHENIX chips per ladder 5 4 ladders per half stave 2 2 bus per half stave 1 2 pilot chips per half stave 1 2 (1)  Increase readout speed, from ~200 µs to ~100 (80) µs. * Develop doubled bus system: 1 separate bus for ladder 1 1 separate bus for ladder 2 * Read every ladder by one pilot chip individually, or develop a new pilot chip (preferred) that can read two busses in parallel. RIKEN R&D plans ladder #2 ladder #1 2 ALICE pilot chips or 1 PHENIX pilot chip pilot MCM bus1bus2

J.M. Heuser RIKEN plans - Effectively, collaboration effort between RIKEN and ALICE/CERN has started with beginning of JFY2003 (April 1 st ). - At CERN, three RIKEN persons are now involved in that project: Johann Heuser, Hiroyuki Kano, (Hiroaki Ohnishi) - Next to contributions to the ALICE pixel project at CERN, PHENIX related design work will be done at CERN and in Japan. It is planned to collaborate with industry in Japan on the production of the bus. - Details will evolve with time and progress made in this project.